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Next Generation Wafers and the Future of Optical Connectivity

This week Mark Benton (TE Connectivity) joins me to chat all about rugged optical transceivers. Mark and I discuss how these transceivers can enable flexible embedded solutions, the challenges of unbalanced input and output channel counts in military and aerospace designs, and the benefits that modularity can bring to these kinds of designs. Also this week, I check out how you can take a trip to the outer edge of the stratosphere with the help of a space balloon. 

 

Links for July 19, 2024

More information about TE Connectivity 

MULTIGIG RT Fiber Optics Mid-Board Transceiver Platform from TE Connectivity 

Designing Modularity into Rugged Optical Transceivers Enables Flexible System Solutions (Youtube)

 Chalk Talk: TE Connectivity MULTIGIG RT Connectors — TE Connectivity and Mouser Electronics

A Flight To The Near Space – EOS-X SPACE (Youtube)

More information about EOS-X SPACE 

 

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Fish Fry Executive Interviews

David Mayman, CEO – Mayman Aerospace 

Anupam Bakshi, CEO – Agnisys

Dave Kleidermacher, CTO – Green Hills Software

Robert Blake, CEO – Achronix

Jack Harding, CEO – eSilicon

Michiel Ligthart, COO – Verific

Simon Davidmann, CEO – Imperas

Jessica Gomez – Rogue Valley Microdevices

Shishpal Rawat, Chairman – Accellera Systems Initiative

Kevin Bromber, CEO – myDevices

Daniel Hansson, CEO – Verifyter

Mark Papermaster, CTO – AMD

David Fried, CTO – Coventor

Dr. Steven LeBoeuf, President – Valencell

David Dutton, CEO – Silvaco

Bob Niemiec, CEO – TwistThink

Allan Martinson, COO – Starship Technologies

Zhihong Liu, Chairman and CEO – ProPlus Solutions

Taher Madraswala, CEO and President – Open-Silicon

Kapil Shankar, CEO and Director – AnDAPT

Dan Fox, CTO – Local Motors

Kim Rowe, Founder and CEO — RoweBots

Lawrence Cooke, Founder and CEO — NovaSolix

Gregg Recupero, CTO — Performance-IP

Alan Grau, CEO — Icon Labs

Carl Alberty, Vice President – Cirrus Logic

Maximilian Odendahl, CEO — Silexica

Finbarr Moynihan, General Manager — MediaTek

Sanjay Pillay, CEO — Austemper

Louis Parks, CEO – SecureRF

Harold Blomquist, CEO – Helix Semiconductor

Dale Dougherty and Sherry Huss, Co-Founders – Maker Faire

David Su, CEO – Atomic Technologies

Mung Chiang, EVP and Dean of Engineering College – Purdue University

Clay Johnson, CEO – CacheQ

Andy Hock, Vice President, Product – Cerebras Systems

Dan Goehl, Co-founder and Chief Business Officer – UltraSense Systems

Charlie Green, Chief Operating & Technical Officer – Powercast

 

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