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GigaDevice Launches the GD-xD-W515-EVAL Board: The All-in-One Kit for Rapid Prototyping and Development in Multiple Applications

BEIJING, Sept. 27, 2023 (GLOBE NEWSWIRE) — GigaDevice (SSE:603986), a leading provider of flash memory, 32-bit microcontrollers, sensors, and analog technology, is proud to introduce the new All-in-One kit: GD-xD-W515-Eval Board. This evaluation platform leverages various GigaDevice products, enabling customers to evaluate multiple hardware and software combinations all within one comprehensive kit.

The GD-xD-W515-EVAL Board is the first evaluation kit in the xD series, it comprises a mainboard, a fingerprint board, and an LCD board within a compact footprint. It can be powered by either a battery or … Read More → "GigaDevice Launches the GD-xD-W515-EVAL Board: The All-in-One Kit for Rapid Prototyping and Development in Multiple Applications"

OMNIVISION Announces New Low-power, Enhanced-performance 2MP Image Sensor for Security Surveillance Cameras

SANTA CLARA, Calif. – September 27, 2023 – OMNIVISION, a leading global developer of semiconductor solutions, including advanced digital imagingRead More → "OMNIVISION Announces New Low-power, Enhanced-performance 2MP Image Sensor for Security Surveillance Cameras"

New partnership: IAR and Edge Impulse to provide IAR customers worldwide with integrated AI and ML capabilities

Uppsala Sweden/San Jose, US; September 27, 2023 – IAR, the world leader in software and services for embedded development, today announced a commercial partnership with Edge Impulse, the leading edge AI platform provider. The partnership is built on integrations between Edge Impulse’s platform and IAR Embedded Workbench, with full integration between the two products on a workflow level.

Engineers building applications with, for example, predictive capabilities can leverage Edge Impulse’s technologies to generate – and evaluate – predictive ML models. These models can be derived from real-time data … Read More → "New partnership: IAR and Edge Impulse to provide IAR customers worldwide with integrated AI and ML capabilities"

New motion sensor board from MIKROE uses Doppler Shift technology

September 2023: MikroElektronika (MIKROE), the embedded solutions company that dramatically cuts development time by providing innovative hardware and software products based on proven standards, has introduced a new motion sensor Click™ board, to support the development of … Read More → "New motion sensor board from MIKROE uses Doppler Shift technology"

Cadence Expands Support for 3Dblox 2.0 Standard with New System Prototyping Flows

  • Cadence Integrity 3D-IC Platform fully supports latest 3Dblox 2.0 standard across all TSMC’s 3DFabric offerings
  • Integrity 3D-IC Platform uniquely combines system planning, implementation and system-level analysis in a single solution, enabling seamless prototyping
  • Mutual customers creating AI, mobile, 5G, hyperscale computing and IoT 3D-IC designs can model system prototypes to accelerate multi-chiplet design turnaround time

 

SAN JOSE, Calif., September 27, 2023—Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the availability of new system prototyping flows based on the Cadence® Integrity 3D-IC Platform … Read More → "Cadence Expands Support for 3Dblox 2.0 Standard with New System Prototyping Flows"

Newark partners with Bourns to meet growing demand for advanced magnetic solutions

Chicago – September 27, 2022: Newark, an Avnet company and global distributor of electronic components, products and solutions, has launched a new global campaign with Bourns, Inc. to supply advanced magnetic solutions. Newark’s longstanding strategic partnership with Bourns is supported by growing customer demand for innovative embedded solutions which are critical to breakthrough electric vehicle and e-mobility designs, high power battery charging, renewable energy, energy storage, Internet of Things (IoT), 5G … Read More → "Newark partners with Bourns to meet growing demand for advanced magnetic solutions"

Synopsys and TSMC Streamline Multi-Die System Complexity with Unified Exploration-to-Signoff Platform and Proven UCIe IP on TSMC N3E Process

Highlights:

  • Synopsys 3DIC Compiler integrates with 3Dblox 2.0 standard for heterogeneous integration and a complete exploration-to-signoff solution.
  • Synopsys UCIe PHY IP, which achieved first-pass silicon success on TSMC N3E process, provides low-latency, low-power, and high-bandwidth die-to-die connectivity.
  • The combination of UCIe PHY IP and 3DIC Compiler optimizes multi-die system design for higher quality-of-results with minimal integration risk.

SUNNYVALE, Calif., Sept. 27, 2023 /Read More → "Synopsys and TSMC Streamline Multi-Die System Complexity with Unified Exploration-to-Signoff Platform and Proven UCIe IP on TSMC N3E Process"

Percepio® Enables Trace Observability for All RTOS, Middleware and Silicon Vendor APIs

Västerås, Sweden, September 27, 2023 * * * Percepio AB, the leading provider of edge observability  solutions for system developers within critical Operational Technology (OT) applications, announces the immediate availability of Read More → "Percepio® Enables Trace Observability for All RTOS, Middleware and Silicon Vendor APIs"

Siemens and TSMC collaborate to help mutual customers optimize designs using foundry’s newest advancements

Siemens Digital Industries Software today announced new certifications and collaborations with longtime partner TSMC, resulting in the successful qualification of multiple industry-leading Siemens EDA product lines for the foundry’s latest process technologies.

“TSMC’s collaboration with design ecosystem partners like Siemens helps our mutual customers remain at the forefront of technology innovation,” said Dan Kochpatcharin, head of the Design Infrastructure Management Division at TSMC. “This close partnership provides customers with proven design solutions that allow customers to more fully leverage the significant performance and power efficiency advantages of TSMC’s advanced process technologies.”

Calibre … Read More → "Siemens and TSMC collaborate to help mutual customers optimize designs using foundry’s newest advancements"

Curtiss-Wright Brings Power of Intel Xeon D-1700 Processors to IPMI Remote Management/NVMe Storage Server Module for Tactical 5G Communications

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