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Microchip Introduces PIC16F17576 MCU Family to Simplify Analog Sensor Design

Integrated low-power analog peripherals reduce design costs and complexity
April 23, 2025

CHANDLER, Ariz., April 23, 2025 — Devices designed for capturing rapidly changing analog signals must respond quickly while consuming minimal power, especially in battery-operated applications. To address these demands, Microchip Technology (Nasdaq: MCHP) has released the PIC16F17576 microcontroller (MCU) product family with integrated low-power peripherals and the ability to precisely measure volatile analog signals.</ … Read More → "Microchip Introduces PIC16F17576 MCU Family to Simplify Analog Sensor Design"

OMNIVISION Launches 1.5-Megapixel Global Shutter Sensor for Automotive Driver Monitoring Systems

The new OX01N1B is designed to be a cost-effective solution for DMS cameras and features industry-leading QE, MTF and low power
April 22, 2025
SANTA CLARA, Calif. – April 22, 2025 – OMNIVISION, a leading global developer of semiconductor technology, including advanced digital imaging, analog and display solutions, today announced the new OX01N1B image sensor for in-cabin automotive driver monitoring systems (DMS). The device is the newest addition to OMNIVISION’s industry-leading Nyxel® near-infrared (NIR) technology family of automotive sensors and is a 1.5-megapixel (MP) RGB-IR or monochrome BSI global shutter (GS) sensor with a pixel size of 2.2 microns (µm) and an optical format of 1/4.51-inch. OMNIVISION will showcase the OX01N1B sensor with eco-system partners at Auto Shanghai, taking place April 23-May 2, 2025.
< … Read More → "OMNIVISION Launches 1.5-Megapixel Global Shutter Sensor for Automotive Driver Monitoring Systems"

Infineon and Marelli enter new era of automotive cockpit design with MEMS laser beam scanning at 2025 Auto Shanghai

April 22, 2025

Munich, Germany – 22 April 2025 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), a global semiconductor leader in power systems and IoT, and Marelli, a world-leading automotive systems manufacturer, are partnering to advance automotive display technology with an innovative MEMS laser beam scanning (LBS) system. Based on Infineon’s LBS technology, this solution enables Marelli to create immersive cockpit experiences free from the constraints of traditional displays. This cutting-edge technology will be showcased at Marelli’s booth during Auto Shanghai 25.

“The automotive industry’s demand for innovative optics solutions in cockpit designs is accelerating, and Infineon is committed to delivering … Read More → "Infineon and Marelli enter new era of automotive cockpit design with MEMS laser beam scanning at 2025 Auto Shanghai"

Ceva Neural Processing Unit IP for Edge AI Selected by Nextchip for Next-Generation ADAS Solutions

Nextchip license NeuPro-M NPU to bring powerful and highly efficient AI capabilities to boost performance and capabilities of automotive safety systems
April 22, 2025

ROCKVILLE, MD., April 22, 2025 – Ceva, Inc. (NASDAQ: CEVA), the leading licensor of silicon and software IP that enables Smart Edge devices to connect, sense and infer data more reliably and efficiently, today announced that Nextchip has licensed the NeuPro-M Edge AI Neural Processing Unit (NPU) IP for its next-generation advanced driver assistance systems (ADAS) solutions. Nextchip develops ADAS and Image Signal Processors (ISP) solutions for automotive Tier 1s … Read More → "Ceva Neural Processing Unit IP for Edge AI Selected by Nextchip for Next-Generation ADAS Solutions"

Renesas Debuts New Group in Popular RA0 Series with Best-in-Class Power Consumption and Extended Temperature Range

Low-Cost RA0E2 Devices Target Consumer Electronics, Small Appliances, Industrial System Control and Building Automation
April 22, 2025

TOKYO, Japan ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced the RA0E2 microcontroller (MCU) Group based on the Arm® Cortex®-M23 processor. The new, cost-competitive devices offer extremely low power consumption, extended temperature range, and a wide variety of peripheral functions and safety features.

Renesas introduced the RA0 MCU series in 2024 and it has quickly become very popular with a wide range of customers due to its affordability and low power consumption. RA0E1 devices have already been adopted in consumer electronics, appliance and white goods, power … Read More → "Renesas Debuts New Group in Popular RA0 Series with Best-in-Class Power Consumption and Extended Temperature Range"

SPARK Microsystems’ SR1120 UWB Transceiver Outperforms Bluetooth by 40X for Wireless Data Throughput

Second-generation SPARK chip delivers 100X lower power ranging than UWB competitors; extends leadership in high data rates, power efficiency, latency and signal robustness
April 22, 2025

Montreal, Canada, April 22, 2025, — SPARK Microsystems, a Canadian fabless semiconductor company specializing in next-generation short-range wireless communications, today introduces its second-generation ultra-wideband (UWB) wireless transceiver, the SR1120.

The SR1120 … Read More → "SPARK Microsystems’ SR1120 UWB Transceiver Outperforms Bluetooth by 40X for Wireless Data Throughput"

CompactPCI Serial R3: PICMG announces release of new specification

April 22, 2025

With Release 3 of the CompactPCI Serial specification, PICMG doubles the bandwidth and speed of CompactPCI Serial applications. This benefits sectors such as aerospace, industry and automotive.

Wakefield, MA. PICMG – a leading consortium to develop innovative open standards in embedded computing – today announces the release of CompactPCI Serial® Revision 3 (CPCI-S.0 R3.0). With the third revision of the standard, the organization is ensuring future viability and scalability for many years to come. CompactPCI Serial® was originally developed as an extension of the open CompactPCI® standard to meet the demand for robust, modular and … Read More → "CompactPCI Serial R3: PICMG announces release of new specification"

xMEMS Labs Powers World’s First AI Sports Glasses with Cowell MEMS Tweeter, Securing Foothold in Booming AI Glasses Market

April 22, 2025

Santa Clara, California, April 22, 2025 – xMEMS Labs, Inc., the global leader in solid-state MEMS speaker technology, today announced that its Cowell MEMS tweeter is now shipping in a groundbreaking AI sports glasses product from Read More → "xMEMS Labs Powers World’s First AI Sports Glasses with Cowell MEMS Tweeter, Securing Foothold in Booming AI Glasses Market"

The 2025 Symposium on VLSI Technology & Circuits – The VLSI Field Thrives on Continuous Growth with the Theme: “Cultivating the VLSI Garden: From Seeds of Innovation to Thriving Growth”

April 21, 2025

Kyoto, Japan (APRIL 18, 2025) – For the 45th consecutive year delivering a unique convergence of microelectronics technology and circuits in one venue, the Read More → "The 2025 Symposium on VLSI Technology & Circuits – The VLSI Field Thrives on Continuous Growth with the Theme: “Cultivating the VLSI Garden: From Seeds of Innovation to Thriving Growth”"

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