industry news
Subscribe Now

STMicroelectronics reveals automotive-grade inertial modules for cost-effective functional-safety applications up to ASIL B

Deliver high accuracy and reliability in vehicle navigation, body electronics, and automated driving systems

Geneva, Switzerland, May 6, 2024 – STMicroelectronics has introduced the ASM330LHBG1 automotive 3-axis accelerometer and 3-axis gyroscope module with a safety-software library that enables a cost-effective solution for functional-safety applications.

The ASM330LHBG1 is AEC-Q100 Grade-1 qualified for the ambient operating temperature range -40°C to 125°C, allowing use such as next to the engine compartment and in areas exposed to sunlight. The modules deliver high accuracy and reliability for systems such as vehicle navigation, body electronics, in driver support and highly automated driving systems. Typical uses include support for precise positioning in navigation systems, digitally stabilizing cameras, lidars, and radars, and in active suspension, door modules, vehicle-to-everything (V2X) applications, adaptive lighting, and motion-activated functions.

Equipped with ST’s machine-learning core (MLC) and programmable finite state machine (FSM), the ASM330LHBG1 can run artificial intelligence (AI) algorithms in the sensor to provide smart functionality at very low power. This IMU is pin-to-pin compatible and shares the same configuration of registers as ST’s automotive IMUs with a lower operating temperature range, permitting a seamless upgrade.

In addition, the modules contain embedded temperature compensation, which ensures stability over wide-ranging operating conditions, and provide a six-channel synchronized output to enhance the accuracy of dead-reckoning algorithms. There are also I²C, MIPI I3C, and SPI serial interfaces, smart programmable interrupts, and a 3KB FIFO that eases managing sensor data to minimize load on the host processor.

The independently tested and certified software adheres to ISO26262 and enables safety-compliant redundancy with two ASM330LHBG1 modules. Fulfilling safety element out of context (SEooC), this combination based on general-purpose hardware supports system certification up to automotive safety integrity level B (ASIL B). This library provides software for configuring the sensing module, checking for correct operation before starting to acquire data, and handling the acquisition of the data coming from the sensing module. Each of these steps is associated with an error code that provides confirmation if a fault is detected. This solution comprising two identical sensors provides redundancy, checking the data coming from two different sensing sources are consistent.

The ASM330LHBG1 is in production now and available in a 14-lead, 2.5mm x 3mm VFLGA plastic land grid array package. Budgetary pricing is $9.40 for orders of 1000 pieces.

Please visit for more information.

Leave a Reply

featured blogs
May 8, 2024
Learn how artificial intelligence of things (AIoT) applications at the edge rely on TSMC's N12e manufacturing processes and specialized semiconductor IP.The post How Synopsys IP and TSMC’s N12e Process are Driving AIoT appeared first on Chip Design....
May 2, 2024
I'm envisioning what one of these pieces would look like on the wall of my office. It would look awesome!...

featured video

Why Wiwynn Energy-Optimized Data Center IT Solutions Use Cadence Optimality Explorer

Sponsored by Cadence Design Systems

In the AI era, as the signal-data rate increases, the signal integrity challenges in server designs also increase. Wiwynn provides hyperscale data centers with innovative cloud IT infrastructure, bringing the best total cost of ownership (TCO), energy, and energy-itemized IT solutions from the cloud to the edge.

Learn more about how Wiwynn is developing a new methodology for PCB designs with Cadence’s Optimality Intelligent System Explorer and Clarity 3D Solver.

featured paper

Altera® FPGAs and SoCs with FPGA AI Suite and OpenVINO™ Toolkit Drive Embedded/Edge AI/Machine Learning Applications

Sponsored by Intel

Describes the emerging use cases of FPGA-based AI inference in edge and custom AI applications, and software and hardware solutions for edge FPGA AI.

Click here to read more

featured chalk talk

Enabling IoT with DECT NR+, the Non-Cellular 5G Standard
In the ever-expanding IoT market, there is a growing need for private, low cost networks. In this episode of Chalk Talk, Amelia Dalton and Heidi Sollie from Nordic Semiconductor explore the details of DECT NR+, the world’s first non-cellular 5G technology standard. They investigate how this self-healing, decentralized, autonomous mesh network can help solve a variety of IoT connectivity issues and how Nordic is helping designers take advantage of DECT NR+ with their nRF91 System-in-Package family.
Aug 17, 2023