fish fry
Subscribe Now

Long Live the (8 Bit) King

Tricky Bits IP, Evolution of the 8 Bit Micro, and the Raspberry Pi of Autonomous Cars

There are whispers that their time has come to fade away into the sunset. Time to drift away on the electronic wind with laser discs, Zune players, and VHS. But can the role of 8 bit MCUs in the electronic engineering ecosystem be dismissed so easily? Maybe not. In this week’s episode of Fish Fry, Nikos Zervas (CEO of CAST) joins us to discuss the changing role of 8 bit MCUs in the EE ecosystem, how CAST works with their partners to bring innovative IP cores to the market, and how their new GZIP data compression IP can reduce power consumption for a variety of designs. Also this week, we check out a new open source, autonomous car platform from StreetDrone and reveal how you can bring the convenience and ease of Arduino into the professional realm.

 

Download this episode (right click and save)

Links for July 13, 2018

More information about CAST IP

More information about StreetDrone

Youtube Video: Wayve Renault Twizy in Action

 

Click here to check out the Fish Fry Archive.

Click here to subscribe to Fish Fry via Podbean

Click here to get the Fish Fry RSS Feed

Click here to subscribe to Fish Fry via iTunes.

Fish Fry Executive Interviews

Darrin Billerbeck, CEO – Lattice Semiconductor

Anupam Bakshi, CEO – Agnisys

Dave Kleidermacher, CTO – Green Hills Software

Robert Blake, CEO – Achronix

Jack Harding, CEO – eSilicon

Michiel Ligthart, COO – Verific

Adnan Hamid, CEO – Breker Technologies

Jeff Waters, VP and General Manager – Altera

Simon Davidmann, CEO – Imperas

Ted Miracco, CEO – SmartFlow Compliance Solutions

Jessica Gomez – Rogue Valley Microdevices

Shishpal Rawat, Chairman – Accellera Systems Initiative

Kevin Bromber, CEO – myDevices

Daniel Hansson, CEO – Verifyter

Mark Papermaster, CTO – AMD

David Fried, CTO – Coventor

Dr. Steven LeBoeuf, President – Valencell

David Dutton, CEO – Silvaco

Bob Niemiec, CEO – TwistThink

Allan Martinson, COO – Starship Technologies

Zhihong Liu, Chairman and CEO – ProPlus Solutions

Taher Madraswala, CEO and President – Open-Silicon>

Kapil Shankar, CEO and Director – AnDAPT

Dan Fox, CTO – Local Motors

Leave a Reply

featured blogs
Sep 21, 2023
Wireless communication in workplace wearables protects and boosts the occupational safety and productivity of industrial workers and front-line teams....
Sep 26, 2023
5G coverage from space has the potential to make connectivity to the Internet truly ubiquitous for a broad range of use cases....
Sep 26, 2023
Explore the LPDDR5X specification and learn how to leverage speed and efficiency improvements over LPDDR5 for ADAS, smartphones, AI accelerators, and beyond.The post How LPDDR5X Delivers the Speed Your Designs Need appeared first on Chip Design....
Sep 26, 2023
The eighth edition of the Women in CFD series features Mary Alarcon Herrera , a product engineer for the Cadence Computational Fluid Dynamics (CFD) team. Mary's unwavering passion and dedication toward a career in CFD has been instrumental in her success and has led her ...
Sep 21, 2023
Not knowing all the stuff I don't know didn't come easy. I've had to read a lot of books to get where I am....

Featured Video

Chiplet Architecture Accelerates Delivery of Industry-Leading Intel® FPGA Features and Capabilities

Sponsored by Intel

With each generation, packing millions of transistors onto shrinking dies gets more challenging. But we are continuing to change the game with advanced, targeted FPGAs for your needs. In this video, you’ll discover how Intel®’s chiplet-based approach to FPGAs delivers the latest capabilities faster than ever. Find out how we deliver on the promise of Moore’s law and push the boundaries with future innovations such as pathfinding options for chip-to-chip optical communication, exploring new ways to deliver better AI, and adopting UCIe standards in our next-generation FPGAs.

To learn more about chiplet architecture in Intel FPGA devices visit https://intel.ly/45B65Ij

featured paper

Accelerating Monte Carlo Simulations for Faster Statistical Variation Analysis, Debugging, and Signoff of Circuit Functionality

Sponsored by Cadence Design Systems

Predicting the probability of failed ICs has become difficult with aggressive process scaling and large-volume manufacturing. Learn how key EDA simulator technologies and methodologies enable fast (minimum number of simulations) and accurate high-sigma analysis.

Click to read more

featured chalk talk

Package Evolution for MOSFETs and Diodes
Sponsored by Mouser Electronics and Vishay
A limiting factor for both MOSFETs and diodes is power dissipation per unit area and your choice of packaging can make a big difference in power dissipation. In this episode of Chalk Talk, Amelia Dalton and Brian Zachrel from Vishay investigate how package evolution has led to new advancements in diodes and MOSFETs including minimizing package resistance, increasing power density, and more! They also explore the benefits of using Vishay’s small and efficient PowerPAK® and eSMP® packages and the migration path you will need to keep in mind when using these solutions in your next design.
Jul 10, 2023
9,471 views