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i-ToF imager based on Infineon’s novel pixel technology boosts 3D camera system performance at optimized cost

Munich, Germany –  1 December, 2022 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) in cooperation with 3D Time-of-Flight specialist and premium partner pmdtechnologies is introducing the IRS2975C imager sensor, a performance-push evolution of the IRS2875C. The imager works according to the Time-of-Flight (ToF) principle known as indirect ToF (i-ToF) and is the first in the industry based on Infineon’s latest advancements in pixel technology. Both form factor and the performance of the IRS2975C are tailored to the growing spot iToF applications, delivering highest possible operating range at optimal power budget. The … Read More → "i-ToF imager based on Infineon’s novel pixel technology boosts 3D camera system performance at optimized cost"

STMicroelectronics and Soitec cooperate on SiC substrate manufacturing technology

  • Agreement to qualify Soitec technology for future 200mm SiC substrate production
  • Key enabling semiconductor technology supports the transition to electric mobility and improved energy efficiency of industrial systems

Geneva (Switzerland) and Bernin (France), December 1, 2022 — STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, and Soitec (Euronext Paris), a leader in designing and manufacturing innovative semiconductor materials, announce the next stage of their cooperation on Silicon Carbide (SiC) substrates, with the qualification of Soitec’s SiC substrate technology by ST planned over the next 18 … Read More → "STMicroelectronics and Soitec cooperate on SiC substrate manufacturing technology"

HARTING USA, From flat PCBs to miniature implantable 3D-Circuits

The most remarkable aspect of technology is its constant development and improvement. Slimmer laptops, smaller phones, and medical devices designed to be unobtrusive and barely visible to the naked eye. Can I use 3D-Circuits to outperform the flat PCBs?

As electronic devices continue to evolve and shrink, so do their circuits and, ultimately, their components. This development has raised the demand for component miniaturization.

3D-Circuits or also called 3D-MID (three-dimensional mechatronic integrated devices</ … Read More → "HARTING USA, From flat PCBs to miniature implantable 3D-Circuits"

Melexis unveils the most versatile dual latch & switch

Tessenderlo, Belgium, 1 December 2022 – Melexis launches the MLX92352, a universal programmable 3-axis latch & switch targeting relative position and speed sensing. It provides magnetic flexibility and pitch independent dual outputs that can be set as speed, pulse or direction. With its unmatched EMC and ESD performance, this stand-alone PCB-less device saves space and total module cost for automotive and industrial applications.

The MLX92351 (pre-programmed) and MLX92352 (programmable) are quadrature output devices, which accurately determine rotational speed and direction in motor systems. The 90° phase shift between the 2 outputs provides customers with pitch and air gap independence, resulting in magnetic … Read More → "Melexis unveils the most versatile dual latch & switch"

Advantest Unveils E5620 DR-SEM for Review and Classification of Ultra-Small Photomask Defects

TOKYO, Dec. 01, 2022 (GLOBE NEWSWIRE) — Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) today unveiled the E5620 Defect Review Scanning Electron Microscope (DR-SEM), its newest mask SEM product for reviewing and classifying ultra-small defects on photomasks and mask blanks. With its high-accuracy, high-throughput defect review capability, the E5620 DR-SEM is expected to contribute appreciably to production quality improvements in next-generation photomasks and shorter mask manufacturing turnaround times.

Like its predecessor, the E5620 implements Advantest’s highly stable image capture technology to easily import defect location data from mask … Read More → "Advantest Unveils E5620 DR-SEM for Review and Classification of Ultra-Small Photomask Defects"

Honeywell And Nexceris Work To Improve Safety For Electric Vehicles

Making Sense of Coercivity in Magnetic Materials with Machine Learning

Coercivity is a physical property of magnetic materials that has much importance in the optimization of energy efficiency in various applications, such as electric motors. However, it is difficult to analyze using the currently available theories, since they cannot account for the material’s defects and other types of inhomogeneities. To tackle this, scientists combined data science, materials informatics, and an extension of the Ginzburg–Landau model to explain how coercivity arises from microstructures in magnetic materials.
 
Soft magnetic materials, i.e., materials that can be easily magnetized and demagnetized, play an essential … Read More → "Making Sense of Coercivity in Magnetic Materials with Machine Learning"

Pusan National University Researchers Introduce an Energy-Efficient Method to Enhance Thermal Conductivity of Polymer Composites

Thermally conductive polymer composites consist of fillers oriented in certain directions that form pathways for heat flow. However, conventional methods to control the orientation of these fillers are energy-intensive and require surface modifications that can deteriorate the quality and properties of these materials. Now, researchers from South Korea have developed an energy-efficient method to control the orientation of the fillers without the need for surface modification, resulting in improvement in thermal conductivity.
 
Owing to their lightweight nature and flexibility, thermally conductive polymer composites are applied between a heat source and a sink in … Read More → "Pusan National University Researchers Introduce an Energy-Efficient Method to Enhance Thermal Conductivity of Polymer Composites"
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