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element14 Community Launches ThinkON Design Challenge with ON Semiconductor

Chicago, September 17, 2019 – element14.com, an Avnet community, is teaming up with ON Semiconductor and Hackster.io to inspire developers to create innovative solutions to everyday problems as part of the ThinkON Design Challenge. Both element14 and Hackster.io community members are invited to design the most creative solution utilizing the ON Semiconductor RSL10 Sensor Development Kit (RSL10-SENSE-GEVK). Example projects could include solutions to monitor … Read More → "element14 Community Launches ThinkON Design Challenge with ON Semiconductor"

Green Hills Software Demonstrates DAL A Application Running Across Multiple Processor Cores

SANTA BARBARA, CA — September 17, 2019 — Green Hills Software, the worldwide leader in high-assurance operating systems, today announced that it is demonstrating its bound multi-processing (BMP) and symmetric multi-processing (SMP) capabilities of the Read More → "Green Hills Software Demonstrates DAL A Application Running Across Multiple Processor Cores"

Curtiss-Wright, Green Hills, and L3Harris Technologies Demo FACE™ Conformant Software Running on 7th Generation Intel Xeon Platform

U.S. Air Force-hosted FACE™ & SOSA™ Expo & Technical Interchange Meeting (TIM), DAYTON, Ohio (Booth #14) – Sept 17, 2019 Curtiss-Wright’s Defense Solutions division, in collaboration with L3Harris Technologies and Green Hills Software (GHS), has publicly demonstrated the first working example of a FACE-conformant operating system (OS) and FACE-conformant software application running on a 7th Generation Intel® (Kaby Lake) Xeon™ processor. The demo featured L3Harris Technologies’ popular FACE-conformant FliteScene Digital Moving Map software running on top of GHS’s industry-leading and FACE-conformant INTEGRITY-178 tuMP™ real-time multicore OS.

RiCool Chassis Platform from Pixus Technologies Features 9-slot or 16-slot OpenVPX 6U Backplanes

Waterloo, Ontario  —  Sept 17, 2019 –  Pixus Technologies, a provider of embedded computing and enclosure solutions, has announced a new RiCool chassis configurations for 9-slot and 16-slot OpenVPX backplanes in the 6U height.   

The RiCool OpenVPX chassis platform line from Pixus provides powerful and reliable cooling for high-CFM requirements.   The front-to-rear cooled 9U tall enclosure pulls air from an intake area below the card cage and blows the heat ninety degrees out the rear.  The dual fans are hot swappable and … Read More → "RiCool Chassis Platform from Pixus Technologies Features 9-slot or 16-slot OpenVPX 6U Backplanes"

Launch of world’s smallest digital IR proximity sensing module paves way to smaller, lighter, always-available earbuds

Premstaetten, Austria (16 September, 2019) — ams (SIX: AMS), a leading worldwide supplier of high performance sensor solutions, today launches the world’s smallest digital proximity sensor module. The ultra-small package of the TMD2635 occupies just 1mm3 of volume and enables audio manufacturers of True Wireless Stereo (TWS) earbud products to develop smaller, lighter industrial design earbuds. The IR proximity sensor enables wireless earbud in-and-out of ear detection to help extend battery life between chargings and can be used in tandem with another TMD2635 to enable elementary touchless gesture control without the need for buttons.

The TMD2635 module from  … Read More → "Launch of world’s smallest digital IR proximity sensing module paves way to smaller, lighter, always-available earbuds"

Core Avionics & Industrial Inc. Announces Industry’s First Single Board Computer Hardware IP Based on NXP LX2160 and Arm that is Designed for DO-254 DAL A Certification and Aligned with the Latest SOSA and HOST Standards

FACE Technology Interchange Meeting (TIM), Dayton, Ohio, September 17, 2019: Core Avionics & Industrial Inc. (“CoreAVI”) announced today the release of its new rugged SBC0003 COTS 3U VPX NXP® LX2160-based Single Board Computer hardware design IP with Arm architecture. CoreAVI’s COTS-D product line, part of CoreAVI’s Platforms for Safety Critical Applications (PSCA), enables customers with IP, including design source files and required DO-254 certification evidence, to allow them to immediately manufacture and certify SBCs and graphics modules. The SBC0003’s low powered, high performance characteristics offer an evolution from the last family of Power Architecture processors to new … Read More → "Core Avionics & Industrial Inc. Announces Industry’s First Single Board Computer Hardware IP Based on NXP LX2160 and Arm that is Designed for DO-254 DAL A Certification and Aligned with the Latest SOSA and HOST Standards"

SmartDV Announces Availability of Ethernet TSN Design IP

SAN JOSE, CALIF –– September 17, 2019 –– SmartDV™ Technologies, the Proven and Trusted choice for Design and Verification Intellectual Property (IP), today announced its Design IP for the Ethernet Time-Sensitive Networking (TSN) protocol, an update to the IEEE standard for time-sensitive transmission of data over Ethernet networks.

“The traditional Ethernet protocol was designed to deliver data reliably but not to a specific time standard,” remarks Deepak Kumar Tala, managing director of SmartDV. For safety … Read More → "SmartDV Announces Availability of Ethernet TSN Design IP"

Sensera Partners with Autodesk to Exhibit 3D IoT Positioning Solution

 

  • Autodesk selects Sensera to demonstrate its real-time 3D location services and smart sensor visualization at Autodesk’s Boston Technology Center as part of its Residency Program
  • Sensera’s installation will showcase a new technology capability which automatically ties sensor readings to their 3D positions
  • With more than 1,000 visitors to the Center each week, Sensera gains a unique opportunity to pitch an entire system that can be sold as a service to potential customers and partners in the Company’s industrial and manufacturing target markets

Carlton, VIC, … Read More → "Sensera Partners with Autodesk to Exhibit 3D IoT Positioning Solution"

Renesas Electronics Showcases Latest Optical Communication Solutions at ECOC 2019

Düsseldorf, September 17, 2019 – Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced it will highlight its newest technologies for data center and telecom applications in booth #278 at the European Conference on Optical Communication (ECOC) in Dublin, Ireland, September 23-25, 2019.
At ECOC, Renesas technical experts will showcase a variety of product solutions … Read More → "Renesas Electronics Showcases Latest Optical Communication Solutions at ECOC 2019"
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