EEJournal

fish fry
Subscribe Now
January 12, 2018

If I Only Had a Brain-1

Peripherals, Modules, and Crowdfunding
by Amelia Dalton

“I shall ask for brains instead of a heart; for a fool would not know what to do with a heart if he had one.” — Scarecrow, The Wizard of Oz

In this week’s episode of Fish Fry, we set our sights on open source hardware design. Jake Janovetz (President – Opal Kelly) introduces us to a brand new crowdfunding campaign called the Brain-1. Jake and I discuss the the details of Brain-1, why they chose crowdfunding to launch this project, and what their new SYZYGY interconnect standard is all about. We also take a closer look at world’s smallest wearable sensor called UVSense rolled out this week at the Consumer Electronics Show. We check out how this sensor technology (which is a collaboration between cosmetics company L’Oreal and Northwestern University) could how we measure harmful UV ray exposure.

Download this episode (right click and save)

Links for January 12, 2018

More information about Opal Kelly

More information about the Brain-1 Crowdfunding Campaign

Feature Article by Kevin Morris: A New Standard for FPGA Peripherals —
Opal Kelly Announces SYZYGY

Researchers develop world’s smallest wearable device

Click here to participate in the The Barr Group 2018 Survey

 

Click here to check out the Fish Fry Archive.

Click here to subscribe to Fish Fry via Podbean

Click here to get the Fish Fry RSS Feed

Click here to subscribe to Fish Fry via iTunes.

————————————
Fish Fry Executive Interviews

Moshe Gavrielov, CEO – Xilinx

Darrin Billerbeck, CEO – Lattice Semiconductor

Paul Kocher, President – Cryptography Research Inc.

Anupam Bakshi, CEO – Agnisys

Dave Kleidermacher, CTO – Green Hills Software

Robert Blake, CEO – Achronix

Jack Harding, CEO – eSilicon

Michiel Ligthart, COO – Verific

Adnan Hamid, CEO – Breker Technologies

Jeff Waters, VP and General Manager – Altera

Simon Davidmann, CEO – Imperas

Ted Miracco, CEO – SmartFlow Compliance Solutions

Jessica Gomez – Rogue Valley Microdevices

Shishpal Rawat, Chairman – Accellera Systems Initiative

Kevin Bromber, CEO – myDevices

Daniel Hansson, CEO – Verifyter

Mark Papermaster, CTO – AMD

David Fried, CTO – Coventor

Dr. Steven LeBoeuf, President – Valencell

David Dutton, CEO – Silvaco

Bob Niemiec, CEO – TwistThink

Allan Martinson, COO – Starship Technologies

Zhihong Liu, Chairman and CEO – ProPlus Solutions

Taher Madraswala, CEO and President – Open-Silicon>

Kapil Shankar, CEO and Director – AnDAPT

Dan Fox, CTO – Local Motors

Kim Rowe, Founder and CEO — RoweBots

Lawrence Cooke, Founder and CEO — NovaSolix

Gregg Recupero, CTO — Performance-IP

Alan Grau, CEO — Icon Labs

Carl Alberty, Vice President – Cirrus Logic

Maximilian Odendahl, CEO — Silexica

Finbarr Moynihan, General Manager — MediaTek

Sanjay Pillay, CEO — Austemper

Louis Parks, CEO – SecureRF

Harold Blomquist, CEO – Helix Semiconductor

Dale Dougherty and Sherry Huss, Co-Founders – Maker Faire

Mike Wisart, CEO – efabless

Chris Giovanniello, SVP and Co-Founder – Menlo Micro

featured blogs
Celebrating World Intellectual Property Day
Apr 26, 2024
LEGO ® is the world's most famous toy brand. The experience of playing with these toys has endured over the years because of the innumerable possibilities they allow us: from simple textbook models to wherever our imagination might take us. We have always been driven by ...
More from Cadence...
Wow! Biomimetic LEDs!
Apr 26, 2024
Biological-inspired developments result in LEDs that are 55% brighter, but 55% brighter than what?...
More from Max's Cool Beans...
Want to Mix and Match Dies in a Single Package? UCIe Can Get You There
Apr 25, 2024
See how the UCIe protocol creates multi-die chips by connecting chiplets from different vendors and nodes, and learn about the role of IP and specifications.The post Want to Mix and Match Dies in a Single Package? UCIe Can Get You There appeared first on Chip Design....
More from Synopsys...

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

USB Power Delivery: Power for Portable (and Other) Products
Sponsored by Mouser Electronics and Bel
USB Type C power delivery was created to standardize medium and higher levels of power delivery but it also can support negotiations for multiple output voltage levels and is backward compatible with previous versions of USB. In this episode of Chalk Talk, Amelia Dalton and Bruce Rose from Bel/CUI Inc. explore the benefits of USB Type C power delivery, the specific communications protocol of USB Type C power delivery, and examine why USB Type C power supplies and connectors are the way of the future for consumer electronics.
Click here for more information about CUI Inc SDI30C-UT 30W 3-Prong AC-DC Desktop Adapters
Oct 2, 2023
26,236 views