fish fry
Subscribe Now

The Trials and Tribulations of Connectivity Integration (and How Taoglas can Help!)

My special guest this week is Dermot O’Shea, CEO of Taoglas! Dermot and I discuss the biggest design and development challenges engineers face today when integrating connectivity into their designs, how Taoglas can speed up time to market for IoT designs and the educational resources included in the Taoglas AntennaXpert.

 

 

Links for August 15, 2025

More information about Taoglas

Subscribe to O’Shea Insights, Taoglas’ Monthly Newsletter

Taoglas LinkedIn

 

Click here to check out the Fish Fry Archive.

Click here to subscribe to Fish Fry via Podbean

Click here to get the Fish Fry RSS Feed

Click here to subscribe to Fish Fry via Apple Podcasts

Click here to subscribe to Fish Fry via Spotify

 

Fish Fry Executive Interviews

David Mayman, CEO – Mayman Aerospace 

Anupam Bakshi, CEO – Agnisys

Dave Kleidermacher, CTO – Green Hills Software

Robert Blake, CEO – Achronix

Jack Harding, CEO – eSilicon

Michiel Ligthart, COO – Verific

Simon Davidmann, CEO – Imperas

Jessica Gomez – Rogue Valley Microdevices

Shishpal Rawat, Chairman – Accellera Systems Initiative

Kevin Bromber, CEO – myDevices

Daniel Hansson, CEO – Verifyter

Mark Papermaster, CTO – AMD

David Fried, CTO – Coventor

Dr. Steven LeBoeuf, President – Valencell

David Dutton, CEO – Silvaco

Bob Niemiec, CEO – TwistThink

Allan Martinson, COO – Starship Technologies

Zhihong Liu, Chairman and CEO – ProPlus Solutions

Taher Madraswala, CEO and President – Open-Silicon

Kapil Shankar, CEO and Director – AnDAPT

Dan Fox, CTO – Local Motors

Kim Rowe, Founder and CEO — RoweBots

Lawrence Cooke, Founder and CEO — NovaSolix

Gregg Recupero, CTO — Performance-IP

Alan Grau, CEO — Icon Labs

Carl Alberty, Vice President – Cirrus Logic

Maximilian Odendahl, CEO — Silexica

Finbarr Moynihan, General Manager — MediaTek

Sanjay Pillay, CEO — Austemper

Louis Parks, CEO – SecureRF

Harold Blomquist, CEO – Helix Semiconductor

Dale Dougherty and Sherry Huss, Co-Founders – Maker Faire

David Su, CEO – Atomic Technologies

Mung Chiang, EVP and Dean of Engineering College – Purdue University

Clay Johnson, CEO – CacheQ

Andy Hock, Vice President, Product – Cerebras Systems

Dan Goehl, Co-founder and Chief Business Officer – UltraSense Systems

Charlie Green, Chief Operating & Technical Officer – Powercast

Mike Johnson, Co-Founder and CTO – SEOPS

Peter Himes, CSO – 4DS Memory

Shahram Mossayebi,  Founder and CEO – Crypto Quantique

Ritu Favre, President – Emerson Test and Measurement 

Larry Richenstein, Founder and CEO – WePower

David Pearah, CEO – SpiderOak

Giovanni Garcea, President – AnDAPT

Bill Lamie, CEO – PX5 RTOS and RTOSX

 

Leave a Reply

featured blogs
Dec 8, 2025
If you're yearning for a project that reconnects you with the roots of our digital age, grab a soldering iron and prepare to party like it's 1979!...

featured news

Need Faster VNX+ Development? Elma Just Built the First Lab Platform for It

Sponsored by Elma Electronic

Struggling to evaluate VNX+ modules or build early prototypes? Elma Electronic’s new 3-slot FlexVNX+ dev chassis streamlines bring-up, testing, and system integration for VNX+ payload cards—SOSA-aligned, lab-ready, and built for fast time-to-market.

Click here to read more

featured chalk talk

STCC4 CO2 Sensor: Enabling Healthy Air in Every Home
Sponsored by Mouser Electronics and Sensirion
In this episode of Chalk Talk, Dr. Kaitlin Howell from Sensirion and Amelia Dalton explore the correlation between ventilation and carbon dioxide sensing and how the features of Sensirion’s STCC4 CO2 Sensor can enable air condition monitoring with ease.
Dec 10, 2025
5,520 views