fish fry
Subscribe Now

DVCon U.S. 2023 Preview and New Proteins Developed by AI

I’m serving up a meaty podcast for your listening pleasure this week! My guest Josh Rensch (2023 DVCon program chair) gives us a sneak peak into this year’s Design and Verification Conference and Exhibition. Josh and I also discuss the details of this year’s DVCon keynote address, who should attend this conference, and how he got involved making custom bacon. Also this week, I investigate how a team of scientists at the University of California San Francisco were able to use artificial intelligence to create original proteins from scratch.

 

 

Click here to download this episode

 

Links for February 10, 2023

More information about DVCon U.S. 2023

DVCon U.S. 2023 Announces Keynote Speaker – Program highlights include panels, poster warrior session and more!

Large language models generate functional protein sequences across diverse families (UCSF)

ProGen: Language Modeling for Protein Engineering (GitHub)

Large language models generate functional protein sequences across diverse families (nature)

 

 

Click here to check out the Fish Fry Archive.

Click here to subscribe to Fish Fry via Podbean

Click here to get the Fish Fry RSS Feed

Click here to subscribe to Fish Fry via Apple Podcasts

Click here to subscribe to Fish Fry via Spotify

 

Fish Fry Executive Interviews

Anupam Bakshi, CEO – Agnisys

Dave Kleidermacher, CTO – Green Hills Software

Robert Blake, CEO – Achronix

Jack Harding, CEO – eSilicon

Michiel Ligthart, COO – Verific

Simon Davidmann, CEO – Imperas

Jessica Gomez – Rogue Valley Microdevices

Shishpal Rawat, Chairman – Accellera Systems Initiative

Kevin Bromber, CEO – myDevices

Daniel Hansson, CEO – Verifyter

Mark Papermaster, CTO – AMD

David Fried, CTO – Coventor

Dr. Steven LeBoeuf, President – Valencell

David Dutton, CEO – Silvaco

Bob Niemiec, CEO – TwistThink

Allan Martinson, COO – Starship Technologies

Zhihong Liu, Chairman and CEO – ProPlus Solutions

Taher Madraswala, CEO and President – Open-Silicon

Kapil Shankar, CEO and Director – AnDAPT

Dan Fox, CTO – Local Motors

Kim Rowe, Founder and CEO — RoweBots

Lawrence Cooke, Founder and CEO — NovaSolix

Gregg Recupero, CTO — Performance-IP

Alan Grau, CEO — Icon Labs

Carl Alberty, Vice President – Cirrus Logic

Maximilian Odendahl, CEO — Silexica

Finbarr Moynihan, General Manager — MediaTek

Sanjay Pillay, CEO — Austemper

Louis Parks, CEO – SecureRF

Harold Blomquist, CEO – Helix Semiconductor

Dale Dougherty and Sherry Huss, Co-Founders – Maker Faire

David Su, CEO – Atomic Technologies

Mung Chiang, EVP and Dean of Engineering College – Purdue University

Clay Johnson, CEO – CacheQ

Andy Hock, Vice President, Product – Cerebras Systems

Dan Goehl, Co-founder and Chief Business Officer – UltraSense Systems

Charlie Green, Chief Operating & Technical Officer – Powercast

Leave a Reply

featured blogs
Jul 20, 2024
If you are looking for great technology-related reads, here are some offerings that I cannot recommend highly enough....

featured video

How NV5, NVIDIA, and Cadence Collaboration Optimizes Data Center Efficiency, Performance, and Reliability

Sponsored by Cadence Design Systems

Deploying data centers with AI high-density workloads and ensuring they are capable for anticipated power trends requires insight. Creating a digital twin using the Cadence Reality Digital Twin Platform helped plan the deployment of current workloads and future-proof the investment. Learn about the collaboration between NV5, NVIDIA, and Cadence to optimize data center efficiency, performance, and reliability. 

Click here for more information about Cadence Data Center Solutions

featured chalk talk

Maximizing High Power Density and Efficiency in EV-Charging Applications
Sponsored by Mouser Electronics and Infineon
In this episode of Chalk Talk, Amelia Dalton and Daniel Dalpiaz from Infineon talk about trends in the greater electrical vehicle charging landscape, typical block diagram components, and tradeoffs between discrete devices versus power modules. They also discuss choices between IGBT’s and Silicon Carbide, the advantages of advanced packaging techniques in both power discrete and power module solutions, and how reliability is increasingly important due to demands for more charging cycles per day.
Dec 18, 2023
29,184 views