Machine Learning: Esperanto coaxes 1092 RISC-V Processors to Dance on the Head of a Pin, er Chip

Dave Ditzel has a legendary history with computing and microprocessors. He joined AT&T Bell Labs to work on C language development. While there, he developed several generations of processors designed to execute optimized compiled C programs including CRISP, Bell Labs’s “C-language Reduced Instruction Set Processor.”

At Bell Labs, Ditzel also co-authored the foundational RISC document, “The Case … Read More → "Machine Learning: Esperanto coaxes 1092 RISC-V Processors to Dance on the Head of a Pin, er Chip"

The Challenges of On-Device AI Development and Yes, AI Can Predict the Rain Better than the Weatherman

Artificial Intelligence reigns supreme in this week’s Fish Fry podcast! First up, we take a closer look at DeepMind’s new foray into rainfall prediction. We investigate how DeepMind’s deep generative model of rain tool supports the advancement of precipitation nowcasting and how it compares to current methods of precipitation forecasting. Keeping with our AI theme this week, Pulin Desai (Cadence Design Systems) … Read More → "The Challenges of On-Device AI Development and Yes, AI Can Predict the Rain Better than the Weatherman"

Mega-Cool Laser-Based Sub-Jellybean-Sized Multizone Ranging Sensor

I’ve just been playing with one of the new VL53L5CX Time-of-Flight 8×8 Multizone Ranging Sensors from STMicroelectronics. On the bright side (no pun intended), this involved a laser beam bouncing all around my office. Sad to relate, however, I couldn’t see it because it was outside the range of human vision.

I tell you — every day I’ … Read More → "Mega-Cool Laser-Based Sub-Jellybean-Sized Multizone Ranging Sensor"

Intel’s Stuart Pann Explains the Company’s use of Outside Foundries

Stuart Pann, Senior Vice President of Intel’s Corporate Planning Group, published an interesting “opinion” piece titled “Expanding Intel’s Foundry Partnerships: A Critical Piece of IDM 2.0” in August. “IDM 2.0” is the term Intel uses to describe its use of process technologies from other foundries in addition to Intel’s home-grown process technologies. The term “IDM” means “integrated device manufacturer” and refers to a chipmaker that manufactures its own silicon die. … Read More → "Intel’s Stuart Pann Explains the Company’s use of Outside Foundries"

Samsung’s 50-Mpixel GN2 Image Sensor Sports Pro Camera Features

In August, at the Hot Chips 33 conference, held online this year thanks to COVID-19, Sooki Yoon described the Samsung 50-Mpixel GN2 image sensor, which the company announced earlier this year. This sensor is destined to be used in mobile phones such as the Xiaomi Mi 11 Ultra/Pro, according … Read More → "Samsung’s 50-Mpixel GN2 Image Sensor Sports Pro Camera Features"

October 19, 2021
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featured chalk talk

Minitek Microspace

Sponsored by Mouser Electronics and Amphenol ICC

With the incredible pace of automotive innovation these days, it’s important to choose the right connectors for the job. With everything from high-speed data to lighting, connectors have a huge impact on reliability, cost, and design. In this episode of Chalk Talk, Amelia Dalton chats with Glenn Heath from Amphenol ICC about the Minitek MicroSpace line of automotive- and industrial-grade connectors.

Click here for more information about Amphenol FCI Minitek MicroSpace™ Connector System

featured paper

Is your application protected from glitches?

Sponsored by Maxim Integrated (now part of Analog Devices)

Medical, industrial, and consumer devices require reliable operation, free from startup glitches. With the glitch-free operation available in the MAX16162, Maxim’s nanoPower supervisor IC, designers now have the means to prevent system startup glitches.

Click to read more

featured video

What are V³Link SerDes?

Sponsored by Texas Instruments

V³Link ICs are ultra-low latency SerDes that aggregate video, clock, control and GPIO data into a single-wire bidirectional bridge between industry-standard interfaces. Vision-based designs can use V³Link devices to achieve higher resolution, extend cable reach up to 15 meters and reduce system size, weight and power. Learn about the basics of V³Link technology and explore typical applications for V³Link in this training video.

