Long, long ago, at the turn of the millennium, two champions of configurable processor IP – ARC and Tensilica – battled for dominance in that arena with unique processor ISAs and custom tools to aid in creating software-development tool chains for their configurable processors. Synopsys bought ARC in 2011, and Cadence bought Tensilica a couple of years later. Fast forward a decade and suddenly, RISC-V has somehow validated the concept … Read More → "Synopsys Takes on RISC-V Configurability with ARC-V Processor IP Family"
It’s not often you get to say things like “exponential increase in insatiable demand,” so I’m going to make the most of it by taking a deep breath, pausing for effect, and waiting for the audience’s antici…
…pation to mount. As I’ve mentioned in previous columns (although possibly using different words), we are currently seeing an … Read More → "9.6Gbps HBM3 Memory Controller IP Boosts SoC AI Performance"
As I’ve mentioned on occasion, I predate many of the technologies that now surround us. I remember the heady days of the first 8-bit microprocessor units (MPUs) and early single board computers (SBCs) that were based on these little rascals. Glancing at the bookshelves in my office, I see my trusty companions of yesteryear in the form of 6502, Z80, etc. data books.
… Read More → "New MCUs Provide 10^2 the Performance at 10^-2 the Power"
Arrow has just launched a development board for Intel’s soon-to-be-produced Agilex 5 SoC FPGAs, and two more such boards wait in the wings. The Arrow AXE5-Eagle board sports one Intel Agilex 5 E-series SoC FPGA. Initially, these development boards will incorporate an engineering sample of the SoC FPGA with 656K logic elements (LEs), while production boards, available by the end of the first half of 2024, will incorporate … Read More → "Arrow reveals first Dev Board for Intel Agilex 5 FPGAs, with two more boards planned"
This week’s podcast is all about high speed communication, optical interfaces for military and aerospace designs and 3D printing in space! My guest Patrick Mechin (Techway) and I discuss the trends in high speed communications, the benefits of optical interfaces for modern embedded systems, and how Techway is supporting innovation in this arena. Also this week, I check out how 3D-printed titanium dioxide foam could help us in … Read More → "High Speed Communications, Optical Interfaces and the Future of Embedded Systems"
