News – EEJournal

Infineon’s EiceDRIVER™ 125 V high-side gate driver protects battery-driven applications in the event of a fault

October 11, 2024

Munich, Germany – 10 October 2024 – In battery-powered applications such as motor drives and switched-mode power supplies (SMPS), the power supply architecture often requires that a module can be disconnected from the main supply rail when a fault occurs in that module. To achieve this functionality, it is common to use high-side disconnect switches (e.g. MOSFETs) to prevent a load short circuit from affecting the battery. Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has now introduced the EiceDRIVER™ 1EDL8011, a high-side gate driver designed to protect battery-powered applications such as cordless power tools, robotics, … Read More → "Infineon’s EiceDRIVER™ 125 V high-side gate driver protects battery-driven applications in the event of a fault"

Patented antenna digital twin solution from Rohde & Schwarz and IMST optimizes automotive connectivity

October 11, 2024

Rohde & Schwarz, in collaboration with wireless communications engineering experts IMST GmbH, has developed a patented antenna digital twin solution, effectively addressing a multitude of challenges and delivering considerable benefits for vehicle manufacturers and their suppliers to optimize automotive connectivity. The solution combines measurements of the antenna characteristics with simulation of the electromagnetic wave propagation to optimize the antennas’ design and their position to ensure for example optimal WiFi coverage inside the vehicle.

Vehicle manufacturers face several challenges when integrating antennas out- or in-side their vehicles. Performing antenna simulations is complex and time consuming, and simulation results … Read More → "Patented antenna digital twin solution from Rohde & Schwarz and IMST optimizes automotive connectivity"

Innoscience launches new generation of BMS solutions based on 100V Bi-directional VGaN™ technology

October 11, 2024

10^th October 2024 – Read More →

Eliyan Delivers Industry’s Highest Performing Chiplet Interconnect PHY at 64Gbps in 3nm Process

Working silicon confirms most efficient and flexible multi-die solution for scaling performance and bandwidth in the Gen AI era

October 11, 2024

SANTA CLARA, Calif. –October 9, 2024 – Eliyan Corporation, credited for the invention of the semiconductor industry’s highest-performance and most efficient chiplet interconnect, today revealed the successful delivery of first silicon for its NuLink™-2.0 PHY, manufactured in a 3nm process. The device achieves 64Gbps/bump, the industry’s highest performance for a die-to-die PHY solution for multi-die architectures. While compatible with UCIe standard, the milestone further confirms Eliyan’s ability to extend die-to-die connectivity by 2x higher bandwidth, on standard as well as advanced packaging, at unprecedented power, area, and latency.

The NuLink-2.0 is a multi-mode PHY solution … Read More → "Eliyan Delivers Industry’s Highest Performing Chiplet Interconnect PHY at 64Gbps in 3nm Process"

Navitas Delivers More Power for AI & EV with Extended GaNSafe™ Portfolio

Rugged, cool, extended-power performance with world’s most protected GaN power semiconductor in thermally-enhanced TOLT package.

October 10, 2024

Torrance, CA – Oct 9^th, 2024— Navitas Semiconductor (Nasdaq: NVTS), the only pure-play, next-generation power semiconductor company and industry leader in gallium nitride (GaN) … Read More →

Memfault Unveils IoT Compliance Toolkit to Help Customers Meet Emerging Global Embedded Device Regulations

Built-in observability and over-the-air capabilities enable embedded device manufacturers to meet key aspects of new, global compliance requirements

October 10, 2024

SAN FRANCISCO, CA / ACCESSWIRE / October 9, 2024 / Memfault, provider of the first embedded device observability and over-the-air (OTA) platform, today announced the unveiling of its IoT compliance toolkit, giving customers seamless access to technology that makes it easier to meet critical aspects of current and emerging global compliance requirements. With Memfault, customers will have the tools they need to meet some of the common compliance requirements including vulnerability detection in deployed devices and the management and distribution of OTA updates.

The hardware industry is on a journey … Read More → "Memfault Unveils IoT Compliance Toolkit to Help Customers Meet Emerging Global Embedded Device Regulations"

Unveiling a New Technique for Preparing Ionic Liquid-Based Membranes for Mixture Separation

The innovative methodology proposed by researchers could improve their versatility and energy efficiency for many industrial applications

October 10, 2024

Ionic liquid (IL)-immobilized membranes are promising materials for separating mixtures, but their manufacture via conventional methods can be complex. Researchers from Japan have now developed a novel and versatile technique to prepare IL-immobilized membranes using vapor-phase transport followed by a simple anion exchange process. This innovative approach enables a more straightforward method for producing membranes tailored to separate specific compounds, paving the way for more energy-efficient separation processes.

Separating mixtures into their constituent substances is essential in many fields. For example, mixture separation plays a key role in the petrochemical industry, as well as … Read More →

i.MX 93 System on Module: A Building Block for Gateways & HMI Solutions

October 10, 2024

HMI and Gateways play crucial roles in our increasingly interconnected digital landscape. HMIs enable intuitive interaction between humans and complex systems and enhance user experience and productivity, with adoption in consumer, automotive, industrial, and medical solutions. Gateways act as bridges between different networks and protocols and facilitate edge computing. Together, HMI and Gateways are essential and drive innovation … Read More → "i.MX 93 System on Module: A Building Block for Gateways & HMI Solutions"

LG Taking Orders for Level 3 DC Fast Chargers Expanding Lineup for Growing EV Infrastructure

New Level 3 DC Charger to Join LG’s Level 2 AC Charger Offering Commercial Customers Flexibility in Meeting Needs of EV Customers

October 10, 2024

LINCOLNSHIRE, Ill., Oct. 3, 2024 — Further strengthening its commitment to meet the growing market need for fast, reliable EV vehicle charging solutions, LG Business Solutions USA has begun taking orders for LG’s first Level 3 DC Charger in the United States. The new fast charger, model LG EVD175SK-PN, has been certified to UL 2594, the UL Standard for Electric Vehicle … Read More → "LG Taking Orders for Level 3 DC Fast Chargers Expanding Lineup for Growing EV Infrastructure"

Alpha and Omega Semiconductor Announces Application-Specific EZBuck™ Regulator Designed to Power Intel Arrow Lake Platform

With 45A Peak Current Capability, the AOZ23567QI Buck Converter Provides a Highly Integrated, Compact Solution for Intel Arrow Lake CPU VCCPRIM_VNNAON Rails

October 10, 2024

SUNNYVALE, Calif., Oct. 09, 2024 – Alpha and Omega Semiconductor Limited (AOS) (Nasdaq: AOSL), a designer, developer, and global supplier of a broad range of discrete power devices, wide band gap power devices, power management ICs, and modules, today announced its new application-specific EZBuck™ Regulator. The highly integrated, compact, and high-power-density AOZ23567QI Constant On-Time Buck Converter offers an upgraded solution … Read More → "Alpha and Omega Semiconductor Announces Application-Specific EZBuck™ Regulator Designed to Power Intel Arrow Lake Platform"