New Memory Architectures for SoCs and Multi-Die Systems
Before we dive headfirst into the fray with gusto and abandon (and aplomb, of course), let’s briefly remind ourselves as to the current state-of-play on the chiplet and multi-die systems front. Let’s start with the fact that artificial intelligence (AI) and machine learning (ML) are becoming pervasive and ubiquitous. Let’s also remind ourselves that we create our systems using a variety of processing elements, including CPUs, GPUs, NPUs, TPUs, and other hardware accelerators.
The way we design devices like ASICs, ASSPs, and SoCs today is that we purchase intellectual property ( … Read More → "New Memory Architectures for SoCs and Multi-Die Systems"