EEJournal

fish fry
Subscribe Now
June 28, 2019

The Next Generation of Engineering

Machine Learning, EDA, and a New Quantum State
by Amelia Dalton

“Man’s relationship with technology is complex. We always invent technology, but then technology comes back and reinvents us” ― Atul Jalan

In this week’s episode of Fish Fry, we investigate the complex role of machine learning in the future of design automation. Norman Chang (ANSYS) joins us to discuss how machine learning will not only change the course of the evolution of EDA but also how we deal with design for reliability and FinFET degradation. Also this week, we check out a newly discovered form of electronic matter called the Vestigial Nematic State and how it was identified with a little help from a suite of especially trained neural networks.

Click here to download this episode

Links for June 28, 2019

Machine Learning helps solve a puzzle of how strongly interacting electrons behave at atomic level

Machine learning in electronic-quantum-matter imaging experiments (Whitepaper)

More information about ANSYS Semiconductor Solutions

 

Click here to check out the Fish Fry Archive.

Click here to subscribe to Fish Fry via Podbean

Click here to get the Fish Fry RSS Feed

Click here to subscribe to Fish Fry via iTunes.

 

Fish Fry Executive Interviews

Anupam Bakshi, CEO – Agnisys

Dave Kleidermacher, CTO – Green Hills Software

Robert Blake, CEO – Achronix

Jack Harding, CEO – eSilicon

Michiel Ligthart, COO – Verific

Adnan Hamid, CEO – Breker Technologies

Simon Davidmann, CEO – Imperas

Ted Miracco, CEO – SmartFlow Compliance Solutions

Jessica Gomez – Rogue Valley Microdevices

Shishpal Rawat, Chairman – Accellera Systems Initiative

Kevin Bromber, CEO – myDevices

Daniel Hansson, CEO – Verifyter

Mark Papermaster, CTO – AMD

David Fried, CTO – Coventor

Dr. Steven LeBoeuf, President – Valencell

David Dutton, CEO – Silvaco

Bob Niemiec, CEO – TwistThink

Allan Martinson, COO – Starship Technologies

Zhihong Liu, Chairman and CEO – ProPlus Solutions

Taher Madraswala, CEO and President – Open-Silicon

Kapil Shankar, CEO and Director – AnDAPT

Dan Fox, CTO – Local Motors

Lawrence Cooke, Founder and CEO — NovaSolix

Gregg Recupero, CTO — Performance-IP

Alan Grau, CEO — Icon Labs

Carl Alberty, Vice President – Cirrus Logic

Maximilian Odendahl, CEO — Silexica

Finbarr Moynihan, General Manager — MediaTek

Sanjay Pillay, CEO — Austemper

Louis Parks, CEO – SecureRF

Harold Blomquist, CEO – Helix Semiconductor

Dale Dougherty and Sherry Huss, Co-Founders – Maker Faire

Mike Wisart, CEO – efabless

Chris Giovanniello, SVP and Co-Founder – Menlo Micro

Jake Janovetz, President – Opal Kelly

Jerry Gipper, Executive Director – VITA

Ethan Plotkin, CEO – GDCA

Xin Song, CEO – Bottos

Chris Dries, CEO – UnitedSiC 

Bob Smith, Executive Director – ESD Alliance 

Rick O’Connor, Executive Director – RISC V Foundation

Naveed Sherwani, CEO and Yunsup Lee, CTO/Founder- SiFIve

Doug Letcher, CEO and President – Metrics Technologies

Jun Pei, CEO – Cepton Technologies

Nikos Zervas, CEO – CAST

Dave Hughes, CEO – HCC Embedded

David Su, CEO – Atomic Technologies

Jess Isquith, President/CEO – PICMG

Leave a Reply

featured blogs
BoardSurfers: Training Insights: Design Effortlessly Using Structures in Allegro X
Apr 25, 2024
Structures in Allegro X layout editors let you create reusable building blocks for your PCBs, saving you time and ensuring consistency. What are Structures? Structures are pre-defined groups of design objects, such as vias, connecting lines (clines), and shapes. You can combi...
More from Cadence...
Want to Mix and Match Dies in a Single Package? UCIe Can Get You There
Apr 25, 2024
See how the UCIe protocol creates multi-die chips by connecting chiplets from different vendors and nodes, and learn about the role of IP and specifications.The post Want to Mix and Match Dies in a Single Package? UCIe Can Get You There appeared first on Chip Design....
More from Synopsys...
One Robotic Step Closer to Humanoid Robots in the Home
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...
More from Max's Cool Beans...

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

VITA RF Product Portfolio: Enabling An OpenVPX World
Sponsored by Mouser Electronics and Amphenol
Interoperability is a very valuable aspect of military and aerospace electronic designs and is a cornerstone to VITA, OpenVPX and SOSA. In this episode of Chalk Talk, Amelia Dalton and Eddie Alexander from Amphenol SV explore Amphenol SV’s portfolio of VITA RF solutions. They also examine the role that SOSA plays in the development of military and aerospace systems and how you can utilize Amphenol SV’s VITA RF solutions in your next design.
Click here for more information about Amphenol / SV Microwave VITA Connector Systems
Oct 25, 2023
23,956 views