Quilt Packaging

A New Twist on 2D – or 3D

by Bryon Moyer

So you’re working on a big die, eh? Maybe a huge imaging die – sized to capture a wide field with high resolution? Yeah… die manufacturing yield isn’t so great, eh? What to do?

When you’re on an unfriendly part of the yield curve, yield drops non-linearly with die size, meaning that 4 dice that are ¼ the size of one big die will yield more than four times better, combined, than the one big die. (If both big and small dice are already yielding 99%, then four small dice won’t yield better than 100%...  Read More


Industry News

March 02, 2015

Cypress Debuts Reliable, Secure Fingerprint Sensing Solution for Mobile Devices Through Its Strategic Partnership with IDEX ASA

STMicroelectronics Introduces World’s First Customizable Wireless Battery Charger Controller

Synopsys and Sensory, Inc. Deliver Ultra-Low Power Voice Control Solution for Mobile, Automotive and Consumer Applications

Avnet Abacus adds more industry-leading battery technology to its product portfolio in distribution agreement with RRC

Altera and China Mobile Demonstrate Virtualized C-RAN Platform for 5G at Mobile World Congress 2015

Microsemi Announces Innovative Global Navigation Satellite System Solution for the Communications Market with Integrated Clock Master Technology for Indoor Small Cells

Synopsys and Hillcrest Labs Announce Ultra-Low Power Sensor Processing Solution for Always-On Applications

60V Triple Output, 29µA IQ Buck/Buck/Boost DC/DC Controller Maintains Regulation in Automotive & Heavy Truck Start/Stop Systems

Accellera Systems Initiative UVM 1.2 Proceeds to IEEE Standardization

Microchip LoRa™ Technology Wireless Module Enables IoT; First Module for Ultra Long-Range and Low-Power Network Standard

February 27, 2015

LSR introduces SaBLE-x™ next generation Bluetooth® Smart module with industry-leading RF performance

Lynx Software Technologies Announces Security Product Support for New ARM-based IoT Designs

Cypress’s New $10 PSoC 5LP Prototyping Kit Gives Designers Access to Unmatched Processing Power in a One-Chip Solution

STMicroelectronics Introduces Digital UV Sensor for Mobile, Wearable, and IoT Applications

SmartDV Announces Addition of Six New Verification IPs to their Product Portfolio

Imec and Panasonic Present breakthrough in CMOS-based Transceivers for mm-Wave Radar Systems

Keysight Technologies Introduces Bandwidth Enhanced InfiniiMax III+ Probes, Accessories for High-Speed Bus Testing

PRO DESIGN Unveils New Virtex® UltraScale™ 440 FPGA Based Prototyping Solution

Altera and Escape Communications Announce High-capacity Turn-key Modem Solution for E- and V-band Microwave Radios

New Accelerometer with Exceptional Linearity Over Wide Dynamic Range

February 26, 2015

Xilinx and BEEcube Announce Highly Scalable Prototyping Platform for 5G Massive MIMO Antenna Systems

CEVA Brings Human-Like Intelligent Vision Processing to Low-Power Embedded Systems

Qseven IoT kit from congatec simplifies IoT application development

42V, 6A (IOUT), Synchronous Step-Down Regulator with Integrated Current Sensing

Keysight Technologies Delivers 64 Synchronous Multi-channel Data Acquisition System with Unique Phase Coherency

Imec Demonstrates Compact Wavelength-Division Multiplexing CMOS Silicon Photonics Transceiver

Synopsys' embARC Open Software Platform Accelerates Development of ARC-based Embedded Systems for the Internet of Things

ams and STMicroelectronics Join to Launch Breakthrough Solution for Secure NFC Mobile Payments

News Archive

In It to Win It

Achronix Takes Speedster to Production Prime Time

by Amelia Dalton

Return of the Hobbyist

New Boards, Power Electronics, and Software Tinkerers

by Dick Selwood

Tools! Tools! Tools!

Debuggers and Boards and IDEs! Oh, My!

by Jim Turley

Xilinx Throws Down

Unveils New 16nm UltraScale+ Families

by Kevin Morris

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editors' blog

Freescale Acquired by NXP

posted by Jim Turley

Dutch rival will acquire Freescale to create a combined $40B chip company. (Today)

A Mobile Environment Sensor

posted by Bryon Moyer

Bosch has announced a new combo sensor that can determine whether there are issues with the air you’re breathing. (24-Feb)

One Trillion Chips by 2017

posted by Jim Turley

One market-research firm says we're on track to ship one trillion semiconductor devices in 2017. (19-Feb)

A Hundred Billion Antenna Reconfigurations

posted by Bryon Moyer

Cavendish Kinetics hits a high reliability milestone. While phone makers care about this, they may not actually need this. (18-Feb)

What Does a 5-nm Transistor Look Like?

posted by Bryon Moyer

Imec and Synopsys announced TCAD collaboration at 5 nm. What mischief could they be up to? (17-Feb)

Editors' Blog Archive

 

forum

Quilt Packaging

Posted on 03/02/15 at 9:35 AM by bmoyer

bmoyer
What do you think of this quilt packaging approach to interconnecting multiple dice?

