System Design
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When Safety is King, NAND Reigns Supreme

In this week’s episode of Fish Fry, we investigate the changing role of NAND flash in safety-based systems. Dave Hughes (CEO – HCC Embedded) joins us to discuss HCC’s “Safety Element out of Context” embedded software approach and how HCC helping engineers better use NAND flash in safety systems. Also this week, we give everyone another chance to win a “Hitchhiker’s Guide … Read More → "When Safety is King, NAND Reigns Supreme"

Microsemi Joins RISC-V Love Fest with SoC FPGA

Processors and FPGAs go together like chocolate and peanut butter, but it took a few years to get the recipe just right. Early turn-of-the-millennium attempts included the Xilinx Virtex II Pro with an on-chip PowerPC processor core and Altera’s Excalibur device with an ARM922T processor core. These early products are considered market failures. Actually, Kevin Morris called the Altera Excalibur “a monumental flop” in his article titled “< … Read More → "Microsemi Joins RISC-V Love Fest with SoC FPGA"

The Spirit of 42

What do Douglas Adams, PCB design, DRAM for cryptocurrency, and the fourth Industrial Revolution have in common? This week’s episode of Amelia’s Weekly Fish Fry, of course! First up, Greg Roberts (EMA Design Automation) brings us the goods on EMA’s new ebook called “The Hitchhiker’s Guide to PCB Design”. Next, Mark Greenberg (Cadence Design Systems) and I chat about using DRAM4 for artificial … Read More → "The Spirit of 42"

What Will Replace DRAM and NAND, and When?

Long, long ago, back when Richard Nixon was president of the United States of America, magnetic cores were the dominant computer memory technology. In fact, magnetic cores were essentially the only practical memory technology for two decades. Although we had hand-woven rope memory for ROM, only the Apollo space computers and the HP 9100 desktop calculator used it. My 1954 “Britannica Book of the Year”—a real book, … Read More → "What Will Replace DRAM and NAND, and When?"

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featured blogs
Jan 17, 2019
After two interesting blogs by Yagya Mishra that explained the most popular features of the Run Plan assistant in Virtuoso® ADE Assembler , I am writing this third blog in the series to share... [[ Click on the title to access the full blog on the Cadence Community site...
Jan 16, 2019
112 Gbps Samtec Flyover'„¢ Demo Samtec'€™s Ralph Page walks us through a live demonstration of a Samtec Flyover'„¢ system which enables 112 Gbps PAM4 performance. The Credo CDR generates two ports of 31-bit PRBS data at 112 Gbps PAM4 data rates. The signal travels from...
chalk talks
SimSurfing — Murata and Mouser Electronics   Choosing the right passives for your design can be a huge headache. Sorting through hundreds of data sheets looking for the component with just the right specs, balancing against your BOM requirements, and confirming availability can consume valuable engineering time. In this episode of Chalk Talk, Amelia Dalton chats with Arthur Evans of … Read More → "SimSurfing — Murata and Mouser Electronics"
STRIPT™ Connectors — AVX and Mouser Electronics   There are numerous situations where a solderless connection to a PCB would save time, space, BOM cost, and engineering frustration. However, most designers still resort to sticking an expensive connector on their PCB where one is not really needed. In this episode of Chalk Talk, Amelia Dalton chats with Tom Anderson of AVX … Read More → "STRIPT™ Connectors — AVX and Mouser Electronics"
RedFit IDC SKEDD Connector — Wurth Electronics and Mouser Electronics  Why attach a header connector to your PCB when you really don’t need one? If you’re plugging a ribbon cable into your board, particularly for a limited-use function such as provisioning, diagnostics, or testing, it can be costly and clunky to add a header connector to your BOM, and introduce yet another component to … Read More → "RedFit IDC SKEDD Connector — Wurth Electronics and Mouser Electronics"
RedExpert — Wurth Electronics and Mouser Electronics  Choosing the right passive for your design can be a maddening voyage through datasheets, internet searches, and endless matching and comparing of component specs. Finding just the right inductor or capacitor often becomes an exercise in drudgery. In this episode of Chalk Talk, Amelia Dalton chats with Hebberly Ahatlan of Wurth Electronics about RedExpert … Read More → "RedExpert — Wurth Electronics and Mouser Electronics"
What is Intel® Optane™ Technology? — Mouser Electronics and Intel  Memory architecture is often the biggest bottleneck in a high-performance system design. The gap between high-speed DRAM and higher-capacity non-volatile memory sits at an inconvenient place on the cost-performance curve. In this episode of Chalk Talk, Amelia Dalton chats with Jeffrey Galinovsky of Intel about how new Intel technologies including Intel® Optane™ memory technology … Read More → "What is Intel® Optane™ Technology? — Mouser Electronics and Intel"
A New Advanced IC Packaging Battlefield  Today, advanced packaging technology has created a new battleground where 2.5D packaging and heterogeneous design drive constraints that span semiconductor, packaging, board, and even system-level design. In this episode of Chalk Talk, Amelia Dalton chats with John Park of Cadence Design Systems about new techniques and tools for advanced IC packaging design. Click here … Read More → "A New Advanced IC Packaging Battlefield"