fish fry
Subscribe Now

Automation and the Future of IC Design for Test

What do IC design for test, the Tessent multi-die software solution and the best semiconductor material of all time have in common? This week’s podcast of course! My guest Vidya Neerkundar (Siemens) and I discuss trends in the IC industry today, the unique testing challenges for today’s cutting edge integrated circuits and why automation for 2D and 3D IC design-for-test is the way of the future. Also this week, I investigate a new semiconductor material that is being called the best of all time.

Click here to download this episode

 

Links for December 2, 2022

More information about Tessent Multi-die software

The best semiconductor of them all? (MIT News)

High ambipolar mobility in cubic boron arsenide (Science)

 

Click here to check out the Fish Fry Archive.

Click here to subscribe to Fish Fry via Podbean

Click here to get the Fish Fry RSS Feed

Click here to subscribe to Fish Fry via Apple Podcasts

Click here to subscribe to Fish Fry via Spotify

 

Fish Fry Executive Interviews

Anupam Bakshi, CEO – Agnisys

Dave Kleidermacher, CTO – Green Hills Software

Robert Blake, CEO – Achronix

Jack Harding, CEO – eSilicon

Michiel Ligthart, COO – Verific

Simon Davidmann, CEO – Imperas

Jessica Gomez – Rogue Valley Microdevices

Shishpal Rawat, Chairman – Accellera Systems Initiative

Kevin Bromber, CEO – myDevices

Daniel Hansson, CEO – Verifyter

Mark Papermaster, CTO – AMD

David Fried, CTO – Coventor

Dr. Steven LeBoeuf, President – Valencell

David Dutton, CEO – Silvaco

Bob Niemiec, CEO – TwistThink

Allan Martinson, COO – Starship Technologies

Zhihong Liu, Chairman and CEO – ProPlus Solutions

Taher Madraswala, CEO and President – Open-Silicon

Kapil Shankar, CEO and Director – AnDAPT

Dan Fox, CTO – Local Motors

Kim Rowe, Founder and CEO — RoweBots

Lawrence Cooke, Founder and CEO — NovaSolix

Gregg Recupero, CTO — Performance-IP

Alan Grau, CEO — Icon Labs

Carl Alberty, Vice President – Cirrus Logic

Maximilian Odendahl, CEO — Silexica

Finbarr Moynihan, General Manager — MediaTek

Sanjay Pillay, CEO — Austemper

Louis Parks, CEO – SecureRF

Harold Blomquist, CEO – Helix Semiconductor

Dale Dougherty and Sherry Huss, Co-Founders – Maker Faire

David Su, CEO – Atomic Technologies

Mung Chiang, EVP and Dean of Engineering College – Purdue University

Clay Johnson, CEO – CacheQ

Andy Hock, Vice President, Product – Cerebras Systems

Dan Goehl, Co-founder and Chief Business Officer – UltraSense Systems

Charlie Green, Chief Operating & Technical Officer – Powercast

 

 

Leave a Reply

featured blogs
Jan 27, 2023
Wow, it's already the last Friday in January, so time for one of my monthly update posts where I cover anything that doesn't justify its own full post or which is an update to something I wrote about earlier. Automotive Security I have written about automotive secur...
Jan 26, 2023
By Slava Zhuchenya Software migration can be a dreaded endeavor, especially for electronic design automation (EDA) tools that design companies… ...
Jan 24, 2023
We explain embedded magnetoresistive random access memory (eMRAM) and its low-power SoC design applications as a non-volatile memory alternative to SRAM & Flash. The post Why Embedded MRAMs Are the Future for Advanced-Node SoCs appeared first on From Silicon To Software...
Jan 19, 2023
Are you having problems adjusting your watch strap or swapping out your watch battery? If so, I am the bearer of glad tidings....

featured video

Synopsys 224G & 112G Ethernet PHY IP OIF Interop at ECOC 2022

Sponsored by Synopsys

This Featured Video shows four demonstrations of the Synopsys 224G and 112G Ethernet PHY IP long and medium reach performance, interoperating with third-party channels and SerDes.

Learn More

featured chalk talk

Enabling the Flow of Data in the World of IoT

Sponsored by Mouser Electronics and YAGEO Group

At the heart of our growing IoT ecosystem are high performance semiconductors, but integrated circuits alone cannot make a successful IoT system. In this episode of Chalk Talk, Amelia Dalton chats with Peter Blais from KEMET and Ryan Wenzelman from Pulse about how passive components are crucial to the development of successful IoT frameworks. They take a closer look at RF, wired and power distribution aspects of IoT system development and investigate how YAGEO Group is advancing innovation in the world of IoT with a wide selection of passive components.

Click here for more information about Pulse Electronics World of IoT