News – EEJournal

TE Connectivity’s new 369 shielded connectors expand harsh environment capabilities beyond commercial aerospace

EMI shielded product extension of current 369 connector family now available

November 14, 2019

HARRISBURG, Pa. – November 12, 2019 – TE Connectivity (TE), a world leader in connectivity and sensors, is extending its time-tested 369 connector series with the introduction of the new 369 shielded rectangular connectors for environments that demand ambient EMI noise protection. These connectors incorporate the benefits of the 369 series, which is qualified for use in a wide range of commercial aerospace applications, with EMI shielding that opens up new application possibilities.

“The combination of shielding technology with the existing 369 connector series enables a huge range of potential applications for the 369 series beyond commercial aerospace,” said Clint Schlosser, product manager for TE’s … Read More → "TE Connectivity’s new 369 shielded connectors expand harsh environment capabilities beyond commercial aerospace"

Telit Adds New Cellular Low Power Wide Area Modules to Portfolio

November 14, 2019

Highly efficient power usage and enhanced coverage makes the NE310H2-W1 and NL865H2-W1 ideal for 2G to 4G NB-IoT transition
The miniature xE310 form factor allows for integration in the most compact devices, the xL865 family guarantees smooth evolution for devices based on legacy Telit modules

London, November 11, 2019 – Telit, a global enabler of the Internet of Things (IoT), today announced two new Narrow Band-IoT modules< … Read More → "Telit Adds New Cellular Low Power Wide Area Modules to Portfolio"

Mentor introduces Tessent Safety ecosystem to meet IC test requirements of the autonomous vehicles era

November 13, 2019

Tessent Safety ecosystem leverages the comprehensive automotive IP portfolio of Arm as part of the company’s Functional Safety Partnership Program
As part of the Tessent Safety ecosystem, Mentor unveils new BIST solution delivering up to 10x faster in-system test than traditional offerings

Mentor, a Siemens business, today introduced the new Tessent™ software Safety ecosystem – a comprehensive portfolio of best-in-class automotive IC test solutions from Mentor with links to its industry-leading partners. The program helps IC design teams meet the increasingly stringent functional safety requirements of the … Read More → "Mentor introduces Tessent Safety ecosystem to meet IC test requirements of the autonomous vehicles era"

Renesas Electronics Expands RA Microcontroller Ecosystem with Ready to Use Partner Solutions

New Software and Hardware Building Block Solutions Developed for RA Family of 32-bit Arm Cortex-M MCUs

November 13, 2019

TOKYO, Japan, November 12, 2019 ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced the first 10 ready to use partner solutions that support the Renesas Advanced (RA) microcontroller (MCU) Family of 32-bit Arm® Cortex®-M MCUs. RA MCUs deliver optimized performance and ease of use with the Flexible Software Package (FSP) and partner building block solutions that work out-of-box to address a range of Internet of Things (IoT) endpoint and edge applications.

The RA MCU ecosystem today has more than 30 partners with continuous investments planned. Each partner’s … Read More → "Renesas Electronics Expands RA Microcontroller Ecosystem with Ready to Use Partner Solutions"

Efinix® Rolls Out Trion® T120 FPGAs

Trion T120 FPGAs kick-off a new era of edge computing and acceleration

November 13, 2019

SANTA CLARA, Calif., Nov. 12, 2019 (GLOBE NEWSWIRE) — Efinix^®, an innovator in programmable product platforms and technologies, today announced the rollout of Trion^® T120 FPGAs, featuring a small, high-density fabric, a hardened DDR memory controller and hardened MIPI CSI-2 and PHY interfaces.

