Operation Data Capture: Solving the Challenges of Battlefield Big Data and Mission Critical AI
by Amelia Dalton
In this week’s podcast, I investigate edge-based data capture and AI computing in military programs with David Freeman (Mercury) and Randy Hayes (VAST Data Federal). We discuss the challenges involved with big data, mission critical AI and machine learning applications in rugged environments and how a new data center-class, all-flash network-attached storage system can help solve these issues. Also this week, I check out a new autonomous off-road combat vehicle developed by DARPA that can drive as fast as a human driver and navigate extremely rugged terrain.
Why is Design for Testability (DFT) crucial for VLSI (Very Large Scale Integration) design? Keeping testability in mind when developing a chip makes it simpler to find structural flaws in the chip and make necessary design corrections before the product is shipped to users. T...
See how we're harnessing generative AI throughout our suite of EDA tools with Synopsys.AI Copilot, the world's first GenAI capability for chip design.The post Meet Synopsys.ai Copilot, Industry's First GenAI Capability for Chip Design appeared first on Chip Design....
Review the top 3 FAQs (Frequently Asked Questions) regarding TDK’s CLT32 power inductors. Learn why these tiny power inductors address the most demanding reliability challenges of ADAS and AD power management.
While there is great interest in 3D-IC technology, it is still in its early phases. Standard definitions are lacking, the supply chain ecosystem is in flux, and design, analysis, verification, and test challenges need to be resolved. Read this paper to learn about design challenges, ecosystem requirements, and needed solutions. While various types of multi-die packages have been available for many years, this paper focuses on 3D integration and packaging of multiple stacked dies.
In this episode of Chalk Talk, Amelia Dalton and Kengo Ohmori from ROHM Semiconductor examine the details and benefits of ROHM Semiconductor’s new lineup of EcoGaN™ Power Stage ICs that can reduce the component count by 99% and the power loss of your next design by 55%. They also investigate ROHM’s Ultra-High-Speed Control IC Technology called Nano Pulse Control that maximizes the performance of GaN devices.