Are We There Yet?

The Road to 7nm is Paved with Predictive Modeling

by Amelia Dalton

Sometimes the road less traveled is less traveled for a reason. (Jerry Seinfeld)

We know what roads will lead us to the 7nm semiconductor node and frankly, they’re not all that scenic. In this week’s Fry Fry, we tackle the trials and tribulations of this tiny titan with David Freid from Coventor. David and I discuss the biggest challenges we will face at this smallest of the small process geometry, how virtual fabrication and predictive modeling can help solve some of our problems, and why the most important question surrounding this new node isn’t being asked: "Should we even go to 7nm?" In this week’s Kickstarter Corner, we check out the coolest new Star Wars campaign to hit the kickstartin’ airwaves: Kyberlight Sabers - The strongest, brightest, and best combat-ready sabers in the galaxy!  Read More


Industry News

June 24, 2016

Sensory’s New TrulyHandsfree SDK Simplifies the Development of Voice Activated Products

Brite Semiconductor and Power Line Communications Leader, Semitech Semiconductor, Collaborate on Industrial M2M SoC

AdaCore Launches “Make with Ada” Programming Competition, with €5000 Top Prize

June 23, 2016

Vesper Demonstrates First Commercial Quiescent-Sensing MEMS Device for Consumer Products

Optimal+ to Discuss Real-Time Electronic Chip Traceability at the Symposium on Counterfeit Parts and Materials

TI introduces 1.2-mm2 FemtoFET 60-V N-channel power MOSFET with industry’s best resistance

French Research Team Helps Extend MRI Detection of Diseases & Lower Health-Care Costs

Free Driver Software from STMicroelectronics Extends Flexibility in Designing STM32 Embedded Applications

MEMSIC INC Launches First Ever Vibration Filtering Accelerometers and Tilt Switches

June 22, 2016

Cavium Adds Microsemi’s Storage Solutions to ThunderX® Processor Family

ams' new temperature sensor offers best-in-class combination of accuracy, ultra-low power consumption and small size

Mouser Announces Exclusive Global Sponsorship of 20th Annual Microchip MASTERs Conference

Microsemi Invests in Veracity to Support Commitment to IoT Security Market

Silicon Carbide power MOSFETs from TT Electronics operate in environmentally challenged applications

Cadence Debuts PSpice Web Portal and Ecosystem to Help Designers Address System Level Mixed-Signal Wireless and IoT Challenges

June 21, 2016

Keysight Technologies Announces BenchVue 3.5 Software for Instrument Control, Data Logging, Test Automation

IDT Collaborates with Cavium to Support Hyperscale Data Centers

Accelerate and De-risk Materials Decisions for Semiconductor R&D With IMI Labs from Intermolecular

Bosch Sensortec launches the world’s smallest 9-axis motion sensor

Synopsys Optimizes DesignWare IP for PCI Express 4.0 Architecture to Reduce Latency by up to 20 Percent

TI introduces the industry’s lowest-power, low-jitter retimers for 4K UHD video and camera interface

June 20, 2016

Revolutionary New Fanless Power Supply from Excelsys delivers an incredible 600W with Natural Convection Cooling Only

STMicroelectronics Collaborates with Qualcomm on Sensors for Smart Mobile Devices

June 17, 2016

Mouser to Showcase Newest Technologies at Sensors Expo 2016

Xilinx Broadens the Zynq UltraScale+ MPSoC Family with Streamlined Dual-Core Devices

News Archive

Achronix Accelerates Today’s Data Center

PCIe Board Brings Power-Efficient Networking Performance

by Kevin Morris

Zeno’s Paradox and the Chip of Choice

Choosing Processors Isn’t Like it Used to Be

by Jim Turley

We Have Contact

Applied Materials Improves Connections to Silicon

by Bryon Moyer

The Amalgamation Situation

AMD and the Era of Data Convergence

by Amelia Dalton

Articles Archive

 

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forum

We Have Contact

Posted on 06/20/16 at 10:57 AM by bmoyer

bmoyer
What do you think about Applied Materials' approach to aggressive-node contacts?

