EEJournal

fish fry
Subscribe Now
May 10, 2019

The Communication Super Highway

Fiber Optics and the New Age of Ruggedized Communication
by Amelia Dalton

Optical communication takes center stage in this week’s episode of Amelia’s Weekly Fish Fry. First up, Mark Benton (TE Connectivity) and I chat about the different levels where optics can exist in the world of electronic packaging and the how the most recent advancements in ruggedized fiber optic technology have ushered in a whole new era of box to box and PC to PC communication. Also this week, Patrick Mechin (Techway) joins us to discuss the biggest trends in rugged optical communication today and why signal integrity in these environments is more important than ever before.

 

Click here to download this episode.

Links for May 10, 2019

More information about TE Connectivity

More information about TE Connectivity’s Rugged Fiber Optic Products

More information about Techway SAS

Get Even More From Tektronix with the Chance to Win a Trip to Shanghai or a New Next Generation Oscilloscope! (Click to enter)

Click here to check out the Fish Fry Archive.

Click here to subscribe to Fish Fry via Podbean

Click here to get the Fish Fry RSS Feed

Click here to subscribe to Fish Fry via iTunes.

 

Fish Fry Executive Interviews

Anupam Bakshi, CEO – Agnisys

Dave Kleidermacher, CTO – Green Hills Software

Robert Blake, CEO – Achronix

Jack Harding, CEO – eSilicon

Michiel Ligthart, COO – Verific

Adnan Hamid, CEO – Breker Technologies

Simon Davidmann, CEO – Imperas

Ted Miracco, CEO – SmartFlow Compliance Solutions

Jessica Gomez – Rogue Valley Microdevices

Shishpal Rawat, Chairman – Accellera Systems Initiative

Kevin Bromber, CEO – myDevices

Daniel Hansson, CEO – Verifyter

Mark Papermaster, CTO – AMD

David Fried, CTO – Coventor

Dr. Steven LeBoeuf, President – Valencell

David Dutton, CEO – Silvaco

Bob Niemiec, CEO – TwistThink

Allan Martinson, COO – Starship Technologies

Zhihong Liu, Chairman and CEO – ProPlus Solutions

Taher Madraswala, CEO and President – Open-Silicon

Kapil Shankar, CEO and Director – AnDAPT

Dan Fox, CTO – Local Motors

Lawrence Cooke, Founder and CEO — NovaSolix

Gregg Recupero, CTO — Performance-IP

Alan Grau, CEO — Icon Labs

Carl Alberty, Vice President – Cirrus Logic

Maximilian Odendahl, CEO — Silexica

Finbarr Moynihan, General Manager — MediaTek

Sanjay Pillay, CEO — Austemper

Louis Parks, CEO – SecureRF

Harold Blomquist, CEO – Helix Semiconductor

Dale Dougherty and Sherry Huss, Co-Founders – Maker Faire

Mike Wisart, CEO – efabless

Chris Giovanniello, SVP and Co-Founder – Menlo Micro

Jake Janovetz, President – Opal Kelly

Jerry Gipper, Executive Director – VITA

Ethan Plotkin, CEO – GDCA

Xin Song, CEO – Bottos

Chris Dries, CEO – UnitedSiC 

Bob Smith, Executive Director – ESD Alliance 

Rick O’Connor, Executive Director – RISC V Foundation

Naveed Sherwani, CEO and Yunsup Lee, CTO/Founder- SiFIve

Doug Letcher, CEO and President – Metrics Technologies

Jun Pei, CEO – Cepton Technologies

Nikos Zervas, CEO – CAST

Dave Hughes, CEO – HCC Embedded

David Su, CEO – Atomic Technologies

Jess Isquith, President/CEO – PICMG

Leave a Reply

featured blogs
Must-Have Reads from No Starch Press
Jul 20, 2024
If you are looking for great technology-related reads, here are some offerings that I cannot recommend highly enough....
More from Max's Cool Beans...

featured video

Larsen & Toubro Builds Data Centers with Effective Cooling Using Cadence Reality DC Design

Sponsored by Cadence Design Systems

Larsen & Toubro built the world’s largest FIFA stadium in Qatar, the world’s tallest statue, and one of the world’s most sophisticated cricket stadiums. Their latest business venture? Designing data centers. Since IT equipment in data centers generates a lot of heat, it’s important to have an efficient and effective cooling system. Learn why, Larsen & Toubro use Cadence Reality DC Design Software for simulation and analysis of the cooling system.

Click here for more information about Cadence Multiphysics System Analysis

featured chalk talk

TE Connectivity MULTIGIG RT Connectors
Sponsored by Mouser Electronics and TE Connectivity
In this episode of Chalk Talk, Amelia Dalton and Ryan Hill from TE Connectivity explore the benefits of TE’s Multigig RT Connectors and how these connectors can help empower the next generation of military and aerospace designs. They examine the components included in these solutions and how the modular design of these connectors make them a great fit for your next military and aerospace design.
Click here for more information about TE Connectivity MULTIGIG RT Solder Tail Connector
Mar 19, 2024
18,001 views