fish fry
Subscribe Now

Calling All Chiplets! Eliyan and the Ultimate Chiplet Interconnect

My podcast this week is all about chiplets, chiplet interconnects, and the Bunch of Wires (BoW) chiplet interconnect architecture! My guests hail from Eliyan – who is leading the pack when it comes to chiplet interconnect technology. Ramin Farjadrad (Co-founder and CEO), Patrick Soheili (Co-founder & Head of Business and Corporate Development) and Syrus Ziai (Co-founder & VP of Engineering) join me this week for a deep-dive into the world of chiplets and chiplet interconnects!

 

Click here to download this episode

 

Links for February 3, 2023

More information about Eliyan 

Eliyan Closes $40M Series A Funding Round and Unveils Industry’s Highest Performance Chiplet Interconnect Technologies

Chiplet Pioneer Eliyan Joins UCIe and JEDEC Industry Standardization Organizations, Expands Veteran Leadership Team to Accelerate Adoption of Breakthrough Die-to-Die Interconnect Solution

 

Click here to check out the Fish Fry Archive.

Click here to subscribe to Fish Fry via Podbean

Click here to get the Fish Fry RSS Feed

Click here to subscribe to Fish Fry via Apple Podcasts

Click here to subscribe to Fish Fry via Spotify

 

Fish Fry Executive Interviews

Anupam Bakshi, CEO – Agnisys

Dave Kleidermacher, CTO – Green Hills Software

Robert Blake, CEO – Achronix

Jack Harding, CEO – eSilicon

Michiel Ligthart, COO – Verific

Simon Davidmann, CEO – Imperas

Jessica Gomez – Rogue Valley Microdevices

Shishpal Rawat, Chairman – Accellera Systems Initiative

Kevin Bromber, CEO – myDevices

Daniel Hansson, CEO – Verifyter

Mark Papermaster, CTO – AMD

David Fried, CTO – Coventor

Dr. Steven LeBoeuf, President – Valencell

David Dutton, CEO – Silvaco

Bob Niemiec, CEO – TwistThink

Allan Martinson, COO – Starship Technologies

Zhihong Liu, Chairman and CEO – ProPlus Solutions

Taher Madraswala, CEO and President – Open-Silicon

Kapil Shankar, CEO and Director – AnDAPT

Dan Fox, CTO – Local Motors

Kim Rowe, Founder and CEO — RoweBots

Lawrence Cooke, Founder and CEO — NovaSolix

Gregg Recupero, CTO — Performance-IP

Alan Grau, CEO — Icon Labs

Carl Alberty, Vice President – Cirrus Logic

Maximilian Odendahl, CEO — Silexica

Finbarr Moynihan, General Manager — MediaTek

Sanjay Pillay, CEO — Austemper

Louis Parks, CEO – SecureRF

Harold Blomquist, CEO – Helix Semiconductor

Dale Dougherty and Sherry Huss, Co-Founders – Maker Faire

David Su, CEO – Atomic Technologies

Mung Chiang, EVP and Dean of Engineering College – Purdue University

Clay Johnson, CEO – CacheQ

Andy Hock, Vice President, Product – Cerebras Systems

Dan Goehl, Co-founder and Chief Business Officer – UltraSense Systems

Charlie Green, Chief Operating & Technical Officer – Powercast

3 thoughts on “Calling All Chiplets! Eliyan and the Ultimate Chiplet Interconnect”

  1. While title is hinting at some revolutionary revelation, article is devoid of any useful information.

    As they say, it’s chke full of information as much as shit is full of vitamines.

    Bla blaa blaa, “high bandwith”, blaa bla “low energy for transfer” blaa blah…

    And great connecting story. Imagine that. Industry was stupid, so
    they needed “out of a box thinker” to come up with an idea that shrinking dimensions would make things faster, less expensive etc etc.
    Wowza! Total shocker!

Leave a Reply

featured blogs
Sep 28, 2023
See how we set (and meet) our GHG emission reduction goals with the help of the Science Based Targets initiative (SBTi) as we expand our sustainable energy use.The post Synopsys Smart Future: Our Climate Actions to Reduce Greenhouse Gas Emissions appeared first on Chip Des...
Sep 21, 2023
Not knowing all the stuff I don't know didn't come easy. I've had to read a lot of books to get where I am....

featured video

TDK PowerHap Piezo Actuators for Ideal Haptic Feedback

Sponsored by TDK

The PowerHap product line features high acceleration and large forces in a very compact design, coupled with a short response time. TDK’s piezo actuators also offers good sensing functionality by using the inverse piezo effect. Typical applications for the include automotive displays, smartphones and tablet.

Click here for more information about PowerHap Piezo Actuators

featured paper

Intel's Chiplet Leadership Delivers Industry-Leading Capabilities at an Accelerated Pace

Sponsored by Intel

We're proud of our long history of rapid innovation in #FPGA development. With the help of Intel's Embedded Multi-Die Interconnect Bridge (EMIB), we’ve been able to advance our FPGAs at breakneck speed. In this blog, Intel’s Deepali Trehan charts the incredible history of our chiplet technology advancement from 2011 to today, and the many advantages of Intel's programmable logic devices, including the flexibility to combine a variety of IP from different process nodes and foundries, quicker time-to-market for new technologies and the ability to build higher-capacity semiconductors

To learn more about chiplet architecture in Intel FPGA devices visit: https://intel.ly/47JKL5h

featured chalk talk

The Next Generation of Switching Regulator
Sponsored by Mouser Electronics and RECOM
Power modules can bring a variety of benefits to electronic system design including reduced board space, shorter time to market and easier sourcing of materials. In this episode of Chalk Talk, Amelia Dalton and Louis Bouche from RECOM discuss the benefits of RECOM’s switching regulators, the details of their advanced 3D power packaging and how you can leverage RECOM’s expertise with your next design.
Jan 9, 2023
32,432 views