Choosing the right passives for your design can be a huge headache. Sorting through hundreds of data sheets looking for the component with just the right specs, balancing against your BOM requirements, and confirming availability can consume valuable engineering time. In this episode of Chalk Talk, Amelia Dalton chats with Arthur Evans of … Read More → "SimSurfing — Murata and Mouser Electronics"
Many IoT designs these days need location capabilities. While GPS alone was great in the old days, a modern design should be compatible with other satellite constellations as well for maximum performance. In this episode of Chalk Talk, Amelia Dalton chats with Mike Slade of STMicroelectronics about the Teseo-LIV3F Module which can make … Read More → "ST-Teseo LIV3F GNSS Module for IoT Positioning — STMicroelectronics and Mouser Electronics"
If your company infrastructure is converting from 3G to LTE, you’ve got a lot to think about. You’ll want to rethink the entire installation from antennas to routers, and even reconsider your choice of carriers. In this episode of Chalk Talk, Amelia Dalton chats with Randall Kerr of Digi about demystifying the transition to … Read More → "Migrating from 3G to LTE — Digi International and Mouser Electronics"
There are numerous situations where a solderless connection to a PCB would save time, space, BOM cost, and engineering frustration. However, most designers still resort to sticking an expensive connector on their PCB where one is not really needed. In this episode of Chalk Talk, Amelia Dalton chats with Tom Anderson of AVX … Read More → "STRIPT™ Connectors — AVX and Mouser Electronics"
Why attach a header connector to your PCB when you really don’t need one? If you’re plugging a ribbon cable into your board, particularly for a limited-use function such as provisioning, diagnostics, or testing, it can be costly and clunky to add a header connector to your BOM, and introduce yet another component to … Read More → "RedFit IDC SKEDD Connector — Wurth Electronics and Mouser Electronics"
Choosing the right passive for your design can be a maddening voyage through datasheets, internet searches, and endless matching and comparing of component specs. Finding just the right inductor or capacitor often becomes an exercise in drudgery. In this episode of Chalk Talk, Amelia Dalton chats with Hebberly Ahatlan of Wurth Electronics about RedExpert … Read More → "RedExpert — Wurth Electronics and Mouser Electronics"
Memory architecture is often the biggest bottleneck in a high-performance system design. The gap between high-speed DRAM and higher-capacity non-volatile memory sits at an inconvenient place on the cost-performance curve. In this episode of Chalk Talk, Amelia Dalton chats with Jeffrey Galinovsky of Intel about how new Intel technologies including Intel® Optane™ memory technology … Read More → "What is Intel® Optane™ Technology? — Mouser Electronics and Intel"
Today’s IoT designs require a large variety of sensors, and finding the correct one can be a daunting challenge. Choosing wisely could affect just about every aspect of your project, from BOM cost to performance in the field. In this episode of Chalk Talk, Amelia Dalton chats in depth with Clint Briscoe of … Read More → "Building Application Designs with Pressure Sensors — Honeywell and Mouser Electronics"
With the rapid pace of change in IoT designs these days, the flexibility, power efficiency, and low latency of FPGAs can be major advantages. In this episode of Chalk Talk, Amelia Dalton chats with Tom Schulte of Intel about applying FPGA technology to IoT systems. Click here for more information about Intel® FPGAs (formerly … Read More → "Accelerating a Smart and Connected World — Intel and Mouser Electronics"
Today, advanced packaging technology has created a new battleground where 2.5D packaging and heterogeneous design drive constraints that span semiconductor, packaging, board, and even system-level design. In this episode of Chalk Talk, Amelia Dalton chats with John Park of Cadence Design Systems about new techniques and tools for advanced IC packaging design. Click here … Read More → "A New Advanced IC Packaging Battlefield"
Jan 17, 2019
After two interesting blogs by Yagya Mishra that explained the most popular features of the Run Plan assistant in Virtuoso® ADE Assembler , I am writing this third blog in the series to share... [[ Click on the title to access the full blog on the Cadence Community site...
Jan 16, 2019
112 Gbps Samtec Flyover'¢ Demo Samtec's Ralph Page walks us through a live demonstration of a Samtec Flyover'¢ system which enables 112 Gbps PAM4 performance. The Credo CDR generates two ports of 31-bit PRBS data at 112 Gbps PAM4 data rates. The signal travels from...