The increasing complexity of chip designs that leverage 3D-IC technology , heterogeneous integration, and other manufacturing advancements emphasizes the need for accurate modeling of electromagnetic (EM) crosstalk. EM solvers continue to play a key role in solving larger pro...

In the ever-evolving world of technology, it is crucial for professionals to stay updated with the latest advancements. The Allegro X Update training is a resource to keep you updated with the latest in PCB Design. This training is designed to equip you with comprehensive kno...

Maintaining proper signal integrity is one of the most critical considerations in chiplet design. As chipmakers push the boundaries of performance and miniaturization, ensuring clean, reliable signals between components has become more challenging than ever. For engineers nav...

The rise of AI and multi-die systems has pushed traditional simulation methods to their limits, making it harder to meet the computational demands of advanced chiplet-based designs. As part of Cadence's Xcelium Logic Simulator, the new Xcelium Distributed Simulation App ...

Join me, Sandeep Nasa, Senior Principal Education Application Engineer, in our free technical training webinar and discover how the Cadence Protium X3 simplifies your debugging process. We'll show you how FullVision on Protium X3 lets you dump all design signals at once,...

By Shaleen Bhabu, AE Director ASK and Ronen Stilkol, AE Architect In the rapidly evolving world of semiconductor design, signoff challenges are growing due to increasing complexity, shrinking technology, a rising number of transistors, and the adoption of 3D-IC. Additionally,...

Space exploration has always been a frontier driven by precision and innovation. Among the critical components of space launchers are turbopumps , which ensure the seamless and efficient flow of propellants to rocket engines, enabling the incredible thrust necessary to escape...

In recent posts, we've explored the foundational aspects of Time-of-Flight (ToF) technology and the critical role of Tensilica Vision DSPs in efficiently processing and decoding ToF sensor data. We then delved into how Artificial Intelligence (AI) significantly enhances ...

The challenges for 3D IC design are greater than standard chip design - but they are not insurmountable. In this episode of Chalk Talk, Amelia Dalton chats with Vinay Patwardhan from Cadence Design Systems about the variety of challenges faced by 3D IC designers today and how Cadence’s integrated, high-capacity Integrity 3D IC Platform, with its 3D design planning and implementation cockpit, flow manager and co-design capabilities will not only help you with your next 3D IC design.

With increasing design sizes, complexity of advanced nodes, and faster time to market requirements - design teams are looking for scalability, simplicity, flexibility and agility. In today’s Chalk Talk, Amelia Dalton chats with Mahesh Turaga about the details of Cadence’s end to end cloud portfolio, how you can extend your on-prem environment with the push of a button with Cadence’s new hybrid cloud and Cadence’s Cloud solutions you can help you from design creation to systems design and more.

New applications and technology are driving demand for even more compute and functionality in the devices we use every day. System on chip (SoC) designs are quickly migrating to new process nodes, and rapidly growing in size and complexity. In this episode of Chalk Talk, Amelia Dalton chats with Rod Metcalfe about how machine learning combined with distributed computing offers new capabilities to automate and scale RTL to GDS chip implementation flows, enabling design teams to support more, and increasingly complex, SoC projects.

When your project is at crunch time, a shortage of server capacity can bring your schedule to a crawl. But, the rest of the year, having a bunch of extra servers sitting around idle can be extremely expensive. Cloud-based EDA lets you have exactly the compute resources you need, when you need them. In this episode of Chalk Talk, Amelia Dalton chats with Craig Johnson of Cadence Design Systems about Cadence’s cloud-based EDA solutions.

Learn how Switch, a leading designer, builder, and operator of U.S. exascale data centers, is taking their data center’s cooling capabilities even further. In the past 20 years, Switch has built some of the densest air-cooled data center environments. With AI taking off in the last couple of years, see how they were able to deploy many of the first NVIDIA H100 clusters inside using Cadence’s Reality Digital Twin Platform for pre-modeling, design, and validation.facilities.

Deploying data centers with AI high-density workloads and ensuring they are capable for anticipated power trends requires insight. Creating a digital twin using the Cadence Reality Digital Twin Platform helped plan the deployment of current workloads and future-proof the investment. Learn about the collaboration between NV5, NVIDIA, and Cadence to optimize data center efficiency, performance, and reliability. 

Larsen & Toubro built the world’s largest FIFA stadium in Qatar, the world’s tallest statue, and one of the world’s most sophisticated cricket stadiums. Their latest business venture? Designing data centers. Since IT equipment in data centers generates a lot of heat, it’s important to have an efficient and effective cooling system. Learn why, Larsen & Toubro use Cadence Reality DC Design Software for simulation and analysis of the cooling system.

In the AI era, as the signal-data rate increases, the signal integrity challenges in server designs also increase. Wiwynn provides hyperscale data centers with innovative cloud IT infrastructure, bringing the best total cost of ownership (TCO), energy, and energy-itemized IT solutions from the cloud to the edge.