Infineon introduces new E-version XDP™ hybrid flyback controller ICs for ultra-high power density designs
Munich, Germany – 17 March 2025 – Following the market launch of the industry’s first PFC and hybrid flyback (HFB) combo IC, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is introducing the E-version of its hybrid flyback controller family. Designed for high-performance applications, the new XDP™ hybrid flyback digital controller family leverages the advanced asymmetrical half-bridge (AHB) topology, which combines the simplicity of a flyback converter with the efficiency of a resonant converter, enabling high power density designs. This makes the controllers ideal for various AC/DC applications, including aftermarket and OEM chargers, adapters, power … Read More → "Infineon introduces new E-version XDP™ hybrid flyback controller ICs for ultra-high power density designs"