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All Along the RTOS

Wearable Software that Makes IoT Tick
In this week’s fish fry, we get down into the nitty gritty details of real time operating systems for wearable devices. Kim Rowe (founder and CEO of RoweBots) joins Fish Fry to discuss the future of machine-to-machine communication, the evolution of sensor technology, and the biggest challenges we face when tackling an RTOS for M2M designs.

featured blogs
Nov 27, 2023
Qualcomm Technologies' SVP, Durga Malladi, talks about the current benefits, challenges, use cases and regulations surrounding artificial intelligence and how AI will evolve in the near future....
Nov 27, 2023
Employees of our Cadence Cork team recently volunteered to be part of an exciting journey with our learners from Age Action. Age Action is Ireland's leading advocacy organization for older people and aging. The organization provides practical programs to support older pe...
Nov 27, 2023
See how we're harnessing generative AI throughout our suite of EDA tools with Synopsys.AI Copilot, the world's first GenAI capability for chip design.The post Meet Synopsys.ai Copilot, Industry's First GenAI Capability for Chip Design appeared first on Chip Design....
Nov 6, 2023
Suffice it to say that everyone and everything in these images was shot in-camera underwater, and that the results truly are haunting....

featured video

TDK CLT32 power inductors for ADAS and AD power management

Sponsored by TDK

Review the top 3 FAQs (Frequently Asked Questions) regarding TDK’s CLT32 power inductors. Learn why these tiny power inductors address the most demanding reliability challenges of ADAS and AD power management.

Click here for more information

featured paper

3D-IC Design Challenges and Requirements

Sponsored by Cadence Design Systems

While there is great interest in 3D-IC technology, it is still in its early phases. Standard definitions are lacking, the supply chain ecosystem is in flux, and design, analysis, verification, and test challenges need to be resolved. Read this paper to learn about design challenges, ecosystem requirements, and needed solutions. While various types of multi-die packages have been available for many years, this paper focuses on 3D integration and packaging of multiple stacked dies.

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featured chalk talk

Stepper Motor Basics & Toshiba Motor Control Solutions
Sponsored by Mouser Electronics and Toshiba
Stepper motors offer a variety of benefits that can add value to many different kinds of electronic designs. In this episode of Chalk Talk, Amelia Dalton and Doug Day from Toshiba examine the different types of stepper motors, the solutions to drive these motors, and how the active gain control and ADMD of Toshiba’s motor control solutions can make all the difference in your next design.
Sep 29, 2023
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