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Advancing into FinFET

Chip Lifecycle Design Challenges, In-Chip Monitoring, and Tungsten Data Storage Breakthrough

In this week’s podcast, we are talking about embedded in-chip monitoring and lifecycle chip design challenges with Stephen Crosher and Oliver King from Moortec. We also take a closer look at a new breakthrough in data storage technology and why a team of researchers from Stanford, UC Berkeley, and Texas A&M believe that tiny slices of tungsten ditelluride may just hold the key to the evolution of data storage.

Click here to download this episode

 

Links for July 31, 2020

More information about Moortec 

Stanford-led team shows how to store data using 2D materials instead of silicon chips

Berry curvature memory through electrically driven stacking transitions (Whitepaper)

 

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Fish Fry Executive Interviews

Anupam Bakshi, CEO – Agnisys

Dave Kleidermacher, CTO – Green Hills Software

Robert Blake, CEO – Achronix

Jack Harding, CEO – eSilicon

Michiel Ligthart, COO – Verific

Adnan Hamid, CEO – Breker Technologies

Simon Davidmann, CEO – Imperas

Ted Miracco, CEO – SmartFlow Compliance Solutions

Jessica Gomez – Rogue Valley Microdevices

Shishpal Rawat, Chairman – Accellera Systems Initiative

Kevin Bromber, CEO – myDevices

Daniel Hansson, CEO – Verifyter

Mark Papermaster, CTO – AMD

David Fried, CTO – Coventor

Dr. Steven LeBoeuf, President – Valencell

David Dutton, CEO – Silvaco

Bob Niemiec, CEO – TwistThink

Allan Martinson, COO – Starship Technologies

Zhihong Liu, Chairman and CEO – ProPlus Solutions

Taher Madraswala, CEO and President – Open-Silicon

Kapil Shankar, CEO and Director – AnDAPT

Dan Fox, CTO – Local Motors

 

 

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