Highlights:

• Synopsys 3DIC Compiler integrates with 3Dblox 2.0 standard for heterogeneous integration and a complete exploration-to-signoff solution.
• Synopsys UCIe PHY IP, which achieved first-pass silicon success on TSMC N3E process, provides low-latency, low-power, and high-bandwidth die-to-die connectivity.
• The combination of UCIe PHY IP and 3DIC Compiler optimizes multi-die system design for higher quality-of-results with minimal integration risk.

SUNNYVALE, Calif., Sept. 27, 2023 /Read More → "Synopsys and TSMC Streamline Multi-Die System Complexity with Unified Exploration-to-Signoff Platform and Proven UCIe IP on TSMC N3E Process"

Siemens Digital Industries Software today announced new certifications and collaborations with longtime partner TSMC, resulting in the successful qualification of multiple industry-leading Siemens EDA product lines for the foundry’s latest process technologies.

“TSMC’s collaboration with design ecosystem partners like Siemens helps our mutual customers remain at the forefront of technology innovation,” said Dan Kochpatcharin, head of the Design Infrastructure Management Division at TSMC. “This close partnership provides customers with proven design solutions that allow customers to more fully leverage the significant performance and power efficiency advantages of TSMC’s advanced process technologies.”

Calibre … Read More → "Siemens and TSMC collaborate to help mutual customers optimize designs using foundry’s newest advancements"