fish fry
Subscribe Now

AI’s Next Giant Leap: How Intel is Advancing the Neuromorphic Computing Revolution

In today’s Fish Fry podcast, Mike Davies (Intel) joins me to investigate the past, present, and future of neuromorphic computing. Mike and I discuss how neuromorphic computing will usher in a new age of artificial intelligence, the details of Intel’s Loihi 2 neuromorphic chip, and why Intel’s Lava open-source software framework is crucial to the success of this new neuromorphic computing revolution.

 

Click here to download this episode

Links for October 1, 2021

Intel Advances Neuromorphic with Loihi 2, New Lava Software Framework and New Partners

How Neuromorphic Computing Uses the Human Brain as a Model (Youtube)

Brains Behind the Brains: Mike Davies and Neuromorphic Computing at Intel Labs (Youtube)

Feature Article by Kevin Morris: Neuromorphic Revolution – Will Neuromorphic Architectures Replace Moore’s Law?

 

Click here to check out the Fish Fry Archive.

Click here to subscribe to Fish Fry via Podbean

Click here to get the Fish Fry RSS Feed

Click here to subscribe to Fish Fry via Apple Podcasts

Click here to subscribe to Fish Fry via Spotify

 

Fish Fry Executive Interviews

Anupam Bakshi, CEO – Agnisys

Dave Kleidermacher, CTO – Green Hills Software

Robert Blake, CEO – Achronix

Jack Harding, CEO – eSilicon

Michiel Ligthart, COO – Verific

Adnan Hamid, CEO – Breker Technologies

Simon Davidmann, CEO – Imperas

Jessica Gomez – Rogue Valley Microdevices

Shishpal Rawat, Chairman – Accellera Systems Initiative

Kevin Bromber, CEO – myDevices

Daniel Hansson, CEO – Verifyter

Mark Papermaster, CTO – AMD

David Fried, CTO – Coventor

Dr. Steven LeBoeuf, President – Valencell

David Dutton, CEO – Silvaco

Bob Niemiec, CEO – TwistThink

Allan Martinson, COO – Starship Technologies

Zhihong Liu, Chairman and CEO – ProPlus Solutions

Taher Madraswala, CEO and President – Open-Silicon

Kapil Shankar, CEO and Director – AnDAPT

Dan Fox, CTO – Local Motors

Kim Rowe, Founder and CEO — RoweBots

Lawrence Cooke, Founder and CEO — NovaSolix

Gregg Recupero, CTO — Performance-IP

Alan Grau, CEO — Icon Labs

Carl Alberty, Vice President – Cirrus Logic

Maximilian Odendahl, CEO — Silexica

Finbarr Moynihan, General Manager — MediaTek

Sanjay Pillay, CEO — Austemper

Louis Parks, CEO – SecureRF

Harold Blomquist, CEO – Helix Semiconductor

Dale Dougherty and Sherry Huss, Co-Founders – Maker Faire

David Su, CEO – Atomic Technologies

Mung Chiang, EVP and Dean of Engineering College – Purdue University

Clay Johnson, CEO – CacheQ

Leave a Reply

featured blogs
May 21, 2022
May is Asian American and Pacific Islander (AAPI) Heritage Month. We would like to spotlight some of our incredible AAPI-identifying employees to celebrate. We recognize the important influence that... ...
May 20, 2022
I'm very happy with my new OMTech 40W CO2 laser engraver/cutter, but only because the folks from Makers Local 256 helped me get it up and running....
May 19, 2022
Learn about the AI chip design breakthroughs and case studies discussed at SNUG Silicon Valley 2022, including autonomous PPA optimization using DSO.ai. The post Key Highlights from SNUG 2022: AI Is Fast Forwarding Chip Design appeared first on From Silicon To Software....
May 12, 2022
By Shelly Stalnaker Every year, the editors of Elektronik in Germany compile a list of the most interesting and innovative… ...

featured video

EdgeQ Creates Big Connections with a Small Chip

Sponsored by Cadence Design Systems

Find out how EdgeQ delivered the world’s first 5G base station on a chip using Cadence’s logic simulation, digital implementation, timing and power signoff, synthesis, and physical verification signoff tools.

Click here for more information

featured paper

Introducing new dynamic features for exterior automotive lights with DLP® technology

Sponsored by Texas Instruments

Exterior lighting, primarily used to illuminate ground areas near the vehicle door, can now be transformed into a projection system used for both vehicle communication and unique styling features. A small lighting module that utilizes automotive-grade digital micromirror devices, such as the DLP2021-Q1 or DLP3021-Q1, can display an endless number of patterns in any color imaginable as well as communicate warnings and alerts to drivers and other vehicles.

Click to read more

featured chalk talk

"Scalable Power Delivery" for High-Performance ASICs, SoCs, and xPUs

Sponsored by Infineon

Today’s AI and Networking applications are driving an exponential increase in compute power. When it comes to scaling power for these kinds of applications with next generation chipsets, we need to keep in mind package size constraints, dynamic current balancing, and output capacitance. In this episode of Chalk Talk, Mark Rodrigues from Infineon joins Amelia Dalton to discuss the system design challenges with increasing power density for next generation chipsets, the benefits that phase paralleling brings to the table, and why Infineon’s best in class transient performance with XDP architecture and Trans Inductor Voltage Regulator can help power  your next high performance ASIC, SoC or xPU design.

Click here for more information about computing and data storage from Infineon