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Elliptic Labs’ AI Platform Now Optimized for Ceva’s NeuPro-Nano NPU – Enabling Smarter Edge Devices

Oslo, Norway and ROCKVILLE, MD., June 10, 2025 – Elliptic Labs (OSE: ELABS), a global AI software company and the world leader in AI Virtual Smart Sensors™ currently deployed in over half a billion devices, and Ceva, Inc. (NASDAQ: CEVA), the leading licensor of silicon and software IP that enables Smart Edge devices to connect, sense and infer data more reliably and efficiently, today announced a collaboration to … Read More → "Elliptic Labs’ AI Platform Now Optimized for Ceva’s NeuPro-Nano NPU – Enabling Smarter Edge Devices"

IAR platform boosts embedded development with upgraded toolchains for Arm and RISC-V

June 10, 2025 – Uppsala, Sweden – IAR, a global leader in software solutions for embedded systems, has launched a major update of its flagship toolchains: IAR toolchains for Arm version 9.70 and for RISC-V version 3.40. These modern toolchains significantly enhance the cloud-enabled IAR platform with new capabilities in performance, safety, and automation to support agile, scalable embedded applications in automotive, industrial, medical, and IoT markets.

Built to meet the increasing complexity of embedded systems, the latest IAR toolchains offer cloud-based licensing, CI/CD pipeline integration, and multi-architecture support. As Arm and … Read More → "IAR platform boosts embedded development with upgraded toolchains for Arm and RISC-V"

Infineon introduces XENSIV™ TLE4802SC16-S0000 with inductive sensing for higher accuracy and performance

Munich, Germany – 10 June 2025 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is launching the XENSIV™ TLE4802SC16-S0000, an inductive sensor designed to enhance performance in automotive chassis applications. The sensor enables high-precision torque and angle measurements with robust stray field robustness, supporting digital output via SENT or SPC protocols. It achieves highly accurate sensing without needing additional shielding. Tailored for use in electric power steering systems, including torque and steering angle sensors, as well as pedal and suspension applications, the sensor offers both flexibility and reliability.

The XENSIV TLE4802SC16 … Read More → "Infineon introduces XENSIV™ TLE4802SC16-S0000 with inductive sensing for higher accuracy and performance"

Redefining Wireless Connectivity: Leankon’s Advanced WiFi 6E & WiFi 7 Dipole Antenna Solutions

Leankon, a global leader in innovative antenna solutions, is dedicated to simplifying antenna technologies for customers worldwide. We are proud to introduce our latest advancements in WiFi 6E and WiFi 7 flexible dipole antennas, setting a new standard in performance and design adaptability. 

Enhance Wireless Connectivity

Our compact dipole antennas offer unparalleled performance, designed for seamless integration across Bluetooth 2.4GHz and WiFi 6E/WiFi 7 triple-bands (2.4/5/6GHz). With versatile cable routing solutions, they empower product designers to … Read More → "Redefining Wireless Connectivity: Leankon’s Advanced WiFi 6E & WiFi 7 Dipole Antenna Solutions"

Revealing space-saving, high-frequency digital automotive audio amplifiers for smart-cockpit applications

STMicroelectronics has revealed new class-D automotive audio amplifiers for smart-cockpit applications, engineered for tiny overall dimensions and with a digital input that simplifies circuit design.

The new HFDA80D and HFDA90D extend ST’s family of high-frequency automotive amplifiers, complementing the HFA80A analog-input IC. All the devices operate at a switching frequency of 2MHz to save PCB space and lower the bill of materials. Also containing … Read More → "Revealing space-saving, high-frequency digital automotive audio amplifiers for smart-cockpit applications"

AI-powered Engineering through Seamless CADx Integration

The Franco-German software developer CoreTechnologie has entered into a cooperation with the AI-driven engineering intelligence platform Leo AI from Cambridge, USA. The strategic technology integration of the new partners enables advanced AI-powered analysis of CADx data on the Leo AI platform through CoreTechnologie’s embedded software development kit (SDK) 3D_Kernel_IO.

Automated Analysis

By integrating the SDK into the Leo AI platform, native CAD files from 3D Experience, NX, Creo, Solidworks and neutral formats such as Step and JT are analysed and interpreted using artificial intelligence (AI). The … Read More → "AI-powered Engineering through Seamless CADx Integration"

Zuken Vitech Announces GENESYS 2025: Advancing Interoperability and Usability in Model-Based Systems Engineering

BLACKSBURG, VA, USA, June 10, 2025 – Zuken Vitech, a leading provider of model-based systems engineering (MBSE) solutions, is proud to announce the release of GENESYS 2025, the latest evolution of its flagship systems engineering platform. This release delivers significant new capabilities that enhance model organization, promote interoperability, and streamline the adoption of key industry standards.

Model Organization with Containment for Greater Interoperability

At the core of GENESYS 2025 is the introduction of containment, a new approach to model organization that … Read More → "Zuken Vitech Announces GENESYS 2025: Advancing Interoperability and Usability in Model-Based Systems Engineering"

Curtiss-Wright Adds Digital Video Encoder Module to Industry-Leading Axon Family of Compact Flight Test Instrumentation System Building Blocks

ETTC 2025 EUROPEAN TEST AND TELEMETRY CONFERENCE (Booth #10-1)  – TOULOUSE, FRANCE – June 10, 2025 – Read More → "Curtiss-Wright Adds Digital Video Encoder Module to Industry-Leading Axon Family of Compact Flight Test Instrumentation System Building Blocks"
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