fish fry
Subscribe Now

Chips, Chiplets, and Modules, Oh My!

How Constraint Drives Innovation

In this week’s Fish Fry podcast, we’ve got an interview double header! First up, Peggy Carrieres (Avnet) joins me to discuss the electronic supply shortages we are experiencing today and why she believes constraint drives innovation. Next, Rob Mains (CHIPS Alliance) joins me to discuss how CHIPS Alliance is collaborating with a variety of different companies and universities to create a chip design ecosystem and the details of their unified memory standard developed with RISC-V international.

 

 

Click here to download this episode

Links for September 24, 2021

Click here for more information about Avnet

Click here to listen to the Avnet Distributing Wisdom Podcast

Click here for more information about the CHIPS Alliance

CHIPS Alliance and RISC-V International Invite the RISC-V Community to Participate in Updating a New Unified Memory Architecture Standard

 

Click here to check out the Fish Fry Archive.

Click here to subscribe to Fish Fry via Podbean

Click here to get the Fish Fry RSS Feed

Click here to subscribe to Fish Fry via Apple Podcasts

Click here to subscribe to Fish Fry via Spotify

 

Fish Fry Executive Interviews

Anupam Bakshi, CEO – Agnisys

Dave Kleidermacher, CTO – Green Hills Software

Robert Blake, CEO – Achronix

Jack Harding, CEO – eSilicon

Michiel Ligthart, COO – Verific

Adnan Hamid, CEO – Breker Technologies

Simon Davidmann, CEO – Imperas

Jessica Gomez – Rogue Valley Microdevices

Shishpal Rawat, Chairman – Accellera Systems Initiative

Kevin Bromber, CEO – myDevices

Daniel Hansson, CEO – Verifyter

Mark Papermaster, CTO – AMD

David Fried, CTO – Coventor

Dr. Steven LeBoeuf, President – Valencell

David Dutton, CEO – Silvaco

Bob Niemiec, CEO – TwistThink

Allan Martinson, COO – Starship Technologies

Zhihong Liu, Chairman and CEO – ProPlus Solutions

Taher Madraswala, CEO and President – Open-Silicon

Kapil Shankar, CEO and Director – AnDAPT

Dan Fox, CTO – Local Motors

Kim Rowe, Founder and CEO — RoweBots

Lawrence Cooke, Founder and CEO — NovaSolix

Gregg Recupero, CTO — Performance-IP

Alan Grau, CEO — Icon Labs

Carl Alberty, Vice President – Cirrus Logic

Maximilian Odendahl, CEO — Silexica

Finbarr Moynihan, General Manager — MediaTek

Sanjay Pillay, CEO — Austemper

Louis Parks, CEO – SecureRF

Harold Blomquist, CEO – Helix Semiconductor

Dale Dougherty and Sherry Huss, Co-Founders – Maker Faire

David Su, CEO – Atomic Technologies

Mung Chiang, EVP and Dean of Engineering College – Purdue University

Clay Johnson, CEO – CacheQ

One thought on “Chips, Chiplets, and Modules, Oh My!”

Leave a Reply

featured blogs
May 21, 2022
May is Asian American and Pacific Islander (AAPI) Heritage Month. We would like to spotlight some of our incredible AAPI-identifying employees to celebrate. We recognize the important influence that... ...
May 20, 2022
I'm very happy with my new OMTech 40W CO2 laser engraver/cutter, but only because the folks from Makers Local 256 helped me get it up and running....
May 19, 2022
Learn about the AI chip design breakthroughs and case studies discussed at SNUG Silicon Valley 2022, including autonomous PPA optimization using DSO.ai. The post Key Highlights from SNUG 2022: AI Is Fast Forwarding Chip Design appeared first on From Silicon To Software....
May 12, 2022
By Shelly Stalnaker Every year, the editors of Elektronik in Germany compile a list of the most interesting and innovative… ...

featured video

EdgeQ Creates Big Connections with a Small Chip

Sponsored by Cadence Design Systems

Find out how EdgeQ delivered the world’s first 5G base station on a chip using Cadence’s logic simulation, digital implementation, timing and power signoff, synthesis, and physical verification signoff tools.

Click here for more information

featured paper

Reduce EV cost and improve drive range by integrating powertrain systems

Sponsored by Texas Instruments

When you can create automotive applications that do more with fewer parts, you’ll reduce both weight and cost and improve reliability. That’s the idea behind integrating electric vehicle (EV) and hybrid electric vehicle (HEV) designs.

Click to read more

featured chalk talk

Industrial Ethernet Next Generation Connections

Sponsored by Mouser Electronics and Amphenol ICC

No longer are hierarchical communication models effective in this new era of Industry 4.0. We need to look at an independent communication model that includes a single network with industrial ethernet at its core. In this episode of Chalk Talk, Amelia Dalton chats with Peter Swift about Amphenol’s SPE and iX Industrial family of connectors. They take a closer look at the details of these connector solutions and investigate why they are a great fit for the next generation of industrial automation applications.

Click here for more information about Amphenol ICC Industrial Ethernet Connectors & Cable Assemblies