fish fry
Subscribe Now

When Safety is King, NAND Reigns Supreme

How HCC Embedded is Changing the Flash Memory Landscape

In this week’s episode of Fish Fry, we investigate the changing role of NAND flash in safety-based systems. Dave Hughes (CEO – HCC Embedded) joins us to discuss HCC’s “Safety Element out of Context” embedded software approach and how HCC helping engineers better use NAND flash in safety systems. Also this week, we give everyone another chance to win a “Hitchhiker’s Guide to PCB Design” T-shirt!

 

 

Click here and download this episode

Links for December 14, 2018

More information about Embedded HCC

Feature Article by Bryon Moyer: Communication Solves Flash Unpredictability – HCC Embedded Launches a Failsafe Flash Translation Layer

Enter to win a  “The Hitchhiker’s Guide to PCB Design” T-Shirt!

 

Click here to check out the Fish Fry Archive.

Click here to subscribe to Fish Fry via Podbean

Click here to get the Fish Fry RSS Feed

Click here to subscribe to Fish Fry via iTunes.

Fish Fry Executive Interviews

Anupam Bakshi, CEO – Agnisys

Dave Kleidermacher, CTO – Green Hills Software

Robert Blake, CEO – Achronix

Jack Harding, CEO – eSilicon

Michiel Ligthart, COO – Verific

Adnan Hamid, CEO – Breker Technologies

Simon Davidmann, CEO – Imperas

Ted Miracco, CEO – SmartFlow Compliance Solutions

Jessica Gomez – Rogue Valley Microdevices

Shishpal Rawat, Chairman – Accellera Systems Initiative

Kevin Bromber, CEO – myDevices

Daniel Hansson, CEO – Verifyter

Mark Papermaster, CTO – AMD

David Fried, CTO – Coventor

Dr. Steven LeBoeuf, President – Valencell

David Dutton, CEO – Silvaco

Bob Niemiec, CEO – TwistThink

Allan Martinson, COO – Starship Technologies

Zhihong Liu, Chairman and CEO – ProPlus Solutions

Taher Madraswala, CEO and President – Open-Silicon

Kapil Shankar, CEO and Director – AnDAPT

Dan Fox, CTO – Local Motors

 

 

Leave a Reply

featured blogs
May 19, 2022
The current challenge in custom/mixed-signal design is to have a fast and silicon-accurate methodology. In this blog series, we are exploring the Custom IC Design Flow and Methodology stages. This... ...
May 19, 2022
Learn about the AI chip design breakthroughs and case studies discussed at SNUG Silicon Valley 2022, including autonomous PPA optimization using DSO.ai. The post Key Highlights from SNUG 2022: AI Is Fast Forwarding Chip Design appeared first on From Silicon To Software....
May 12, 2022
By Shelly Stalnaker Every year, the editors of Elektronik in Germany compile a list of the most interesting and innovative… ...
Apr 29, 2022
What do you do if someone starts waving furiously at you, seemingly delighted to see you, but you fear they are being overenthusiastic?...

featured video

EdgeQ Creates Big Connections with a Small Chip

Sponsored by Cadence Design Systems

Find out how EdgeQ delivered the world’s first 5G base station on a chip using Cadence’s logic simulation, digital implementation, timing and power signoff, synthesis, and physical verification signoff tools.

Click here for more information

featured paper

5 common Hall-effect sensor myths

Sponsored by Texas Instruments

Hall-effect sensors can be used in a variety of automotive and industrial systems. Higher system performance requirements created the need for improved accuracy and more integration – extending the use of Hall-effect sensors. Read this article to learn about common Hall-effect sensor misconceptions and see how these sensors can be used in real-world applications.

Click to read more

featured chalk talk

224 Gbps Data Rates: Separating Fact from Fiction

Sponsored by Samtec

Data rates are getting faster with each passing year. In this episode of Chalk Talk, Amelia Dalton chats with Matthew Burns from Samtec to separate fact from fiction when it comes to 224 Gbps data rates. They take a closer look at the design challenges, the tradeoffs, and architectural decisions that we will need to consider when designing a 224 Gbps design. They also investigate the variety of interconnect solutions that Samtec offers for your next 224 Gbps design.

Click here for more information about Silicon-to-Silicon Application Solutions from Samtec