Nexperia launches miniaturized leadless logic ICs to save space and enhance reliability in automotive applications
Nijmegen, 5 December, 2024: Nexperia introduced today a new portfolio of logic ICs in tiny automotive-qualified MicroPak XSON5 leadless packaging. Miniaturized logic ICs are essential for space constrained applications including sophisticated automotive applications such as chassis safety systems, battery monitoring, infotainment units, and advanced driver assistance systems (ADAS). MicroPak XSON5 is a thermally enhanced plastic enclosure with a 75% smaller PCB footprint than traditional leaded mini logic packages, that also features side-wettable flanks to support automated optical inspection (AOI) of solder joints.
This release reinforces Nexperia’s leadership position in the logic industry with innovative packaging that meets the growing … Read More → "Nexperia launches miniaturized leadless logic ICs to save space and enhance reliability in automotive applications"