fish fry
Subscribe Now

The Communication Super Highway

Fiber Optics and the New Age of Ruggedized Communication

Optical communication takes center stage in this week’s episode of Amelia’s Weekly Fish Fry. First up, Mark Benton (TE Connectivity) and I chat about the different levels where optics can exist in the world of electronic packaging and the how the most recent advancements in ruggedized fiber optic technology have ushered in a whole new era of box to box and PC to PC communication. Also this week, Patrick Mechin (Techway) joins us to discuss the biggest trends in rugged optical communication today and why signal integrity in these environments is more important than ever before.

 

Click here to download this episode.

Links for May 10, 2019

More information about TE Connectivity

More information about TE Connectivity’s Rugged Fiber Optic Products

More information about Techway SAS

Get Even More From Tektronix with the Chance to Win a Trip to Shanghai or a New Next Generation Oscilloscope! (Click to enter)

Click here to check out the Fish Fry Archive.

Click here to subscribe to Fish Fry via Podbean

Click here to get the Fish Fry RSS Feed

Click here to subscribe to Fish Fry via iTunes.

 

Fish Fry Executive Interviews

Anupam Bakshi, CEO – Agnisys

Dave Kleidermacher, CTO – Green Hills Software

Robert Blake, CEO – Achronix

Jack Harding, CEO – eSilicon

Michiel Ligthart, COO – Verific

Adnan Hamid, CEO – Breker Technologies

Simon Davidmann, CEO – Imperas

Ted Miracco, CEO – SmartFlow Compliance Solutions

Jessica Gomez – Rogue Valley Microdevices

Shishpal Rawat, Chairman – Accellera Systems Initiative

Kevin Bromber, CEO – myDevices

Daniel Hansson, CEO – Verifyter

Mark Papermaster, CTO – AMD

David Fried, CTO – Coventor

Dr. Steven LeBoeuf, President – Valencell

David Dutton, CEO – Silvaco

Bob Niemiec, CEO – TwistThink

Allan Martinson, COO – Starship Technologies

Zhihong Liu, Chairman and CEO – ProPlus Solutions

Taher Madraswala, CEO and President – Open-Silicon

Kapil Shankar, CEO and Director – AnDAPT

Dan Fox, CTO – Local Motors

David Su, CEO – Atomic Technologies

Leave a Reply

featured blogs
Apr 13, 2021
We explain the NHTSA's latest automotive cybersecurity best practices, including guidelines to protect automotive ECUs and connected vehicle technologies. The post NHTSA Shares Best Practices for Improving Autmotive Cybersecurity appeared first on From Silicon To Software....
Apr 13, 2021
If a picture is worth a thousand words, a video tells you the entire story. Cadence's subsystem SoC silicon for PCI Express (PCIe) 5.0 demo video shows you how we put together the latest... [[ Click on the title to access the full blog on the Cadence Community site. ]]...
Apr 12, 2021
The Semiconductor Ecosystem- It is the definition of '€œHigh Tech'€, but it isn'€™t just about… The post Calibre and the Semiconductor Ecosystem appeared first on Design with Calibre....
Apr 8, 2021
We all know the widespread havoc that Covid-19 wreaked in 2020. While the electronics industry in general, and connectors in particular, took an initial hit, the industry rebounded in the second half of 2020 and is rolling into 2021. Travel came to an almost stand-still in 20...

featured video

The Verification World We Know is About to be Revolutionized

Sponsored by Cadence Design Systems

Designs and software are growing in complexity. With verification, you need the right tool at the right time. Cadence® Palladium® Z2 emulation and Protium™ X2 prototyping dynamic duo address challenges of advanced applications from mobile to consumer and hyperscale computing. With a seamlessly integrated flow, unified debug, common interfaces, and testbench content across the systems, the dynamic duo offers rapid design migration and testing from emulation to prototyping. See them in action.

Click here for more information

featured paper

Understanding the Foundations of Quiescent Current in Linear Power Systems

Sponsored by Texas Instruments

Minimizing power consumption is an important design consideration, especially in battery-powered systems that utilize linear regulators or low-dropout regulators (LDOs). Read this new whitepaper to learn the fundamentals of IQ in linear-power systems, how to predict behavior in dropout conditions, and maintain minimal disturbance during the load transient response.

Click here to download the whitepaper

featured chalk talk

TDK Magnetic Sheets For EMI and NFC Applications

Sponsored by Mouser Electronics and TDK

Today’s dense, complex designs can be extremely challenging from an EMI perspective. Re-designs of PCBs to eliminate problems can be expensive and time consuming, and a manufacturing solution can be preferable. In this episode of Chalk Talk, Amelia Dalton chats with Chris Burket of TDX about Flexield noise suppression sheets, which may be just what your design needs to get EMI under control.

Click here for more information about TDK Flexield Noise Suppression Sheets