Readers of the Samtec blog know we are always talking about next-gen speed. Current channels rates are running at 56 Gbps PAM4. However, system designers are starting to look at 112 Gbps PAM4 data rates. Intuition would say that bleeding edge data rates ...
Autumn is a tough time for us Brits. From the beginning of September when the kids go back to school until Christmas Eve, we have little to get excited about besides the nights closing in and the weather getting worse. For ...
Rise of the Machines is a description, a title, and a path. I know, this title might seem worn out, and sound dystopian at the core but I promise in this case it is a good thing. Automation is being used ...
As computing power continues to increase, air cooled systems cannot meet current thermal requirements for HPC hardware systems. Power consumption, space and performance must all be considered during system design. Immersion cooling is a fast-growing solution to economically combat system heat, ...
Samtec on Facebook
Samtec on Twitter
Samtec Chalk Talks
Accelerate HD Ultra-Dense Multi-Row Mezzanine Strips — Samtec and Mouser Electronics
Embedded applications are putting huge new demands on small connectors. Size, weight, and power constraints are combining with new signal integrity challenges due to high-speed interfaces and high-density connections, putting a crunch on connectors for embedded design. In this episode of Chalk Talk, Amelia Dalton chats with Matthew Burns of Samtec about the new generation of high-performance connectors for embedded design.
Click here for more information about Samtec AcceleRate® HD Ultra-Dense Mezzanine Strips
Evaluation and Development Kits — Samtec
With signal integrity becoming increasingly challenging in today’s designs, interconnect is taking on a key role. In order to see how a particular interconnect solution will perform in our design, we really need hands-on evaluation of the technology. In this episode of Chalk Talk, Amelia Dalton chats with Matthew Burns of Samtec about evaluation and development kits for high-speed interconnect solutions.
Click here for more information about Samtec Evaluation and Development Kits
0 to 112 (Gbps PAM4) in 5 Seconds – Samtec
With serial connections hitting 112Gbps, we can’t mess around with our interconnect. We need engineered solutions that will keep those eyes open and deliver the signal integrity we need in our high-speed designs. In this episode of Chalk Talk, Amelia Dalton talks with Matt Burns of Samtec about the interconnect options for speeds up to 112Gbs, and Samtec’s Flyover interconnect technology.
Click here to download the Silicon-to-Silicon Solutions Guide