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Gold-mining fungi could guide human prospectors

Shiny, pretty and useful in electronics, gold has been prized by humans for millennia, but we’re not the only ones out there prospecting. Scientists from Australia’s CSIRO have now found a fungus species that mines for gold, and even decorates itself with the precious particles. Following the fungus could be a new, environmentally-friendly way to find large underground gold deposits.

Continue reading at New Atlas

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Oct 19, 2020
We'€™re proud to see that many expert verification teams exploit the powers of UVM vr_ad, in implementing intricate verification environments in e . The vr_ad is an open source package, part of UVM- e... [[ Click on the title to access the full blog on the Cadence Communit...
Oct 16, 2020
Another event popular in the tech event circuit is PCI-SIG® DevCon. While DevCon events are usually in-person around the globe, this year, like so many others events, PCI-SIG DevCon is going virtual. PCI-SIG DevCons are members-driven events that provide an opportunity to le...
Oct 16, 2020
If you said '€œYes'€ to two of the items in the title of this blog -- specifically the last two -- then read on......
Oct 16, 2020
[From the last episode: We put together many of the ideas we'€™ve been describing to show the basics of how in-memory compute works.] I'€™m going to take a sec for some commentary before we continue with the last few steps of in-memory compute. The whole point of this web...

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Better PPA with Innovus Mixed Placer Technology – Gigaplace XL

Sponsored by Cadence Design Systems

With the increase of on-chip storage elements, it has become extremely time consuming to come up with an optimized floorplan with manual methods. Innovus Implementation’s advanced multi-objective placement technology, GigaPlace XL, provides automation to optimize at scale, concurrent placement of macros, and standard cells for multiple objectives like timing, wirelength, congestion, and power. This technology provides an innovative way to address design productivity along with design quality improvements reducing weeks of manual floorplan time down to a few hours.

Click here for more information about Innovus Implementation System

featured Paper

New package technology improves EMI and thermal performance with smaller solution size

Sponsored by Texas Instruments

Power supply designers have a new tool in their effort to achieve balance between efficiency, size, and thermal performance with DC/DC power modules. The Enhanced HotRod™ QFN package technology from Texas Instruments enables engineers to address design challenges with an easy-to-use footprint that resembles a standard QFN. This new package type combines the advantages of flip-chip-on-lead with the improved thermal performance presented by a large thermal die attach pad (DAP).

Click here to download the whitepaper

Featured Chalk Talk

Intel NUC Elements

Sponsored by Mouser Electronics and Intel

Intel Next Unit of Computing (NUC) compute elements are small-form-factor barebone computer kits and components that are perfect for a wide variety of system designs. In this episode of Chalk Talk, Amelia Dalton chats with Kristin Brown of Intel System Product Group about pre-engineered solutions from Intel that can provide the appropriate level of computing power for your next design, with a minimal amount of development effort from your engineering team.

Click here for more information about Intel NUC 8 Compute Element (U-Series)