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Calling All Chiplets! Eliyan and the Ultimate Chiplet Interconnect

My podcast this week is all about chiplets, chiplet interconnects, and the Bunch of Wires (BoW) chiplet interconnect architecture! My guests hail from Eliyan – who is leading the pack when it comes to chiplet interconnect technology. Ramin Farjadrad (Co-founder and CEO), Patrick Soheili (Co-founder & Head of Business and Corporate Development) and Syrus Ziai (Co-founder & VP of Engineering) join me this week for a deep-dive into the world of chiplets and chiplet interconnects!

 

Click here to download this episode

 

Links for February 3, 2023

More information about Eliyan 

Eliyan Closes $40M Series A Funding Round and Unveils Industry’s Highest Performance Chiplet Interconnect Technologies

Chiplet Pioneer Eliyan Joins UCIe and JEDEC Industry Standardization Organizations, Expands Veteran Leadership Team to Accelerate Adoption of Breakthrough Die-to-Die Interconnect Solution

 

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Fish Fry Executive Interviews

Anupam Bakshi, CEO – Agnisys

Dave Kleidermacher, CTO – Green Hills Software

Robert Blake, CEO – Achronix

Jack Harding, CEO – eSilicon

Michiel Ligthart, COO – Verific

Simon Davidmann, CEO – Imperas

Jessica Gomez – Rogue Valley Microdevices

Shishpal Rawat, Chairman – Accellera Systems Initiative

Kevin Bromber, CEO – myDevices

Daniel Hansson, CEO – Verifyter

Mark Papermaster, CTO – AMD

David Fried, CTO – Coventor

Dr. Steven LeBoeuf, President – Valencell

David Dutton, CEO – Silvaco

Bob Niemiec, CEO – TwistThink

Allan Martinson, COO – Starship Technologies

Zhihong Liu, Chairman and CEO – ProPlus Solutions

Taher Madraswala, CEO and President – Open-Silicon

Kapil Shankar, CEO and Director – AnDAPT

Dan Fox, CTO – Local Motors

Kim Rowe, Founder and CEO — RoweBots

Lawrence Cooke, Founder and CEO — NovaSolix

Gregg Recupero, CTO — Performance-IP

Alan Grau, CEO — Icon Labs

Carl Alberty, Vice President – Cirrus Logic

Maximilian Odendahl, CEO — Silexica

Finbarr Moynihan, General Manager — MediaTek

Sanjay Pillay, CEO — Austemper

Louis Parks, CEO – SecureRF

Harold Blomquist, CEO – Helix Semiconductor

Dale Dougherty and Sherry Huss, Co-Founders – Maker Faire

David Su, CEO – Atomic Technologies

Mung Chiang, EVP and Dean of Engineering College – Purdue University

Clay Johnson, CEO – CacheQ

Andy Hock, Vice President, Product – Cerebras Systems

Dan Goehl, Co-founder and Chief Business Officer – UltraSense Systems

Charlie Green, Chief Operating & Technical Officer – Powercast

3 thoughts on “Calling All Chiplets! Eliyan and the Ultimate Chiplet Interconnect”

  1. While title is hinting at some revolutionary revelation, article is devoid of any useful information.

    As they say, it’s chke full of information as much as shit is full of vitamines.

    Bla blaa blaa, “high bandwith”, blaa bla “low energy for transfer” blaa blah…

    And great connecting story. Imagine that. Industry was stupid, so
    they needed “out of a box thinker” to come up with an idea that shrinking dimensions would make things faster, less expensive etc etc.
    Wowza! Total shocker!

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