In this week’s episode of Fish Fry, Judy Warner gives us a special sneak peek into this year’s AltiumLive PCB Design Summit. Judy and I discuss the details of this third annual PCB design conference, how the goals of this conference have evolved over the years, and why Judy hopes this event will become the PCB Village Square of the EE industry. Also this week, we investigate … Read More → "PCB Town Square"
Evolution takes center stage this week’s episode of Fish Fry! To start things off, I investigate how a baby ostrich and a robotic dinosaur on a treadmill might have just helped solve the mystery of the evolution of avian flight. Next, I chat with Rob Persons (Artseyn Embedded Technologies) about the evolution of tactical systems and the role encryption will play … Read More → "Survival of the Fittest"
It’s an idea rooted in the very identity of the products that the semiconductor industry puts out: the integrated circuit (or IC). For decades, our job has been to take lots of things that used to exist as separate components – transistors, resistors, capacitors, and such – and build them all in close proximity on a single monolithic piece of silicon.
The 2019 Design Automation Conference (DAC) is in Las Vegas and our EE Journal team is on the scene to learn about recent developments and trends, and new products and technologies in the design and automation of electronic systems.
What do Moore’s Law, the Von Neuman Bottleneck, and alpha-band brain activity have in common?! This week’s episode of Amelia’s Weekly Fish Fry! Matthew Burns (Samtec) joins us to discuss how we can prepare for the next wave of high speed fabrics in embedded computing and why these new faster fabrics will make our design lives harder not easier. … Read More → "Faster Interconnect! Go! Go!"
Moore’s Law said that we could double the number of transistors on an integrated circuit every two years. But there were a lot of variables in that equation. For example, the industry has always assumed that an “integrated circuit” was a single, 2D monolithic silicon chip. But Moore’s Law didn’t make that distinction. It also didn’t specify an area for the silicon … Read More → "Intel FOVEROS 3D Packaging"