Delivering Higher FPGA Utilization & Performance: UltraScale Architecture Tech Packet

Posted on 06/15/16 at 9:46 AM by amelia

amelia
This page has been fixed. You can now download the whitepaper.

A Hidden IoT Network

Posted on 06/13/16 at 10:48 AM by bmoyer

bmoyer
Do you see home hotspots as a feasible way to simplify IoT device on-boarding?

Rethinking System Integration

Posted on 06/10/16 at 11:30 AM by bmoyer

bmoyer
What do you think of this IoT interop approach?

EE Times "Divested"

Posted on 06/07/16 at 9:31 AM by mburns122

mburns122
Simply put, well said.

Forum Archive

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Featured Blogs

Xilinx, Inc.

June 24, 2016
  Dave Jone’s latest EEVBlog teardown pulls the covers off of a low-cost Siglent SSA3021X 2GHz Spectrum Analyzer and guess what? He finds a Xilinx Spartan-6 LX45 FPGA inside at 6:14 in the video. As Dave notes from a previous teardown, there’s a Spar…
 

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Cadence

June 24, 2016
If you were asked where in the world the most leading-edge semiconductor research is done, you'd probably pick the US or perhaps Taiwan. But the real answer is Belgium. Not even Brussels, but Leuven, a small town about 15 miles to the east where imec …
 

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Mentor Graphics Corp.

June 23, 2016
Attending the recent TU-Automotive show in Detroit, it was clear that the North American automotive industry is alive and well. I suspect the attendance level was typical for this show, but the exhibition has grown in significant ways over recent years. P…
 

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Samtec, Inc.

June 23, 2016
Many Samtec blogs discuss bleeding edge new technologies, new products, or provide guidelines on optimizing system performance. Having said that, one of our biggest selling product lines is standard pitch (2.54, 2.00, 1.27 mm) board-to-board interconnects…
 

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Altera

June 22, 2016
We have reached the stage in the evolution of the Internet of Things (IoT) where two independent processes have become self-sustaining. The first—the creative process—has begun to uncover genuinely compelling applications. Beyond $40 internet lightbulbs, …
 

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chalk talks

TI LaunchPad Ecosystem

Turning your idea into a working project begins with a good development kit. Launchpad from Texas Instruments offers a robust, affordable starting point to make your next idea a reality. In this episode of Chalk Talk, Amelia Dalton talks to Daniel Ogilvie of Texas Instruments about the latest on TI's popular LaunchPad.

Running Out of Processing Power? No Problem.

Today's applications demand more processing power on a smaller energy budget. Advanced algorithms such as embedded vision easily overwhelm conventional SoCs. In this episode of Chalk Talk, Amelia Dalton chats with Eric Ma of Xilinx about maximizing performance-per-watt with Zynq UltraScale+ MPSoCs.

Powering Non-Isolated 24V Rail Applications Made Easy

Designing the DC/DC power supply for your design is almost never the fun part. And, designing a good power supply can be a complex engineering challenge. In this episode of Chalk Talk, Amelia Dalton chats with Tenille Medley of Texas Instruments about simplifying industrial power design. It may just make your next design project a lot easier.

De-Risk Yield Manufacturing Ramp-up with Veloce DFT App

Get DFT off the critical path on your next chip design. In this episode of Chalk Talk, Amelia Dalton chats with Jean-Marie Brunet of Mentor Graphics about how you can use emulation to significantly improve your DFT productivity.

Thermal Management

We often find ourselves needing to measure temperature and take some action in our designs. But, thermal management can be a complicated area, with a lot of alternatives in terms of sensors and supporting circuitry. In this episode of Chalk Talk, Amelia Dalton chats with John Austin of Microchip Technology about the numerous options for thermal management solutions.

Vivado Design Suite HLx Editions

High-level design methods can dramatically increase your productivity. Now that technologies like high-level synthesis (HLS) have gone mainstream, we can make some serious improvements to our FPGA design process. In this episode of Chalk Talk, Amelia Dalton chats with Tim Vanevenhoven of Xilinx about how the new HLx editions of Vivado Design suite are taking high-level design mainstream.

Chalk Talk Archive


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