Built on SMIC’s 40nm process, Trion T120 FPGAs are designed and developed to address high-volume cutting-edge products and applications in … Read More → "Efinix® Rolls Out Trion® T120 FPGAs"

Abaco Announces Flexible, Rugged 4-Channel Gigabit Ethernet Interface XMC to Help Minimize Size, Weight and Power (SWaP)

November 13, 2019

Offers choice of copper, fiber SFP connectivity

Broad range of operating system support

Simple, cost-effective upgrade for PMC676RC, PMC677RC users

HUNTSVILLE, Ala.— November 12 2019 Abaco Systems today announced the XMC477RC 4-Channel SFP Gigabit Ethernet Interface, further expanding the company’s range of network interface card options. The new XMC is distinguished by its support for four SFP (Small … Read More → "Abaco Announces Flexible, Rugged 4-Channel Gigabit Ethernet Interface XMC to Help Minimize Size, Weight and Power (SWaP)"

NXP Announces New Automotive Ultra-Wideband Chip Capable of Turning Smartphones into Car Keys

NXP, BMW Group, and Continental work on new auto Ultra-Wideband (UWB) use cases and standards in CCC

November 13, 2019

Enables a broad range of striking new use cases such as true handsfree smartphone car access
Provides spatial awareness to cars and smart devices through unique UWB localization capabilities
New automotive Integrated Circuit (IC) completes NXP’s UWB portfolio spanning auto, mobile and IoT ecosystems
MUNICH, Germany – November 12, 2019 – NXP Semiconductors N.V. (NASDAQ: NXPI), the world’s largest provider of automotive semiconductors, today announced an addition to its UWB portfolio with a new automotive UWB IC. UWB provides precise, secure, real-time localization capabilities unrivaled by other wireless technologies such as Wi-Fi, Bluetooth, and … Read More → "NXP Announces New Automotive Ultra-Wideband Chip Capable of Turning Smartphones into Car Keys"

Mentor’s Tessent Connect automation reduces IC test implementation costs and accelerates time to market

Tessent Connect helped eSilicon dramatically speed IC test cycles for next-generation ASIC

November 12, 2019

Mentor, a Siemens business, today introduced Tessent Connect – an innovative design-for-test (DFT) automation methodology that delivers intent-driven hierarchical test implementation that helps IC design teams achieve manufacturing test quality goals faster and with fewer resources compared to traditional DFT methods. As part of the Tessent Connect rollout, Mentor today also announced the Tessent Connect Quickstart program, offering detailed flow assessments from Mentor’s applications and consulting services engineers.

Today’s advanced IC designs can achieve very high defect coverage for manufacturing and in-system test by integrating dedicated on-chip infrastructure such as embedded compression, … Read More → "Mentor’s Tessent Connect automation reduces IC test implementation costs and accelerates time to market"

STMicroelectronics Adds Wireless Support to Proven Smart-Meter Chipset for More Flexible, Scalable Smart Infrastructures

November 12, 2019

ST8500 smart-meter chipset now integrates both RF and PLC communication
Customer ADD Grup reveals first hybrid smart electricity meters leveraging upgraded functionality
Chipset and demonstration solutions to display at European Utility Week 2019

Geneva, November 12, 2019 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, is facilitating smarter city and industry infrastructures through the combination of powerline and wireless communication in its market-proven smart-meter chipset.

Already widely used in smart electricity meters, ST’ … Read More → "STMicroelectronics Adds Wireless Support to Proven Smart-Meter Chipset for More Flexible, Scalable Smart Infrastructures"

GOWIN Semiconductor Releases the First FPGA with Integrated Bluetooth Radio

November 12, 2019

SAN JOSE, Calif. and GUANGZHOU, China, Nov. 12, 2019 (GLOBE NEWSWIRE) — GOWIN Semiconductor Corp., the world’s fastest-growing programmable logic company, announces the release of their latest mSoC FPGA with integrated Bluetooth 5.0 Low Energy radio enabling an entirely new wave of FPGA computing capabilities at the edge.

Edge computing is requiring new demands on programmable devices. With significant variances in product requirements, GOWIN is paving the way for innovation with a variety of new features integrated within their next-generation FPGAs. Their latest device called the GW1NRF-4 provides a 4k LUT FPGA, a 32-bit power-optimized … Read More → "GOWIN Semiconductor Releases the First FPGA with Integrated Bluetooth Radio"

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