fish fry
Subscribe Now

The Problem is Exponential: The Value of Pre-silicon Verification and Pre-silicon Hardware Debug

In this week’s Fish Fry Podcast, Paul Cunningham (Cadence Design Systems) joins me to discuss why pre-silicon verification and pre-silicon hardware debug are crucial to today’s advanced SoC designs. We dig into the details of Cadence’s Palladium Z2 Enterprise Emulation and Protium X2 Enterprise Prototyping systems and take a closer look at how these systems can optimize workload distribution between verification, validation and pre-silicon software bring-up.

Click here to download this episode

 

Links for May 21, 2021

Cadence Unveils Next-Generation Palladium Z2 and Protium X2 Systems to Dramatically Accelerate Pre-Silicon Hardware Debug and Software Validation

Chalk Talk: Cloud Computing for Electronic Design (Are We There Yet?)

 

Click here to check out the Fish Fry Archive.

Click here to subscribe to Fish Fry via Podbean

Click here to get the Fish Fry RSS Feed

Click here to subscribe to Fish Fry via Apple Podcasts.

Click here to subscribe to Fish Fry via Spotify

 

Fish Fry Executive Interviews

Anupam Bakshi, CEO – Agnisys

Dave Kleidermacher, CTO – Green Hills Software

Robert Blake, CEO – Achronix

Jack Harding, CEO – eSilicon

Michiel Ligthart, COO – Verific

Adnan Hamid, CEO – Breker Technologies

Simon Davidmann, CEO – Imperas

Jessica Gomez – Rogue Valley Microdevices

Shishpal Rawat, Chairman – Accellera Systems Initiative

Kevin Bromber, CEO – myDevices

Daniel Hansson, CEO – Verifyter

Mark Papermaster, CTO – AMD

David Fried, CTO – Coventor

Dr. Steven LeBoeuf, President – Valencell

David Dutton, CEO – Silvaco

Bob Niemiec, CEO – TwistThink

Allan Martinson, COO – Starship Technologies

Zhihong Liu, Chairman and CEO – ProPlus Solutions

Taher Madraswala, CEO and President – Open-Silicon

Kapil Shankar, CEO and Director – AnDAPT

Dan Fox, CTO – Local Motors

Lawrence Cooke, Founder and CEO — NovaSolix

Gregg Recupero, CTO — Performance-IP

Alan Grau, CEO — Icon Labs

Carl Alberty, Vice President – Cirrus Logic

Maximilian Odendahl, CEO — Silexica

Finbarr Moynihan, General Manager — MediaTek

Sanjay Pillay, CEO — Austemper

Louis Parks, CEO – SecureRF

Harold Blomquist, CEO – Helix Semiconductor

Dale Dougherty and Sherry Huss, Co-Founders – Maker Faire

David Su, CEO – Atomic Technologies

featured blogs
Mar 4, 2024
The current level of computing power is unprecedented. It has led to the development of advanced computational techniques that enable us to simulate larger systems and predict complex phenomena with greater accuracy. However, the simulation of turbomachinery systems still pos...
Mar 1, 2024
Explore standards development and functional safety requirements with Jyotika Athavale, IEEE senior member and Senior Director of Silicon Lifecycle Management.The post Q&A With Jyotika Athavale, IEEE Champion, on Advancing Standards Development Worldwide appeared first ...
Feb 28, 2024
Would it be better to ride the railways on people-powered rail bikes, or travel to the edge of space in a luxury lounge hoisted by a gigantic balloon?...

featured video

Tackling Challenges in 3DHI Microelectronics for Aerospace, Government, and Defense

Sponsored by Synopsys

Aerospace, Government, and Defense industry experts discuss the complexities of 3DHI for technological, manufacturing, & economic intricacies, as well as security, reliability, and safety challenges & solutions. Explore DARPA’s NGMM plan for the 3DHI R&D ecosystem.

Learn more about Synopsys Aerospace and Government Solutions

featured paper

Reduce 3D IC design complexity with early package assembly verification

Sponsored by Siemens Digital Industries Software

Uncover the unique challenges, along with the latest Calibre verification solutions, for 3D IC design in this new technical paper. As 2.5D and 3D ICs redefine the possibilities of semiconductor design, discover how Siemens is leading the way in verifying complex multi-dimensional systems, while shifting verification left to do so earlier in the design process.

Click here to read more

featured chalk talk

Package Evolution for MOSFETs and Diodes
Sponsored by Mouser Electronics and Vishay
A limiting factor for both MOSFETs and diodes is power dissipation per unit area and your choice of packaging can make a big difference in power dissipation. In this episode of Chalk Talk, Amelia Dalton and Brian Zachrel from Vishay investigate how package evolution has led to new advancements in diodes and MOSFETs including minimizing package resistance, increasing power density, and more! They also explore the benefits of using Vishay’s small and efficient PowerPAK® and eSMP® packages and the migration path you will need to keep in mind when using these solutions in your next design.
Jul 10, 2023
27,144 views