STMicroelectronics launches highly-integrated power-management IC for its latest microprocessors
Geneva, Switzerland, September 19, 2024 – The STPMIC25 power-management IC for STMicroelectronics’ STM32MP2 microprocessors is now available, with 16 channels to supply all the MPU power rails as well as system peripherals in one convenient package. Completing the hardware design requires only a small number of external components to provide filtering and stabilization and the STEVAL-PMIC25V1 evaluation board is available now to start development immediately.
The IC contains … Read More → "STMicroelectronics launches highly-integrated power-management IC for its latest microprocessors"
New eBook from Mouser Electronics Offers Insights into Design Challenges of Motor Control
September 19, 2024 – Mouser Electronics, Inc., the authorized global distributor with the newest electronic components and industrial automation products, today announces a new eBook offering a deep dive into motor control. Electric motors play vital roles in an extraordinarily wide range of products, from cars to refrigerators and yard tools to elevators and air conditioning. With the push to achieve a more sustainable future, the challenge … Read More → "New eBook from Mouser Electronics Offers Insights into Design Challenges of Motor Control"
Unleash Parallel Power with ASRock Industrial’s IMB-X1900, Driven by Intel® Xeon® W Performance
Taipei, Taiwan (September 18, 2024) – In today’s fast-paced business environment, efficiency and performance are paramount. ASRock Industrial introduces the IMB-X1900, a motherboard that combines cutting-edge innovation with unparalleled processing power and AI acceleration to drive the future of high-performance systems. Designed to elevate industry standards and redefine performance in demanding environments, the IMB-X1900 exemplifies ASRock Industrial’s commitment to excellence. With powerful processing capabilities, expansive memory support, and advanced connectivity options, this motherboard is built on the robust Intel® Xeon® W-3500/3400 and W-2500/2400 Series Processors, ensuring it effortlessly manages even the most complex parallelized tasks, delivering exceptional efficiency … Read More → "Unleash Parallel Power with ASRock Industrial’s IMB-X1900, Driven by Intel® Xeon® W Performance"
HSYCO Gateway Simplifies Communication Between Disparate, Proprietary Industrial and Building Automation Protocols
STMicroelectronics launches integrated high-voltage power stage with space-efficient evaluation board for smaller, tougher motor drives
- Gate driver, power MOSFETs, bootstrap diodes, and fast-acting protection all in one package save 70% of board space
- Evaluation board with compact, circular footprint accelerates development of fans and pumps
Geneva, Switzerland, September 18, 2024 – Accelerating development of compact and reliable fans and pumps built with energy-efficient motors, STMicroelectronics has introduced the PWD5T60 … Read More → "STMicroelectronics launches integrated high-voltage power stage with space-efficient evaluation board for smaller, tougher motor drives"
BlackBerry QNX Strengthens Automotive Software Portfolio with New Safety-Certified Filesystem
NXP’s MC33777 Revolutionizes Battery Pack Monitoring Technology for Electric Vehicles
What’s new: NXP® Semiconductors today announced the MC33777, the world’s first battery junction box IC that integrates critical pack-level functions into a single device. Unlike conventional pack-level monitoring solutions that require multiple discrete components, external actuators and processing support, NXP’s MC33777 consolidates essential BMS functions. The IC significantly reduces design complexity, qualification and software development effort, and cost for OEMs, while enhancing the overall performance of the system.
Why it matters: This state-of-the-art IC can help protect high-voltage batteries from overcurrent by … Read More → "NXP’s MC33777 Revolutionizes Battery Pack Monitoring Technology for Electric Vehicles"
Infineon and Oxford Ionics awarded contract to build a mobile quantum computer
Munich – 18 September 2024 – Infineon Technologies AG and its technology partner Oxford Ionics Ltd. have been selected to build a mobile quantum computer as one of three consortia by Agentur für Innovation in der Cybersicherheit GmbH „Innovation for Cybersecurity“ (Cyberagentur). The Cyberagentur, supported by the German Federal Ministries of the Interior and Defence, aims to obtain three functioning mobile quantum computers within three years, of which one system will be selected for further development for practical use. It is investing a total of 35 million euros in the research and development project. The competition … Read More → "Infineon and Oxford Ionics awarded contract to build a mobile quantum computer"
STMicroelectronics delivers industry’s first FIPS 140-3 certified TPMs for computer, server, and embedded systems
Geneva, Switzerland, September 17, 2024 – STMicroelectronics today announced the FIPS 140-3 certification of STSAFE-TPM trusted platform modules (TPMs), the first standardized cryptographic modules on the market to receive this certificate.
The newly certified TPMs, the ST33KTPM2X, ST33KTPM2XSPI, ST33KTPM2XI2C, ST33KTPM2I and ST33KTPM2A provide cryptographic asset protection to meet security and regulatory requirements for critical information systems. They are used in PCs, servers and network-connected … Read More → "STMicroelectronics delivers industry’s first FIPS 140-3 certified TPMs for computer, server, and embedded systems"
