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Managing the Massive Data Throughput: AI-Based Designs and The Value of NoC Tiling

My podcast guest this week is Andy Nightingale, Vice President Product Management & Marketing at Arteris. Andy and I chat about the key challenge faced by SoC designers when building NoC interconnects for AI based designs, the details of NoC interconnect IP soft tiling and some real world examples of AI based designs that benefit from NoC IP soft tiling. Also this week, I check out how odor detection by the silkworm moth could improve localization technologies in robotics.

 

 

Links for December 6, 2024

More information about Arteris

Arteris AI/ML Solutions

Accelerate AI SoC Designs with NoC Tiling Overview 

Arteris Announces NoC Tiling Innovation

Arteris FlexNoC non-coherent network-on-chip IP

Arteris Ncore cache coherent network-on-chip IP

Study Uncovers How Silkworm Moth’s Odor Detection May Improve Robotics (Chiba University)

Olfactory sampling volume for pheromone capture by wing fanning of silkworm moth: a simulation-based study (scientific reports)

 

 

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Simon Davidmann, CEO – Imperas

Jessica Gomez – Rogue Valley Microdevices

Shishpal Rawat, Chairman – Accellera Systems Initiative

Kevin Bromber, CEO – myDevices

Daniel Hansson, CEO – Verifyter

Mark Papermaster, CTO – AMD

David Fried, CTO – Coventor

Dr. Steven LeBoeuf, President – Valencell

David Dutton, CEO – Silvaco

Bob Niemiec, CEO – TwistThink

Allan Martinson, COO – Starship Technologies

Zhihong Liu, Chairman and CEO – ProPlus Solutions

Taher Madraswala, CEO and President – Open-Silicon

Kapil Shankar, CEO and Director – AnDAPT

Dan Fox, CTO – Local Motors

Kim Rowe, Founder and CEO — RoweBots

Lawrence Cooke, Founder and CEO — NovaSolix

Gregg Recupero, CTO — Performance-IP

Alan Grau, CEO — Icon Labs

Carl Alberty, Vice President – Cirrus Logic

Maximilian Odendahl, CEO — Silexica

Finbarr Moynihan, General Manager — MediaTek

Sanjay Pillay, CEO — Austemper

Louis Parks, CEO – SecureRF

Harold Blomquist, CEO – Helix Semiconductor

Dale Dougherty and Sherry Huss, Co-Founders – Maker Faire

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Mung Chiang, EVP and Dean of Engineering College – Purdue University

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Peter Himes, CSO – 4DS Memory

 

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