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Thermal Trials and Temperature Tales

Thermal-Electric Co-Simulation for System Analysis

We all know that today’s engineering teams are facing increasing challenges surrounding thermal aware designs. Whether you are designing a board, an IC, or a system, we all struggle with thermal and electrical simulation at one point or another. In this week’s Fish Fry, Jerry Zhao (Cadence Design Systems) and I discuss the challenges of thermal and electrical simulation and the benefits of electrical and thermal co-simulation of multi-physics designs.

 

Click here to download this episode

 

Links for January 10, 2020

More information about Celsius Thermal Solver

Feature Article by Bryon Moyer: Electrical and Thermal Analysis Together – Cadence Announces Celsius, Integrated with Electrical Tools

Demonstrating Electrical-Thermal Co-Simulation with Celsius Thermal Solver (Video)

New Chalk Talk: Addressing Digital Implementation Challenges with Innovative Machine Learning Techniques

 

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Fish Fry Executive Interviews

Anupam Bakshi, CEO – Agnisys

Dave Kleidermacher, CTO – Green Hills Software

Robert Blake, CEO – Achronix

Jack Harding, CEO – eSilicon

Michiel Ligthart, COO – Verific

Adnan Hamid, CEO – Breker Technologies

Simon Davidmann, CEO – Imperas

Ted Miracco, CEO – SmartFlow Compliance Solutions

Jessica Gomez – Rogue Valley Microdevices

Shishpal Rawat, Chairman – Accellera Systems Initiative

Kevin Bromber, CEO – myDevices

Daniel Hansson, CEO – Verifyter

Mark Papermaster, CTO – AMD

David Fried, CTO – Coventor

Dr. Steven LeBoeuf, President – Valencell

David Dutton, CEO – Silvaco

Bob Niemiec, CEO – TwistThink

Allan Martinson, COO – Starship Technologies

Zhihong Liu, Chairman and CEO – ProPlus Solutions

Taher Madraswala, CEO and President – Open-Silicon

Kapil Shankar, CEO and Director – AnDAPT

Dan Fox, CTO – Local Motors

David Su, CEO – Atomic Technologies

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