My podcast this week is all about chiplets, chiplet interconnects, and the Bunch of Wires (BoW) chiplet interconnect architecture! My guests hail from Eliyan – who is leading the pack when it comes to chiplet interconnect technology. Ramin Farjadrad (Co-founder and CEO), Patrick Soheili (Co-founder & Head of Business and Corporate Development) and Syrus Ziai (Co-founder & VP of Engineering) join me this week for a deep-dive into the world of chiplets and chiplet interconnects!
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While title is hinting at some revolutionary revelation, article is devoid of any useful information.
As they say, it’s chke full of information as much as shit is full of vitamines.
Bla blaa blaa, “high bandwith”, blaa bla “low energy for transfer” blaa blah…
And great connecting story. Imagine that. Industry was stupid, so
they needed “out of a box thinker” to come up with an idea that shrinking dimensions would make things faster, less expensive etc etc.
Wowza! Total shocker!