I sometimes joke that I’d bend over backwards to be flexible and that I’d give my right arm to be ambidextrous (I didn’t say they were good jokes). Now, following a recent excursion into wibbly-wobbly analog space (where no one can hear you scream), I’m tempted to say that I’d jump through hoops to be more agile.
I … Read More → "Agile Analog Makes the Analog Parts of SoC Design Easy Peasy Lemon Squeezy"
Do you know any jokes suitable for young kids? The reason I ask is that there are three girls aged 8, 7, and 3 living next door to me. Whenever they see me pottering around outside, the two older girls race over to tell me their latest and greatest jokes and puns (the youngest one toggles along behind to make sure I haven’t forgotten that she’s three … Read More → "Metaspectral Takes AI Processing of Hyperspectral Imaging by Storm"
I don’t like to boast but, as one of the leading engineers of my generation (according to my mother), I’m a dab hand at measuring things like voltage, current, and resistance. These days, we can measure electrical properties like this to extraordinary degrees of accuracy and precision using instruments that … Read More → "The Non-Contact Body Temperature Measurement Market Heats Up"
Integrated circuits once again take center stage in this week’s Fish Fry podcast! Brandon Bautz (Cadence Design Systems) and I chat about the challenges of IC design closure today, how distribution and optimization can help address these growing design challenges, and the details of the Cadence® Certus™ Closure Solution. Also this week I investigate a new soft robot developed by Cornell University that can detect damage and heal … Read More → "A Billion Instances and Counting – Solving the Challenges of IC Design Closure"
What do IC design for test, the Tessent multi-die software solution and the best semiconductor material of all time have in common? This week’s podcast of course! My guest Vidya Neerkundar (Siemens) and I discuss trends in the IC industry today, the unique testing challenges for today’s cutting edge integrated circuits and why automation for 2D and 3D IC design-for-test is the way of the future. Also … Read More → "Automation and the Future of IC Design for Test"
