fish fry
Subscribe Now

The Amalgamation Situation

AMD and the Era of Data Convergence

Keep innovation in your back pocket and the end game in your sights at all times. This race is ride or die. The data center waits for no one. Mark Papermaster (CTO – AMD) joins Fish Fry this week to discuss the complex chip competition in the data center market, why open ecosystems are the lynchpin of data center evolution, and why he believes that your product is only as good as your team.  Also this week, we take a closer look at how you can maximize your performance-per-watt with Zynq UltraScale+ MPSoCs.


 

Download this episode (right click and save)

Links for June 17, 2016

More information about AMD

New Episode of Chalk Talk: Running Out of Processing Power? No Problem.

Fish Fry Executive Interviews

Moshe Gavrielov, CEO – Xilinx

Darrin Billerbeck, CEO – Lattice Semiconductor

Bill Neifert, CTO – Carbon Design Systems

Sean Dart, CEO – Forte Design Systems

Andy Pease, CEO – QuickLogic

Paul Kocher, President – Cryptography Research Inc.

Anupam Bakshi, CEO – Agnisys

Dave Kleidermacher, CTO – Green Hills Software

Robert Blake, CEO – Achronix

Jack Harding, CEO – eSilicon

Michiel Ligthart, COO – Verific

Adnan Hamid, CEO – Breker Technologies

Jeff Waters, VP and General Manager – Altera

Simon Davidmann, CEO – Imperas

Ted Miracco, CEO – SmartFlow Compliance Solutions

Cees Links – GreenPeak Technologies

Jessica Gomez – Rogue Valley Microdevices

Shishpal Rawat, Chairman – Accellera Systems Initiative

Kevin Bromber, CEO – myDevices

Daniel Hansson, CEO – Verifyter

One thought on “The Amalgamation Situation”

Leave a Reply

featured blogs
Nov 23, 2022
The current challenge in custom/mixed-signal design is to have a fast and silicon-accurate methodology. In this blog series, we are exploring the Custom IC Design Flow and Methodology stages. This methodology directly addresses the primary challenge of predictability in creat...
Nov 22, 2022
Learn how analog and mixed-signal (AMS) verification technology, which we developed as part of DARPA's POSH and ERI programs, emulates analog designs. The post What's Driving the World's First Analog and Mixed-Signal Emulation Technology? appeared first on From Silicon To So...
Nov 21, 2022
By Hossam Sarhan With the growing complexity of system-on-chip designs and technology scaling, multiple power domains are needed to optimize… ...
Nov 18, 2022
This bodacious beauty is better equipped than my car, with 360-degree collision avoidance sensors, party lights, and a backup camera, to name but a few....

featured video

How to Harness the Massive Amounts of Design Data Generated with Every Project

Sponsored by Cadence Design Systems

Long gone are the days where engineers imported text-based reports into spreadsheets and sorted the columns to extract useful information. Introducing the Cadence Joint Enterprise Data and AI (JedAI) platform created from the ground up for EDA data such as waveforms, workflows, RTL netlists, and more. Using Cadence JedAI, engineering teams can visualize the data and trends and implement practical design strategies across the entire SoC design for improved productivity and quality of results.

Learn More

featured paper

Algorithm Verification with FPGAs and ASICs

Sponsored by MathWorks

Developing new FPGA and ASIC designs involves implementing new algorithms, which presents challenges for verification for algorithm developers, hardware designers, and verification engineers. This eBook explores different aspects of hardware design verification and how you can use MATLAB and Simulink to reduce development effort and improve the quality of end products.

Click here to read more

featured chalk talk

Medical Grade Temperature Sensing with the World's Smallest Surface Mount FIR Temperature IC

Sponsored by Mouser Electronics and Melexis

Temperature sensing has come a very long way in recent years. In this episode of Chalk Talk, Amelia Dalton chats with Doug Gates from Melexis about the latest innovation in medical grade temperature sensing. They take a closer look at the different kinds of applications that can use this kind of sensing technology, the role that emissivity and field view play in temperature sensing, and what sets the Melexis’ MLX90632 apart from other temperature sending solutions on the market today. 

Click here for more information about Melexis MLX90632 Infrared Temperature Sensors