fish fry
Subscribe Now

The Amalgamation Situation

AMD and the Era of Data Convergence

Keep innovation in your back pocket and the end game in your sights at all times. This race is ride or die. The data center waits for no one. Mark Papermaster (CTO – AMD) joins Fish Fry this week to discuss the complex chip competition in the data center market, why open ecosystems are the lynchpin of data center evolution, and why he believes that your product is only as good as your team.  Also this week, we take a closer look at how you can maximize your performance-per-watt with Zynq UltraScale+ MPSoCs.


 

Download this episode (right click and save)

Links for June 17, 2016

More information about AMD

New Episode of Chalk Talk: Running Out of Processing Power? No Problem.

Fish Fry Executive Interviews

Moshe Gavrielov, CEO – Xilinx

Darrin Billerbeck, CEO – Lattice Semiconductor

Bill Neifert, CTO – Carbon Design Systems

Sean Dart, CEO – Forte Design Systems

Andy Pease, CEO – QuickLogic

Paul Kocher, President – Cryptography Research Inc.

Anupam Bakshi, CEO – Agnisys

Dave Kleidermacher, CTO – Green Hills Software

Robert Blake, CEO – Achronix

Jack Harding, CEO – eSilicon

Michiel Ligthart, COO – Verific

Adnan Hamid, CEO – Breker Technologies

Jeff Waters, VP and General Manager – Altera

Simon Davidmann, CEO – Imperas

Ted Miracco, CEO – SmartFlow Compliance Solutions

Cees Links – GreenPeak Technologies

Jessica Gomez – Rogue Valley Microdevices

Shishpal Rawat, Chairman – Accellera Systems Initiative

Kevin Bromber, CEO – myDevices

Daniel Hansson, CEO – Verifyter

One thought on “The Amalgamation Situation”

Leave a Reply

featured blogs
Jul 1, 2022
We all look for 100% perfection and want to turn our dreams (expectations) into reality as far as we can. Are you also looking for a magic wand to turn expectation into reality? The story applies to... ...
Jun 30, 2022
Learn how AI-powered cameras and neural network image processing enable everything from smartphone portraits to machine vision and automotive safety features. The post How AI Helps Cameras See More Clearly appeared first on From Silicon To Software....
Jun 28, 2022
Watching this video caused me to wander off into the weeds looking at a weird and wonderful collection of wheeled implementations....

featured video

Multi-Vendor Extra Long Reach 112G SerDes Interoperability Between Synopsys and AMD

Sponsored by Synopsys

This OFC 2022 demo features Synopsys 112G Ethernet IP interoperating with AMD's 112G FPGA and 2.5m DAC, showcasing best TX and RX performance with auto negotiation and link training.

Learn More

featured paper

Addressing high-voltage design challenges with reliable and affordable isolation tech

Sponsored by Texas Instruments

Check out TI’s new white paper for an overview of galvanic isolation techniques, as well as how to improve isolated designs in electric vehicles, grid infrastructure, factory automation and motor drives.

Click to read more

featured chalk talk

Faster, More Predictable Path to Multi-Chiplet Design Closure

Sponsored by Cadence Design Systems

The challenges for 3D IC design are greater than standard chip design - but they are not insurmountable. In this episode of Chalk Talk, Amelia Dalton chats with Vinay Patwardhan from Cadence Design Systems about the variety of challenges faced by 3D IC designers today and how Cadence’s integrated, high-capacity Integrity 3D IC Platform, with its 3D design planning and implementation cockpit, flow manager and co-design capabilities will not only help you with your next 3D IC design.

Click here for more information about Integrity 3D-IC Platform from Cadence Design Systems