Our new AI-powered custom design solution, Virtuoso Studio, leverages our 30 years of industry knowledge and leadership, providing innovative features, reimagined infrastructure for unrivaled productivity, and new levels of integration that stretch beyond classic design bound...

Our new AI-powered custom design solution, Virtuoso Studio, leverages our 30 years of industry knowledge and leadership, providing innovative features, reimagined infrastructure for unrivaled productivity, and new levels of integration that stretch beyond classic design bound...

Labforge is a Waterloo, Ontario-based company that designs, builds, and manufactures smart cameras used in industrial automation and defense applications. By bringing artificial intelligence (AI) into their vision systems with Cadence , they can automate tasks that are diffic...

The Design Automation Conference (DAC) recently celebrated its 60th anniversary in San Francisco with an outstanding lineup of speakers and presentations. Academic, research, government, and industry attendees participated in robust research and engineering tracks, hands-on t...

When designing an electric drivetrain, it's important to ensure the system is reliable and free from overheating and breakdowns. To achieve this, simulating the system before building any physical prototypes can provide valuable insights into the performance of the drive...

The newest version of Fine Marine offers critical enhancements that improve solver performances and sharpen the C-Wizard’s capabilities even further. Check out the highlights: γ-ReθTransition Model and Extension for Crossflow Modeling We have boosted our modeling capabili...

In the Cadence Live Silicon Valley presentation on From Chips to Chillers: Electronics Cooling Through to Sustainability , Sherman Ikemoto , System Sales Group Director for the Cadence Digital Twin platform, discusses the sustainable methods for electronics cooling using Cade...

The Allegro SKILL coding language offers capabilities to create user-friendly graphical user interfaces (GUIs) for an enhanced user experience. The extensive collection of Allegro SKILL widgets enables the creation of sophisticated GUI components for various design tasks. Usi...

The challenges for 3D IC design are greater than standard chip design - but they are not insurmountable. In this episode of Chalk Talk, Amelia Dalton chats with Vinay Patwardhan from Cadence Design Systems about the variety of challenges faced by 3D IC designers today and how Cadence’s integrated, high-capacity Integrity 3D IC Platform, with its 3D design planning and implementation cockpit, flow manager and co-design capabilities will not only help you with your next 3D IC design.

With increasing design sizes, complexity of advanced nodes, and faster time to market requirements - design teams are looking for scalability, simplicity, flexibility and agility. In today’s Chalk Talk, Amelia Dalton chats with Mahesh Turaga about the details of Cadence’s end to end cloud portfolio, how you can extend your on-prem environment with the push of a button with Cadence’s new hybrid cloud and Cadence’s Cloud solutions you can help you from design creation to systems design and more.

New applications and technology are driving demand for even more compute and functionality in the devices we use every day. System on chip (SoC) designs are quickly migrating to new process nodes, and rapidly growing in size and complexity. In this episode of Chalk Talk, Amelia Dalton chats with Rod Metcalfe about how machine learning combined with distributed computing offers new capabilities to automate and scale RTL to GDS chip implementation flows, enabling design teams to support more, and increasingly complex, SoC projects.

When your project is at crunch time, a shortage of server capacity can bring your schedule to a crawl. But, the rest of the year, having a bunch of extra servers sitting around idle can be extremely expensive. Cloud-based EDA lets you have exactly the compute resources you need, when you need them. In this episode of Chalk Talk, Amelia Dalton chats with Craig Johnson of Cadence Design Systems about Cadence’s cloud-based EDA solutions.

Predicting the probability of failed ICs has become difficult with aggressive process scaling and large-volume manufacturing. Learn how key EDA simulator technologies and methodologies enable fast (minimum number of simulations) and accurate high-sigma analysis.

As high-speed connectors become more prevalent in various applications, PCB design teams face the challenge of optimizing the interface between high-speed connectors and PCBs with varying stack-ups and route densities. To succeed, design teams need to address this problem using highly accurate 3D finite element method (FEM) field solvers. This application note presents an innovative workflow that streamlines the engineering time and effort required to address this design challenge within PCBs.

Join us for an insightful conversation about the complex world of chip design and how AI-driven verification is shaping the future of electronic design. Product Engineer Matt Graham shares how Cadence is leveraging the power of AI to boost productivity and improve the efficiency of electronic design. Cadence is revolutionizing the field with AI-driven verification, providing faster, more accurate, and more comprehensive verification results.

The Cadence® Celsius™ EC Solver supports electronics system designers in managing the most challenging thermal/electronic cooling problems quickly and accurately. By utilizing a powerful computational engine and meshing technology, designers can model and analyze the fluid flow and heat transfer of even the most complex electronic system and ensure the electronic cooling system is reliable.