EEJournal

fish fry
Subscribe Now
October 8, 2021

Eyes on the Prize: element14’s Spy Nerd Challenge and MIT’s New Robot Finds Lost Items

by Amelia Dalton

In this week’s podcast, we start things off with a closer look at a new robotic system developed by a team of researchers at MIT called RFusion. We investigate how it combines RF information, visual data, and neural networks to find and retrieve objects with ease. (Spoiler alert: it can even find objects when they are buried under a pile and fully out of view.) Also this week, Tariq Ahmad (element14) joins us to discuss element14’s new Spy Nerd Challenge. We chat about the motivations behind the creation of this unique electronic design contest, how you can get involved and what you can win.

 

Click here to download this episode

Links for October 8, 2021

More information about element14

element14 Announces Spy Nerd Design Challenge

RFusion: A Robot that Finds and Retrieves Missing Objects (Youtube)

A robot that finds lost items: This robotic arm fuses data from a camera and antenna to locate and retrieve items, even if they are buried under a pile.

 

Click here to check out the Fish Fry Archive.

Click here to subscribe to Fish Fry via Podbean

Click here to get the Fish Fry RSS Feed

Click here to subscribe to Fish Fry via Apple Podcasts

Click here to subscribe to Fish Fry via Spotify

 

Fish Fry Executive Interviews

Anupam Bakshi, CEO – Agnisys

Dave Kleidermacher, CTO – Green Hills Software

Robert Blake, CEO – Achronix

Jack Harding, CEO – eSilicon

Michiel Ligthart, COO – Verific

Adnan Hamid, CEO – Breker Technologies

Simon Davidmann, CEO – Imperas

Jessica Gomez – Rogue Valley Microdevices

Shishpal Rawat, Chairman – Accellera Systems Initiative

Kevin Bromber, CEO – myDevices

Daniel Hansson, CEO – Verifyter

Mark Papermaster, CTO – AMD

David Fried, CTO – Coventor

Dr. Steven LeBoeuf, President – Valencell

David Dutton, CEO – Silvaco

Bob Niemiec, CEO – TwistThink

Allan Martinson, COO – Starship Technologies

Zhihong Liu, Chairman and CEO – ProPlus Solutions

Taher Madraswala, CEO and President – Open-Silicon

Kapil Shankar, CEO and Director – AnDAPT

Dan Fox, CTO – Local Motors

Kim Rowe, Founder and CEO — RoweBots

Lawrence Cooke, Founder and CEO — NovaSolix

Gregg Recupero, CTO — Performance-IP

Alan Grau, CEO — Icon Labs

Carl Alberty, Vice President – Cirrus Logic

Maximilian Odendahl, CEO — Silexica

Finbarr Moynihan, General Manager — MediaTek

Sanjay Pillay, CEO — Austemper

Louis Parks, CEO – SecureRF

Harold Blomquist, CEO – Helix Semiconductor

Dale Dougherty and Sherry Huss, Co-Founders – Maker Faire

Mike Wisart, CEO – efabless

Chris Giovanniello, SVP and Co-Founder – Menlo Micro

Jake Janovetz, President – Opal Kelly

Jerry Gipper, Executive Director – VITA

Ethan Plotkin, CEO – GDCA

Xin Song, CEO – Bottos

Chris Dries, CEO – UnitedSiC 

Bob Smith, Executive Director – ESD Alliance 

Rick O’Connor, Executive Director – RISC V Foundation

Naveed Sherwani, CEO and Yunsup Lee, CTO/Founder- SiFIve

Doug Letcher, CEO and President – Metrics Technologies

Jun Pei, CEO – Cepton Technologies

Nikos Zervas, CEO – CAST

Dave Hughes, CEO – HCC Embedded

David Su, CEO – Atomic Technologies

Jess Isquith, President/CEO – PICMG

Galen Hunt, Distinguished Engineer and Managing Director, Microsoft Azure Sphere – Microsoft 

Vinay Gokhale, VP Business Development – ThirdWayv

Kevin Hannah, Director of Product Operations- Kazuhm

Srinath Anantharaman, CEO – ClioSoft

Gajinder Panesar, CTO  – UltraSoC and Tim Ramsdale, CEO – Agile Analog

Steve Cammish, VP of Edge Solutions – ADLINK

Adam Benzion, Co-Founder, Hackster.io

Ted Pawela, COO – Altium 

Michael Dick, CEO – C2A Security

Ted Mirracco, CEO – Cylynt 

Arun Subbarao, VP of Engineering – Lynx Software

Doug Sandy, Chief Technical Officer – PICMG

Stefan Müller, CTO and Founder – FMC

Brian Faith, CEO – QuickLogic 

Paul Cunningham, Senior Vice President and General Manager- Cadence Design Systems

Tom Doyle, CEO – Aspinity

Pim Tulys, CEO – Intrinsic-ID

Yonatan Geifman , Co-founder and CEO – Deci

Mung Chiang, EVP and Dean of Engineering College – Purdue University

Clay Johnson, CEO – CacheQ

Leave a Reply

featured blogs
Wave Generation Revisited and Other Highlights of Fine Marine v11.1
Oct 5, 2022
The newest version of Fine Marine - Cadence's CFD software specifically designed for Marine Engineers and Naval Architects - is out now. Discover re-conceptualized wave generation, drastically expanding the range of waves and the accuracy of the modeling and advanced pos...
More from Cadence...
6 Reasons to Leverage IC Hardware Development in the Cloud
Oct 4, 2022
We share 6 key advantages of cloud-based IC hardware design tools, including enhanced scalability, security, and access to AI-enabled EDA tools. The post 6 Reasons to Leverage IC Hardware Development in the Cloud appeared first on From Silicon To Software....
More from Synopsys...
What’s It All About, Alfie?
Sep 30, 2022
When I wrote my book 'Bebop to the Boolean Boogie,' it was certainly not my intention to lead 6-year-old boys astray....
More from Max's Cool Beans...

featured video

PCIe Gen5 x16 Running on the Achronix VectorPath Accelerator Card

Sponsored by Achronix

In this demo, Achronix engineers show the VectorPath Accelerator Card successfully linking up to a PCIe Gen5 x16 host and write data to and read data from GDDR6 memory. The VectorPath accelerator card featuring the Speedster7t FPGA is one of the first FPGAs that can natively support this interface within its PCIe subsystem. Speedster7t FPGAs offer a revolutionary new architecture that Achronix developed to address the highest performance data acceleration challenges.

Click here for more information about the VectorPath Accelerator Card

featured paper

Algorithm Verification with FPGAs and ASICs

Sponsored by MathWorks

Developing new FPGA and ASIC designs involves implementing new algorithms, which presents challenges for verification for algorithm developers, hardware designers, and verification engineers. This eBook explores different aspects of hardware design verification and how you can use MATLAB and Simulink to reduce development effort and improve the quality of end products.

Click here to read more

featured chalk talk

"Scalable Power Delivery" for High-Performance ASICs, SoCs, and xPUs

Sponsored by Infineon

Today’s AI and Networking applications are driving an exponential increase in compute power. When it comes to scaling power for these kinds of applications with next generation chipsets, we need to keep in mind package size constraints, dynamic current balancing, and output capacitance. In this episode of Chalk Talk, Mark Rodrigues from Infineon joins Amelia Dalton to discuss the system design challenges with increasing power density for next generation chipsets, the benefits that phase paralleling brings to the table, and why Infineon’s best in class transient performance with XDP architecture and Trans Inductor Voltage Regulator can help power  your next high performance ASIC, SoC or xPU design.

Click here for more information about computing and data storage from Infineon