fish fry
Subscribe Now

A Billion Instances and Counting – Solving the Challenges of IC Design Closure

Integrated circuits once again take center stage in this week’s Fish Fry podcast! Brandon Bautz (Cadence Design Systems) and I chat about the challenges of IC design closure today, how distribution and optimization can help address these growing design challenges, and the details of the Cadence® Certus™ Closure Solution. Also this week I investigate a new soft robot developed by Cornell University that can detect damage and heal itself!

Click here to download this episode

 

Links for December 16, 2022

More information about Cadence® Certus™ Closure Solution

New Youtube Playlist: Robotics on Amelia’s Weekly Fish Fry 

Soft robot detects damage and heals itself (Cornell Chronicle)

Autonomous self-healing optical sensors for damage intelligent soft-bodied systems (Science)

 

Click here to check out the Fish Fry Archive.

Click here to subscribe to Fish Fry via Podbean

Click here to get the Fish Fry RSS Feed

Click here to subscribe to Fish Fry via Apple Podcasts

Click here to subscribe to Fish Fry via Spotify

 

Fish Fry Executive Interviews

Anupam Bakshi, CEO – Agnisys

Dave Kleidermacher, CTO – Green Hills Software

Robert Blake, CEO – Achronix

Jack Harding, CEO – eSilicon

Michiel Ligthart, COO – Verific

Simon Davidmann, CEO – Imperas

Jessica Gomez – Rogue Valley Microdevices

Shishpal Rawat, Chairman – Accellera Systems Initiative

Kevin Bromber, CEO – myDevices

Daniel Hansson, CEO – Verifyter

Mark Papermaster, CTO – AMD

David Fried, CTO – Coventor

Dr. Steven LeBoeuf, President – Valencell

David Dutton, CEO – Silvaco

Bob Niemiec, CEO – TwistThink

Allan Martinson, COO – Starship Technologies

Zhihong Liu, Chairman and CEO – ProPlus Solutions

Taher Madraswala, CEO and President – Open-Silicon

Kapil Shankar, CEO and Director – AnDAPT

Dan Fox, CTO – Local Motors

Kim Rowe, Founder and CEO — RoweBots

Lawrence Cooke, Founder and CEO — NovaSolix

Gregg Recupero, CTO — Performance-IP

Alan Grau, CEO — Icon Labs

Carl Alberty, Vice President – Cirrus Logic

Maximilian Odendahl, CEO — Silexica

Finbarr Moynihan, General Manager — MediaTek

Sanjay Pillay, CEO — Austemper

Louis Parks, CEO – SecureRF

Harold Blomquist, CEO – Helix Semiconductor

Dale Dougherty and Sherry Huss, Co-Founders – Maker Faire

David Su, CEO – Atomic Technologies

Mung Chiang, EVP and Dean of Engineering College – Purdue University

Clay Johnson, CEO – CacheQ

Andy Hock, Vice President, Product – Cerebras Systems

Dan Goehl, Co-founder and Chief Business Officer – UltraSense Systems

Charlie Green, Chief Operating & Technical Officer – Powercast

Leave a Reply

featured blogs
Jul 25, 2025
Manufacturers cover themselves by saying 'Contents may settle' in fine print on the package, to which I reply, 'Pull the other one'”it's got bells on it!'...

featured paper

Agilex™ 3 vs. Certus-N2 Devices: Head-to-Head Benchmarking on 10 OpenCores Designs

Sponsored by Altera

Explore how Agilex™ 3 FPGAs deliver up to 2.4× higher performance and 30% lower power than comparable low-cost FPGAs in embedded applications. This white paper benchmarks real workloads, highlights key architectural advantages, and shows how Agilex 3 enables efficient AI, vision, and control systems with headroom to scale.

Click to read more

featured chalk talk

Power Modules and Why You Should Use Them in Your Next Power Design
In this episode of Chalk Talk, Amelia Dalton and Christine Chacko from Texas Instruments explore a variety of power module package technologies, examine the many ways that power modules can help save on total design solution cost, and the unique benefits that Texas Instruments power modules can bring to your next design.
Aug 22, 2024
43,309 views