What do Moore’s Law, the Von Neuman Bottleneck, and alpha-band brain activity have in common?! This week’s episode of Amelia’s Weekly Fish Fry! Matthew Burns (Samtec) joins us to discuss how we can prepare for the next wave of high speed fabrics in embedded computing and why these new faster fabrics will make our design lives harder not easier. … Read More → "Faster Interconnect! Go! Go!"
Moore’s Law said that we could double the number of transistors on an integrated circuit every two years. But there were a lot of variables in that equation. For example, the industry has always assumed that an “integrated circuit” was a single, 2D monolithic silicon chip. But Moore’s Law didn’t make that distinction. It also didn’t specify an area for the silicon … Read More → "Intel FOVEROS 3D Packaging"
‘Twas the night before Christmas, when all through the lab
Not a tech was stirring, not even in the fab;
The daughter cards were hung by their headers with care,
In hopes that St. VPX soon would be there;
In this week’s episode of Fish Fry, we are diving deep into the world of VPX. Dave Caserza, Michael Munroe, Ovidiu Mesesan ( … Read More → "Clear and Present Signals"
Before becoming professional engineers, most of us designed and built things as a hobby. It’s rare to find an engineer who jumped right into engineering school without at least some background of tinkering and experimenting. And, when we did those projects, we had full control. We could choose whatever part we wanted or needed. We didn’t have to deal with management, manufacturing, … Read More → "Who Chooses Components and Tools?"
What do Douglas Adams, PCB design, DRAM for cryptocurrency, and the fourth Industrial Revolution have in common? This week’s episode of Amelia’s Weekly Fish Fry, of course! First up, Greg Roberts (EMA Design Automation) brings us the goods on EMA’s new ebook called “The Hitchhiker’s Guide to PCB Design”. Next, Mark Greenberg (Cadence Design Systems) and I chat about using DRAM4 for artificial … Read More → "The Spirit of 42"
As electronic system design has evolved, the practice of designing in specialized silos has broken down. Challenges such as signal integrity for multi-gigabit signals has forced co-design that spans every level of design from system to board to package to IC. Other issues, including thermal, power, RF, EM, and many more, have exacerbated this effect. As much as we wish we could just design our PCB … Read More → "Validate Twice, Build Once"
