Hard to believe it's already December and 11/12ths of a year's worth of CFD is behind us. And with the holidays looming, it's uncertain how many more editions of This Week in CFD are...

The annual Design Automation Conference (DAC) is coming up December 5th to 9th, next week. It is in-person in San Francisco's Moscone Center West. It will be available virtually from December...

Components, or parts, are the basic building blocks of a PCB design. It is of utmost importance that the components present in the design, their graphics, electrical, and part definitions, match the...

Another six months have passed since we posted our last blog on Layout Verification. We are now happy to introduce some new videos around this topic especially around the next generation parasitic...

Creating an environment of respect and appreciation for one another is a core element of Cadence’s culture. On Veterans Day, and all month long, we showed our gratitude for our Veteran employees,...

Because of the Thanksgiving break (and me taking the whole week off), I skipped the regular November Update post, but suddenly there is so much semiconductor news that I'm doing it out of band...

The newest release of the Cadence Omnis CFD environment is available now and brings better project and file management, more geometry repair tools, multi-block structured meshing and faster Turbo and...

The System Analysis Knowledge Bytes blog series explores the capabilities and potential of the System Analysis tools offered by Cadence®. In addition to providing insight into the useful...

New applications and technology are driving demand for even more compute and functionality in the devices we use every day. System on chip (SoC) designs are quickly migrating to new process nodes, and rapidly growing in size and complexity. In this episode of Chalk Talk, Amelia Dalton chats with Rod Metcalfe about how machine learning combined with distributed computing offers new capabilities to automate and scale RTL to GDS chip implementation flows, enabling design teams to support more, and increasingly complex, SoC projects.

When your project is at crunch time, a shortage of server capacity can bring your schedule to a crawl. But, the rest of the year, having a bunch of extra servers sitting around idle can be extremely expensive. Cloud-based EDA lets you have exactly the compute resources you need, when you need them. In this episode of Chalk Talk, Amelia Dalton chats with Craig Johnson of Cadence Design Systems about Cadence’s cloud-based EDA solutions.

Bridging the gap from the AI and data science world to the RTL and hardware design world can be challenging. High-level synthesis (HLS) can provide a mechanism to get from AI frameworks like TensorFlow into synthesizable RTL, enabling the development of high-performance inference architectures. In this episode of Chalk Talk, Amelia Dalton chats with Dave Apte of Cadence Design Systems about doing AI design with HLS.

Electrical-thermal co-simulation can dramatically improve the system design process, allowing thermal design adaptation to be done much earlier. The Cadence Celsius Thermal Solver is a complete electrical-thermal co-simulation solution for the full hierarchy of electronic systems from ICs to physical enclosures. In this episode of Chalk Talk, Amelia Dalton chats with CT Kao of Cadence Design Systems about how the Celsius Thermal Solver can help detect and mitigate thermal issues early in the design process.

Validate your most sophisticated SoC designs before silicon and stay on schedule. Full system verification and early software development is possible with Cadence Palladium and Protium Dynamic Duo for IP/SoC verification, hardware and software regressions, full system verification, and early software development.

Designing an always-on system that needs to conserve battery life? Need to also include hands-free voice control for your users? Watch this video to learn how you can reduce the energy consumption of devices with small batteries and provide a solution for a greener world with the Cadence® Tensilica® HiFi 1 DSP family.

3D stacking of ICs is emerging as a preferred solution for chip designers facing a slowdown in Moore’s Law and the rising costs of advanced nodes. However, chip stacking creates new complexities, with extra considerations required for the mechanical, electrical, and thermal aspects of the whole stacked system. Watch this video for an overview of Cadence® Integrity™ 3D-IC, a comprehensive platform for 3D planning, implementation, and system analysis, enabling system-driven PPA for multi-chiplet designs.

3D-ICs are expected to have a broad impact on networking, graphics, AI/ML, and high-performance computing. While there’s interest in 3D-ICs, it’s still in its early phases. Standard definitions are lacking, the supply chain ecosystem is in flux, and design, analysis, verification, and test challenges need to be resolved. Read this white paper to learn about 3D integration and packaging of multiple stacked dies, design challenges, ecosystem requirements, and needed solutions.