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Chalk Talk ST-Teseo LIV3F GNSS Module for IoT Positioning — STMicroelectronics and Mouser Electronics

   Many IoT designs these days need location capabilities. While GPS alone was great in the old days, a modern design should be compatible with other satellite constellations as well for maximum performance. In this episode of Chalk Talk, Amelia Dalton chats with Mike Slade of STMicroelectronics about the Teseo-LIV3F Module which can make … Read More → "ST-Teseo LIV3F GNSS Module for IoT Positioning — STMicroelectronics and Mouser Electronics"

Chalk Talk What is Intel® Optane™ Technology? — Mouser Electronics and Intel

  Memory architecture is often the biggest bottleneck in a high-performance system design. The gap between high-speed DRAM and higher-capacity non-volatile memory sits at an inconvenient place on the cost-performance curve. In this episode of Chalk Talk, Amelia Dalton chats with Jeffrey Galinovsky of Intel about how new Intel technologies including Intel® Optane™ memory technology … Read More → "What is Intel® Optane™ Technology? — Mouser Electronics and Intel"

Chalk Talk Building Application Designs with Pressure Sensors — Honeywell and Mouser Electronics

   Today’s IoT designs require a large variety of sensors, and finding the correct one can be a daunting challenge. Choosing wisely could affect just about every aspect of your project, from BOM cost to performance in the field.  In this episode of Chalk Talk, Amelia Dalton chats in depth with Clint Briscoe of … Read More → "Building Application Designs with Pressure Sensors — Honeywell and Mouser Electronics"

Chalk Talk Accelerating a Smart and Connected World — Intel and Mouser Electronics

   With the rapid pace of change in IoT designs these days, the flexibility, power efficiency, and low latency of FPGAs can be major advantages. In this episode of Chalk Talk, Amelia Dalton chats with Tom Schulte of Intel about applying FPGA technology to IoT systems. Click here for more information about Intel® FPGAs (formerly … Read More → "Accelerating a Smart and Connected World — Intel and Mouser Electronics"

Chalk Talk A New Advanced IC Packaging Battlefield

  Today, advanced packaging technology has created a new battleground where 2.5D packaging and heterogeneous design drive constraints that span semiconductor, packaging, board, and even system-level design. In this episode of Chalk Talk, Amelia Dalton chats with John Park of Cadence Design Systems about new techniques and tools for advanced IC packaging design. Click here … Read More → "A New Advanced IC Packaging Battlefield"
featured blogs
Jan 17, 2019
After two interesting blogs by Yagya Mishra that explained the most popular features of the Run Plan assistant in Virtuoso® ADE Assembler , I am writing this third blog in the series to share... [[ Click on the title to access the full blog on the Cadence Community site...
Jan 16, 2019
112 Gbps Samtec Flyover'„¢ Demo Samtec'€™s Ralph Page walks us through a live demonstration of a Samtec Flyover'„¢ system which enables 112 Gbps PAM4 performance. The Credo CDR generates two ports of 31-bit PRBS data at 112 Gbps PAM4 data rates. The signal travels from...