fish fry
Subscribe Now

The Sustainment Slog

Product Pruning and Finding Your Point of No Return

When does sustainment become a slog? When does the bottom one percent of your sales become too much to bear? In this week’s Fish Fry, we are diving into the world of OEM product management with Ethan Plotkin and Siku Thompson from GDCA. Ethan, Siku and I discuss supply chain trust, integrated sustainment, and the hidden costs associated with ad hoc orders. Also this week, we take a closer look at some revolutionary new research from Johns Hopkins Applied Physics Lab that is creating drinking water from atmospheric humidity with a little help from metal-organic frameworks.

Click here to download this episode

Links for February 7, 2020

More information about GDCA

More information about 2020 Embedded Tech Trends

Whitepaper: Reversible Atmospheric Water Harvesting Using Metal-Organic Frameworks

Video: Extracting Water from Thin Air

Click here to check out the Fish Fry Archive.

Click here to subscribe to Fish Fry via Podbean

Click here to get the Fish Fry RSS Feed

Click here to subscribe to Fish Fry via iTunes.

 

Fish Fry Executive Interviews

Anupam Bakshi, CEO – Agnisys

Dave Kleidermacher, CTO – Green Hills Software

Robert Blake, CEO – Achronix

Jack Harding, CEO – eSilicon

Michiel Ligthart, COO – Verific

Adnan Hamid, CEO – Breker Technologies

Simon Davidmann, CEO – Imperas

Ted Miracco, CEO – SmartFlow Compliance Solutions

Jessica Gomez – Rogue Valley Microdevices

Shishpal Rawat, Chairman – Accellera Systems Initiative

Kevin Bromber, CEO – myDevices

Daniel Hansson, CEO – Verifyter

Mark Papermaster, CTO – AMD

David Fried, CTO – Coventor

Dr. Steven LeBoeuf, President – Valencell

David Dutton, CEO – Silvaco

Bob Niemiec, CEO – TwistThink

Allan Martinson, COO – Starship Technologies

Zhihong Liu, Chairman and CEO – ProPlus Solutions

Taher Madraswala, CEO and President – Open-Silicon

Kapil Shankar, CEO and Director – AnDAPT

Dan Fox, CTO – Local Motors

David Su, CEO – Atomic Technologies

 

Leave a Reply

featured blogs
Oct 27, 2020
As we continue this blog series, we'€™re going to keep looking at System Design and Verification Online Training courses. In Part 1 , we went over Verilog language and application, Xcelium simulator,... [[ Click on the title to access the full blog on the Cadence Community...
Oct 27, 2020
Back in January 2020, we rolled out a new experience for component data for our discrete wire products. This update has been very well received. In that blog post, we promised some version 2 updates that would better organize the new data. With this post, we’re happy to...
Oct 26, 2020
Do you have a gadget or gizmo that uses sensors in an ingenious or frivolous way? If so, claim your 15 minutes of fame at the virtual Sensors Innovation Fall Week event....
Oct 23, 2020
[From the last episode: We noted that some inventions, like in-memory compute, aren'€™t intuitive, being driven instead by the math.] We have one more addition to add to our in-memory compute system. Remember that, when we use a regular memory, what goes in is an address '...

featured video

Demo: Inuitive NU4000 SoC with ARC EV Processor Running SLAM and CNN

Sponsored by Synopsys

Autonomous vehicles, robotics, augmented and virtual reality all require simultaneous localization and mapping (SLAM) to build a map of the surroundings. Combining SLAM with a neural network engine adds intelligence, allowing the system to identify objects and make decisions. In this demo, Synopsys ARC EV processor’s vision engine (VPU) accelerates KudanSLAM algorithms by up to 40% while running object detection on its CNN engine.

Click here for more information about DesignWare ARC EV Processors for Embedded Vision

featured Paper

New package technology improves EMI and thermal performance with smaller solution size

Sponsored by Texas Instruments

Power supply designers have a new tool in their effort to achieve balance between efficiency, size, and thermal performance with DC/DC power modules. The Enhanced HotRod™ QFN package technology from Texas Instruments enables engineers to address design challenges with an easy-to-use footprint that resembles a standard QFN. This new package type combines the advantages of flip-chip-on-lead with the improved thermal performance presented by a large thermal die attach pad (DAP).

Click here to download the whitepaper

Featured Chalk Talk

A New Perspective on Materialism

Sponsored by Mouser Electronics and KEMET

When choosing capacitors or other passive components, it’s easy to get bogged down in the datasheets. But, how often do you think about the properties of the materials these components are made from? In this episode of Chalk Talk, Amelia Dalton and Patrik Kalbermatten of KEMET take a fascinating look at material classification, the role of ferrite in systems, and the development of metal composite piezo ceramic powders to give us sustainable sources for our component materials.

Click here for more information about KEMET Electronics Sensor Components