In It to Win It

Posted on 03/01/15 at 1:54 PM by gobeavs

Very interesting listening to this. Achronix says they are in production. I would love to hear about how many actual FPGAs they are shipping per month. Ten pieces per month?

Looking at the last couple rounds, I'm surprised the doors aren't closed yet. …

Xilinx Throws Down

Posted on 03/01/15 at 1:16 PM by gobeavs

I just think Achronix is toast. I would really love to hear what their advantage is. I think the Intel 22 nm may have been a small advantage but probably not enough to make that big of a difference. I think you need to be twice as fast or half the die siz…

Tools! Tools! Tools!

Posted on 02/28/15 at 7:22 AM by Dick Selwood

Dick Selwood
Full report on a show with over 900 exhibitors to come. Watch this space

Return of the Hobbyist

Posted on 02/28/15 at 7:21 AM by Dick Selwood

Dick Selwood
Have you used one of these boards? And why did you? Love to hear how you found it.

Xilinx Throws Down

Posted on 02/26/15 at 12:46 PM by TotallyLost

TotallyLost
@gobeavs -- and it wasn't that many years ago that key Xilix staff were brutally vocal putting down folks pioneering C/SystemC to RTL.

Now the company stand is: Vivado HLS accelerates design implementation and verification by enabling C, C++, and Syst…

Xilinx Throws Down

Posted on 02/26/15 at 10:43 AM by kevin

kevin
@gobeavs, I'm as impressed with this announcement as anybody, but I think you're assigning a bit too much nobility to Xilinx and Altera marketing when you say "I don't think Xilinx or Altera put some lame effective LUTs... number out there."

Let's rev…

Xilinx Throws Down

Posted on 02/25/15 at 2:15 PM by gobeavs

Just another nail in the coffin for Achronix. I think it's funny that Achronix puts a LUT count on the hard IP. That is an interesting marketing ploy. I don't think Xilinx or Altera put some lame effective LUTs including hard IP number out there.

You k…

A Harvest of Heat

Posted on 02/25/15 at 12:44 PM by jdobbs

Good article, and the third paragraph is right on. Generating power from temperature differences hasn't been top of mind due to the lack of awareness and finished products. I would like to encourage readers to browse our Perpetua portfolio of thermoelectr…

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4-Channel Analog Front End Solution

Designing the analog front end for any project can be a time-consuming engineering task. And, without a lot of analog expertise, many of us will face some tricky engineering challenges. In this episode of Chalk Talk, Amelia Dalton chats with Bill Laumeister of Maxim Integrated about a new analog front end (AFE) that both simplifies and improves the design of many analog front ends.

Abstract and Conquer: A New Alternative to Hierarchical Timing Analysis

Sign-off timing analysis for today’s complex SoC designs can be daunting. Rather than just throwing more computer power at the problem, you need to adopt a hierarchical approach and take advantage of higher levels of abstraction. In this episode of Chalk Talk, Amelia Dalton talks with Ruben Molina of Cadence Design Systems about a new, faster approach to sign-off timing analysis.

Delivering Higher FPGA Utilization & Performance: UltraScale Architecture

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Graphics Rendering and Video Processing with Altera SoC and Helio View Dev Kit

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Developing Clean Efficient Power with LLC Resonant Converters with Infineon

Ready to get your black belt in DC power conversion? In this episode of Chalk Talk, Amelia Dalton chats with Sam Abdel-Rahman of Infineon about how to make a versatile, high-efficiency, LLC resonant mode power converter. So, buckle up, hit play, and get your DC on!

Architecture Matters: Three Architectural Insights for SoC FPGAs

New devices that combine the power and flexiblility of FPGAs and conventional processors on a single chip represent a breakthrough in capability. But, understanding the complex architecture of these sophisticated components requires us to look under the hood to see how the architecture fits our design requirements, and how to choose the right chip for our application. In this episode of Chalk Talk, Amelia Dalton talks with Todd Koelling of Altera about what to look for in the architecture of your SoC FPGA.

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