fish fry
Subscribe Now

Running the Long Game: New RISC-V Based SoCs and Using Technosignatures to Find Alien Life

It’s a bird, it’s a plane, it’s a RISC-V Fish Fry! In this week’s podcast, we first investigate how the search for alien life just got a lot more interesting with the help of a unique grant from NASA, the SETI institute, and a team of esteemed researchers from across the United States. We take a closer look at the details of this new research project and how it is hoping to find signs of alien life on distant exoplanets using technosignatures. Also this week, Sammy Cheung (CEO – Efinix) joins us to discuss how Efinix is blending the worlds of RISC-V and reconfigurable computing and the details of  their new family of software-defined SoCs based on the RISC-V core.

 

Click here to download this episode

Links for June 26, 2020

Does intelligent life exist on other planets? Technosignatures may hold new clues (Rochester Newscenter)

CfA Scientists Collaborate on New Study to Search the Universe for Signs of Technological Civilizations

More information about the SETI Institute

More information about Efinix

Efinix® Announces Availability of Three RISC-V® SoCs

 

Click here to check out the Fish Fry Archive.

Click here to subscribe to Fish Fry via Podbean

Click here to get the Fish Fry RSS Feed

Click here to subscribe to Fish Fry via iTunes.

Click here to subscribe to Fish Fry via Spotify

 

Fish Fry Executive Interviews

Anupam Bakshi, CEO – Agnisys

Dave Kleidermacher, CTO – Green Hills Software

Robert Blake, CEO – Achronix

Jack Harding, CEO – eSilicon

Michiel Ligthart, COO – Verific

Adnan Hamid, CEO – Breker Technologies

Simon Davidmann, CEO – Imperas

Ted Miracco, CEO – SmartFlow Compliance Solutions

Jessica Gomez – Rogue Valley Microdevices

Shishpal Rawat, Chairman – Accellera Systems Initiative

Kevin Bromber, CEO – myDevices

Daniel Hansson, CEO – Verifyter

Mark Papermaster, CTO – AMD

David Fried, CTO – Coventor

Dr. Steven LeBoeuf, President – Valencell

David Dutton, CEO – Silvaco

Bob Niemiec, CEO – TwistThink

Allan Martinson, COO – Starship Technologies

Zhihong Liu, Chairman and CEO – ProPlus Solutions

Taher Madraswala, CEO and President – Open-Silicon

Kapil Shankar, CEO and Director – AnDAPT

Dan Fox, CTO – Local Motors

 

Leave a Reply

featured blogs
Feb 26, 2021
OMG! Three 32-bit processor cores each running at 300 MHz, each with its own floating-point unit (FPU), and each with more memory than you than throw a stick at!...
Feb 26, 2021
In the SPECTRE 20.1 base release, we released Spectre® XDP-HB as part of the new Spectre X-RF simulation technology. Spectre XDP-HB uses a highly distributed multi-machine multi-core simulation... [[ Click on the title to access the full blog on the Cadence Community si...
Feb 24, 2021
mmWave applications are all the rage. Why? Simply put, the 5G tidal wave is coming. Also, ADAS systems use 24 GHz for SRR applications and 77 GHz for LRR applications. Obviously, the world needs mmWave tech! Traditional mmWave technology spans the 30 – 300 GHz frequency...

featured video

Silicon-Proven Automotive-Grade DesignWare IP

Sponsored by Synopsys

Get the latest on Synopsys' automotive IP portfolio supporting ISO 26262 functional safety, reliability, and quality management standards, with an available architecture for SoC development and safety management.

Click here for more information

featured paper

Using the DS28E18, The Basics

Sponsored by Maxim Integrated

This application note goes over the basics of using the DS28E18 1-Wire® to I2C/SPI Bridge with Command Sequencer and discusses the steps to get it up and running quickly. It then shows how to use the device with two different devices. The first device is an I2C humidity/temperature sensor and the second one is an SPI temperature sensor device. It concludes with detailed logs of each command.

Click here to download the whitepaper

Featured Chalk Talk

Accelerate the Integration of Power Conversion with microBUCK® and microBRICK™

Sponsored by Mouser Electronics and Vishay

In the world of power conversion, multi-chip packaging, thermal performance, and power density can make all of the difference in the success of your next design. In this episode of Chalk Talk, Amelia Dalton chats with Raymond Jiang about the trends and challenges in power delivery and how you can leverage the unique combination of discrete MOSFET design, IC expertise, and packaging capability of Vishay’s microBRICK™and microBUCK® integrated voltage regulators.

Click here for more information about Vishay microBUCK® and microBRICK™ DC/DC Regulators