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SiTime MEMS Oscillators Support Square Point-of-Sale Products

SANTA CLARA, Calif., July 21, 2021 – SiTime® Corporation (NASDAQ: SITM), a market leader in MEMS timing, today announced that Square (NYSE: SQ), the globally trusted software, payments, and hardware solution for businesses of all sizes, is using the SiTime SiT8008 low-power, programmable MEMS … Read More → "SiTime MEMS Oscillators Support Square Point-of-Sale Products"

Powerful, compact System-on-Module supports three processor cores

Milwaukee, Wisconsin, July 22, 2021. Display solutions and embedded systems provider, Review Display Systems Inc. (RDS) has today announced the availability of a new System-on-Module (SOM) from Kontron, a leading global provider of embedded computing technology. The SOM-SL STM32MP157 is based on the STMicroelectronics STM32MP157A processor which features fully integrated Dual Cortex-A7 and Cortex-M4 processor cores.

The integrated Cortex-M4 core of the STM32MP157A processor offers proven microcontroller technology and sufficient computing power and graphics capability to support demanding control tasks within factory automation, process control and internet communication applications. Based … Read More → "Powerful, compact System-on-Module supports three processor cores"

Cadence Extends Digital Design Leadership with Revolutionary ML-based Cerebrus, Delivering Best-in-class Productivity and Quality of Results

Highlights:
• Cerebrus uses unique ML technology to drive the Cadence RTL-to-signoff implementation flow, delivering up to 10X productivity and 20% PPA improvements for implementation
• Built with a re-usable and transportable reinforced learning model that increases effectiveness with each use
• Provides more efficient on-site and cloud compute resource management capabilities than traditional human-driven design exploration
• Improves PPA and productivity across many nodes and multiple end-applications including consumer, hyperscale computing, 5G communications, automotive and mobile design

SAN JOSE, Calif., July 22, 2021—Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the delivery of the Cadence Cerebrus Intelligent Chip … Read More → "Cadence Extends Digital Design Leadership with Revolutionary ML-based Cerebrus, Delivering Best-in-class Productivity and Quality of Results"

Avishtech To Join Altium’s Nexar Partner Ecosystem

SAN DIEGO, July 22, 2021: Avishtech, a leading provider of innovative EDA stack-up and 2D field solver solutions, has joined Altium’s Nexar partner ecosystem. Avishtech joins a growing list of Nexar partner organizations, including Arduino, Arrow, Diotech, Keysight Technologies, Microchip, Samtec, and Ultra Librarian.

Nexar software partners are growing their businesses while transforming the electronics design, development, and manufacturing process from isolated toolchains and disconnected processes into a streamlined, next-generation workflow that is connected by a comprehensive data model for printed circuit boards. Nexar software partners connect mechanical CAD, CAM, CAE, PLM, and other applications that are relevant … Read More → "Avishtech To Join Altium’s Nexar Partner Ecosystem"

CEVA Continues to Lead the Way in Wireless Connectivity with Bluetooth® 5.3 IP

ROCKVILLE, MD, July 22, 2021 – CEVA, Inc. (NASDAQ: CEVA), the leading licensor of wireless connectivity and smart sensing technologies, today announced the general release of its RivieraWaves Bluetooth 5.3 IP. Supporting a multitude of features to further enhance security, robustness and low power operation, the RivieraWaves Bluetooth 5.3 IP is now available as a complete hardware/software solution for new designs and as a software-only upgrade for compatible existing designs.

As the de-facto standard for Audio Streaming and short range IoT connectivity, Bluetooth device shipments are expected to approach 5 billion units annually by 2022 and surpass 6 billion units annually by 2025, according to … Read More → "CEVA Continues to Lead the Way in Wireless Connectivity with Bluetooth® 5.3 IP"

ICL88xx family of single-stage flyback controllers with constant voltage output optimized for cost-effective smart LED drivers

Munich, Germany – 21 July 2021 – Cost-effective dimmable and intelligent LED systems are expected to increase the market share disproportionately in the coming years. Introducing the ICL8800ICL8810 and ICL8820 single-stage flyback LED controllers for constant output voltages, Infineon Technologies … Read More → "ICL88xx family of single-stage flyback controllers with constant voltage output optimized for cost-effective smart LED drivers"

Unilumin and STMicroelectronics Jointly Develop LED Display Using ST’s 60GHz Contactless Connectivity Chip for Advanced Video Solutions

China, July 21, 2021 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, and Unilumin, a leader in LED displays based in China, today announced that they have worked together to develop a new Unilumin display using the ST60A2, ST’s 60GHz RF transceiver for advanced high-data-rate contactless-transfer solutions.</ … Read More → "Unilumin and STMicroelectronics Jointly Develop LED Display Using ST’s 60GHz Contactless Connectivity Chip for Advanced Video Solutions"

Winbond’s Successful Interoperability of OctalNAND Flash with Synopsys DesignWare AMBA IP Delivers Complete High-Density NAND Flash Memory Solution

Taichung, Taiwan – 2021-07-21 – Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced the successful interoperability of Synopsys’ DesignWare Synchronous Serial Interface (SSI) IP and Winbond’s OctalNAND Flash Memory. The DesignWare SSI IP, offering high transfer rates and low latency in serial flash memories and OctalNAND Flash deliver a complete NAND flash memory solution for automotive, mobile and IoT SoCs, enabling faster adoption of octal non-volatile memories (NVM) with high-speed read bandwidth in densities up to 4Gbit.

As the world’s first x8 Octal interface NAND Flash, Winbond’ … Read More → "Winbond’s Successful Interoperability of OctalNAND Flash with Synopsys DesignWare AMBA IP Delivers Complete High-Density NAND Flash Memory Solution"

featured blogs
Jul 22, 2021
The HotFix 019 (QIR 3, indicated as 2021.1 in the application splash screens) update for OrCAD® and Allegro® is now available at Cadence Downloads . This blog post contains important links... [[ Click on the title to access the full blog on the Cadence Community si...
Jul 21, 2021
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Jul 21, 2021
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Jul 9, 2021
Do you have questions about using the Linux OS with FPGAs? Intel is holding another 'Ask an Expert' session and the topic is 'Using Linux with Intel® SoC FPGAs.' Come and ask our experts about the various Linux OS options available to use with the integrated Arm Cortex proc...