fish fry
Subscribe Now

Terrible Things to Scare the Children: #adifferenthalloween with element14

It’s creepy! It’s crawly! It’s a design contest too! In this week’s Fish Fry podcast, Phil Hutchinson (element14) brings us the goods on this year’s spookily spectacular element14 Halloween design competition. Phil and I chat about some of last year’s creepy creations, why this year’s contest is slightly different than the year before, and how you can enter this unique Halloween design competition. Also this week, I check out how a group of astronomers discovered the oldest known black hole and why this discovery may help unlock the mysteries of the evolution of black holes.

 

Click here to download this episode

 

Links for October 16, 2020

More information about #adifferenthalloween – the element14 Community Halloween Project Competition 

ESO telescope spots galaxies trapped in the web of a supermassive black hole

Large simulation finds new origin of supermassive black holes

 

Click here to check out the Fish Fry Archive.

Click here to subscribe to Fish Fry via Podbean

Click here to get the Fish Fry RSS Feed

Click here to subscribe to Fish Fry via iTunes.

Click here to subscribe to Fish Fry via Spotify

 

Fish Fry Executive Interviews

Anupam Bakshi, CEO – Agnisys

Dave Kleidermacher, CTO – Green Hills Software

Robert Blake, CEO – Achronix

Jack Harding, CEO – eSilicon

Michiel Ligthart, COO – Verific

Adnan Hamid, CEO – Breker Technologies

Simon Davidmann, CEO – Imperas

Ted Miracco, CEO – SmartFlow Compliance Solutions

Jessica Gomez – Rogue Valley Microdevices

Shishpal Rawat, Chairman – Accellera Systems Initiative

Kevin Bromber, CEO – myDevices

Daniel Hansson, CEO – Verifyter

Mark Papermaster, CTO – AMD

David Fried, CTO – Coventor

Dr. Steven LeBoeuf, President – Valencell

David Dutton, CEO – Silvaco

Bob Niemiec, CEO – TwistThink

Allan Martinson, COO – Starship Technologies

Zhihong Liu, Chairman and CEO – ProPlus Solutions

Taher Madraswala, CEO and President – Open-Silicon

Kapil Shankar, CEO and Director – AnDAPT

Dan Fox, CTO – Local Motors

 

Leave a Reply

featured blogs
Oct 23, 2020
Processing a component onto a PCB used to be fairly straightforward. Through hole products, a single or double row surface mount with a larger center-line rarely offer unique challenges obtaining a proper solder joint. However, as electronics continue to get smaller and conne...
Oct 23, 2020
[From the last episode: We noted that some inventions, like in-memory compute, aren'€™t intuitive, being driven instead by the math.] We have one more addition to add to our in-memory compute system. Remember that, when we use a regular memory, what goes in is an address '...
Oct 23, 2020
Any suggestions for a 4x4 keypad in which the keys aren'€™t wobbly and you don'€™t have to strike a key dead center for it to make contact?...
Oct 23, 2020
At 11:10am Korean time this morning, Cadence's Elias Fallon delivered one of the keynotes at ISOCC (International System On Chip Conference). It was titled EDA and Machine Learning: The Next Leap... [[ Click on the title to access the full blog on the Cadence Community ...

featured video

Demo: Low-Power Machine Learning Inference with DesignWare ARC EM9D Processor IP

Sponsored by Synopsys

Applications that require sensing on a continuous basis are always on and often battery operated. In this video, the low-power ARC EM9D Processors run a handwriting character recognition neural network graph to infer the letter that is written.

Click here for more information about DesignWare ARC EM9D / EM11D Processors

featured Paper

New package technology improves EMI and thermal performance with smaller solution size

Sponsored by Texas Instruments

Power supply designers have a new tool in their effort to achieve balance between efficiency, size, and thermal performance with DC/DC power modules. The Enhanced HotRod™ QFN package technology from Texas Instruments enables engineers to address design challenges with an easy-to-use footprint that resembles a standard QFN. This new package type combines the advantages of flip-chip-on-lead with the improved thermal performance presented by a large thermal die attach pad (DAP).

Click here to download the whitepaper

Featured Chalk Talk

Use of Advanced Sensors in Smart Industry Applications

Sponsored by Mouser Electronics and ST Microelectronics

In industrial systems, sensors can give us real-time information about the condition and operation critical machinery. By monitoring vibration, temperature, and other factors, we can get early warning of failures and do predictive maintenance - avoiding costly downtime. In this episode of Chalk Talk, Amelia Dalton chats with Manuel Cantone of ST Microelectronics about the SensorTile Wireless Industrial Node - an integrated solution that makes industrial monitoring a snap.

More information about STMicroelectronics STWIN SensorTile Wireless Industrial Node