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OnScale and SoftMEMS Collaborate with Mentor to Announce a New Integrated Workflow for MEMS Digital Prototyping

SAN DIEGOOct. 23, 2019 /PRNewswire/ — Today, at the MEMS & Sensors Executive Congress – MSEC 2019, OnScale® and SoftMEMS® announced the first truly integrated workflow for MEMS Digital Prototyping combining Cloud Engineering Simulation and Tanner electronic design automation (EDA) tools from Mentor®, a Siemens business.

“The deep integration of design tools offered by OnScale, SoftMEMS, and Mentor, our first EDA partner, provides a unique workflow enabling the co-design and simulation of micromachined electromechanical systems (MEMS) and sensor devices,” says Ian Campbell, CEO, OnScale. The workflow leverages Mentor’s … Read More → "OnScale and SoftMEMS Collaborate with Mentor to Announce a New Integrated Workflow for MEMS Digital Prototyping"

Keysight Technologies Enables Rapid Product Development with PathWave Test 2020 Software Suite

SANTA ROSA, Calif., October 22, 2019

Keysight Technologies, Inc. (NYSE: KEYS), a leading technology company that helps enterprises, service providers and governments accelerate innovation to connect and secure the world, announced the PathWave Test 2020 software suite, which delivers an integrated experience for leading electronic manufacturers to accelerate time-to-market of their digital and … Read More → "Keysight Technologies Enables Rapid Product Development with PathWave Test 2020 Software Suite"

STMicroelectronics Unleashes Enhanced NFC Experiences of New iOS 13 Platform

 

  • New iOS 13 release to significantly extend support for NFC applications including reading/writing tags and improved user experience
  • ST provides support for developers to accelerate delivery of solutions for iOS 13 based on extensive ST25 NFC-tag family
Geneva, October 22, 2019 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, is enhancing software support for smartphone app developers to unleash the full potential from the new Core NFC Framework of the newly released iOS 13 operating system.

Synopsys Launches New ARC VPX DSP Processor IP for High-performance Signal Processing SoC Designs

MOUNTAIN VIEW, Calif., Oct. 22, 2019 /PRNewswire/ —

Highlights:

Samtec Features Latest 32 GT/s Interconnect Solutions at PCI-SIG® Developers Conference Asia-Pacific Tour 2019

New Albany, IN: Samtec Inc., a privately held $822 MM global manufacturer of a broad line of electronic interconnect solutions, will showcase and demonstrate their latest high-performance interconnect and technologies at the PCI-SIG® Developers Conference Asia-Pacific Tour 2019.

Samtec high-speed technologies for Silicon-to-Silicon optimization will be on display, including new high-speed, high-bandwidth optical, board-to-board and cable-to-board interconnects. 56 Gbps PAM4 and 32 GT/s product demonstrations and technical sessions will also be highlighted.

Demonstrations:

Cadence Announces First-to-Market NVMe 1.4 Verification IP for High-Performance Computing

SAN JOSE, Calif., October 22, 2019—Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced the availability of the industry’s first Verification IP (VIP) in support of the new NVM Express 1.4 (NVMe) protocol. The Cadence® VIP for NVMe 1.4 enables designers to quickly and thoroughly verify their storage, data center and high-performance computing (HPC) system-on-chip (SoC) designs with less effort and a greater assurance that the SoC will meet the protocol standards.

The Cadence VIP for NVMe 1.4 supports the company’s Intelligent System Design strategy, enabling SoC design excellence through best-in-class IP. For more information on the Cadence VIP for … Read More → "Cadence Announces First-to-Market NVMe 1.4 Verification IP for High-Performance Computing"

Imec reports monolithic thin-film image sensor for the SWIR range with record pixel density

LEUVEN (Belgium), OCT 21, 2019 — Imec, a world-leading research and innovation hub in nanoelectronics and digital technology, presents a new thin-film monolithic image sensor that captures light in the near-infrared (NIR) and short-wavelength infrared (SWIR). Based on a monolithic approach, the process promises an order of magnitude gain in fabrication throughput and cost compared to processing today’s conventional IR imagers, while at the same time enabling multi-megapixel resolution. IR imagers are used in a wide variety of applications, and imec’s new technology greatly extends their possibilities, including surveillance, biometric identification, virtual reality, machine vision, and industrial … Read More → "Imec reports monolithic thin-film image sensor for the SWIR range with record pixel density"

Samsung Foundry and Synopsys Deliver Comprehensive Automotive Solutions for Autonomous Driving and ADAS

MOUNTAIN VIEW, Calif., Oct. 17, 2019 /PRNewswire/ —

Highlights:

X-FAB Adds Non-Volatile Memory Functions to its 180nm BCD-on-SOI Platform

Tessenderlo, Belgium – October 17, 2019

X-FAB Silicon Foundries SE, the leading analog/mixed-signal and specialty foundry, today announced the availability of SONOS-based Flash and embedded EEPROM on its widely implemented XT018 (https://www.xfab.com/technology/soi/018-um-xt018/) BCD-on-SOI platform. The addition of these Non-Volatile Memory (NVM) elements will open up an even broader array of … Read More → "X-FAB Adds Non-Volatile Memory Functions to its 180nm BCD-on-SOI Platform"

UK collaboration unveils Bizen® a transistor wafer process technology promising to slash lead times, wafer area and process layers while increasing speed, reducing power and increasing gate density over CMOS

Nottingham, UK, October 2019: A UK collaboration between Nottingham-based start-up, Search For The Next (SFN) and Glenrothes-based Semefab may be set to disrupt the semiconductor industry by implementing a fundamental change at transistor level reaching back five decades to the early bipolar IC era before CMOS became mainstream, using a new process called Bizen. Bizen applies the principles of quantum tunnel mechanics to any computing or power technology. When compared to CMOS, Bizen results in a five-fold lead time reduction – down from 15 weeks to just three weeks. Moreover, the new process achieves a three-fold increase in gate density … Read More → "UK collaboration unveils Bizen® a transistor wafer process technology promising to slash lead times, wafer area and process layers while increasing speed, reducing power and increasing gate density over CMOS"

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