Click here for more information

Posted on Oct 19 at 10:11am by Steven Leibson
You're right, kgon1. I am using 200mm fabs as proxies for old lithographies. Upgrading fabs to 300mm means the old tooling for chips made with 200mm equipment needs to be redone. I think many fab vendors drop those lithographies at that point. When they eol a process node, that's the ...
Posted on Oct 19 at 7:43am by Steven Leibson
It costs money to maintain a fab just as it costs money to build one. If clean room floor space can be repurposed for more profit by changing out machines to go with finer pitch lithographies, it usually makes economic sense to do so. That upgrade comes at the expense ...
Posted on Oct 17 at 9:14pm by kgon1
To drive the cost of chips down, one needs scale. 300 mm gives one scale not 200 mm. All the200 mm FABs I've been in are now 300 mm. The last one we brought up as 300mm in 2006 , TI bought it to do 90 nm and 45nm , it 's TI 3rd 300mm FAB. The 15 ...
Posted on Oct 17 at 6:27pm by
True but I left Honeywell Sensing and Control in 2002 and the best designs are still being made. The real problem was a push by management in these companies not to hold any inventory i.e. JIT. It is clear that smart inventory levels ( roughly six months on book would have ...
Posted on Oct 14 at 4:23am by kdoherty99
A nice article covering the latest shortage. There is one aspect of this shortage I have not seen covered in the various articles I've seen so far. The gaining trend to push older IC's into premature obsolescense by the FABs and chip suppliers. This trend is picking up and seems ...
Posted on Oct 12 at 10:56am by gene plichota
there are those of us who object in principle to the way info is organized and presented by the design of our infosphere....much like principled vax-refusers, we stand on our right to not chow down on what's put before us and don't engage farther than is necessary what's wrong ...
Posted on Oct 6 at 4:08pm by Scott V.
There is absolutely no reason to fabricate most semiconductors on a fine pitch process where a mask set to make the chip can literally cost millions of dollars. Most Diodes, Discrete Transitors, Mofets and other power semiconductors can and are fabricated on much older processes that have been around for ...
Posted on Oct 4 at 2:02pm by MartinCroome
We ran out of toilet paper thanks to panic buying! What makes people think that semiconductors are somehow different? Hit it in a nut shell. Stupid purchasing managers in cars manufacturers -> Smart purchasing managers in consumer goods manufacturers -> Panic
Posted on Oct 1 at 6:54am by John
Ha, I too was born in 1957 and my career councillor gave the same advice and, like you, I hated all that theory; I wanted to make things. I hope CCs today look deeper into matching the candidate with the course.
Posted on Sep 29 at 8:00am by Karl Stevens
Here is a pdf that led to Project Catapult that put FPGAs in the Microsoft Data Centers. It does not seem to fit the reasoning in this article. Because the performance gain justifies the cost and adds programmability to the FPGA in spite of all the stated reasons to not ...
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featured blogs
Oct 19, 2021
Learn about key roadblocks to improve ADAS systems & higher levels of autonomous driving, such as SoC performance, from our 2021 ARC Processor Virtual Summit. The post Top 5 Challenges to Achieve High-Level Automated Driving appeared first on From Silicon To Software....
Oct 19, 2021
Today, at CadenceLIVE Europe, we announced the Cadence Safety Solution, a new offering targeting safety-critical applications and featuring integrated analog and digital safety flows and engines for... [[ Click on the title to access the full blog on the Cadence Community si...
Oct 13, 2021
How many times do you search the internet each day to track down for a nugget of knowhow or tidbit of trivia? Can you imagine a future without access to knowledge?...
Oct 4, 2021
The latest version of Intel® Quartus® Prime software version 21.3 has been released. It introduces many new intuitive features and improvements that make it easier to design with Intel® FPGAs, including the new Intel® Agilex'„¢ FPGAs. These new features and improvements...
Machine-Learning Optimized Chip Design -- Cadence Design Systems
New applications and technology are driving demand for even more compute and functionality in the devices we use every day. System on chip (SoC) designs are quickly migrating to new process nodes, and rapidly growing in size and complexity. In this episode of Chalk Talk, Amelia Dalton chats with Rod Metcalfe about how machine learning combined with distributed computing offers new capabilities to automate and scale RTL to GDS chip implementation flows, enabling design teams to support more, and increasingly complex, SoC projects.
Oct 14, 2021
NEUTRIK Fiber Optic Solutions
Sponsored by Mouser Electronics and Neutrik
The advantages and benefits of fiber optics are a mile long…but how can you design with them? How can you clean them? How do you repair them? Need a bit of a refresher? In this episode of Chalk Talk, Amelia Dalton chats with David Kuklinski from Neutrik about the OpticalCon advanced, OpticalCon LITE and Opticalcon DragonFly fiber optic solutions from Neutrik. They take a closer look at what benefits each of these solutions brings to the table, what kind of configurations are offered with each of these fiber optic solutions and what kind of performance you can expect when using them in your next design.
Aug 19, 2021
Seamless Ethernet to the Edge with 10BASE-T1L Technology
In order to keep up with the breakneck speed of today’s innovation in Industry 4.0, we need an efficient way to connect a wide variety of edge nodes to the cloud without breaks in our communication networks, and with shorter latency, lower power, and longer reach. In this episode of Chalk Talk, Amelia Dalton chats with Fiona Treacy from Analog Devices about the benefits of seamless ethernet and how seamless ethernet’s twisted single pair design, long reach and power and data over one cable can solve your industrial connectivity woes.
Aug 17, 2021
Flexible Power for a Smart World
Sponsored by Mouser Electronics and CUI Inc.
Safety, EMC compliance, your project schedule, and your BOM cost are all important factors when you are considering what power supply you will need for your next design. You also need to think about form factor, which capacitor will work best, and more. But if you’re not a power supply expert, this can get overwhelming in a hurry. In this episode of Chalk Talk, Amelia Dalton chats with Ron Stull from CUI Inc. about CUI PBO Single Output Board Mount AC-DC Power Supplies, what this ??ac/dc core brings to the table in terms of form factor, reliability and performance, and why this kind of solution may give you the flexibility you need to optimize your next design.
Aug 3, 2021
i.MX RT1170
Dual Core microcontrollers can bring a lot of benefits to today’s modern embedded designs in order to keep all of our design requirements in balance. In this episode of Chalk Talk, Amelia Dalton chats with Patrick Kennedy from NXP about why newer design requirements for today’s connected embedded systems are making this balancing act even harder than ever before and how the i.MX RT1170 can help solve these problems with its heterogeneous dual cores, MIPI interface, multi-core low power strategy and SRAM PUF technology can make all the difference in your next embedded design.
Aug 3, 2021
Software and Automotive Safety
In the realm of automotive designs, safety must reign above all else. But the question remains: How can we innovate within the constraints of today’s safety standards? In this episode of Chalk Talk, Amelia Dalton chats with Rob Bates from Siemens about the role ISO 26262 plays when it comes to COTS and open source software, what certified software components are all about, and how heterogeneous multiprocessing can be helpful in your next automotive design.
Jul 28, 2021