fish fry
Subscribe Now

Small is Beautiful: Trends in Small Rugged Form Factors and Making Fossil Fuels into Diamonds

You’ve got to think about big things while you’re doing small things, so that all the small things go in the right direction. – Alvin Toffler

What if we could use something that is universally hated to create something that most everyone loves? In this weeks podcast, we start things off with an investigation into how a group of researchers have created the first “clean process” synthetic diamond from petroleum and natural gas. Also this week, Ivan Straznicky (Curtiss-Wright) and I discuss the challenges of ruggedized small form factor designs and why he believes it is time for a new standards in this space.

 

Click here to download this episode

Links for March 13, 2020

More information about Curtiss-Wright

Facile diamond synthesis from lower diamondoids (Science Advances)

Stanford research maps a faster, easier way to build diamond (Standford News)

 

Click here to check out the Fish Fry Archive.

Click here to subscribe to Fish Fry via Podbean

Click here to get the Fish Fry RSS Feed

Click here to subscribe to Fish Fry via iTunes.

 

Fish Fry Executive Interviews

Anupam Bakshi, CEO – Agnisys

Dave Kleidermacher, CTO – Green Hills Software

Robert Blake, CEO – Achronix

Jack Harding, CEO – eSilicon

Michiel Ligthart, COO – Verific

Adnan Hamid, CEO – Breker Technologies

Simon Davidmann, CEO – Imperas

Ted Miracco, CEO – SmartFlow Compliance Solutions

Jessica Gomez – Rogue Valley Microdevices

Shishpal Rawat, Chairman – Accellera Systems Initiative

Kevin Bromber, CEO – myDevices

Daniel Hansson, CEO – Verifyter

Mark Papermaster, CTO – AMD

David Fried, CTO – Coventor

Dr. Steven LeBoeuf, President – Valencell

David Dutton, CEO – Silvaco

Bob Niemiec, CEO – TwistThink

Allan Martinson, COO – Starship Technologies

Zhihong Liu, Chairman and CEO – ProPlus Solutions

Taher Madraswala, CEO and President – Open-Silicon

Kapil Shankar, CEO and Director – AnDAPT

Dan Fox, CTO – Local Motors

David Su, CEO – Atomic Technologies

Leave a Reply

featured blogs
Dec 7, 2023
Building on the success of previous years, the 2024 edition of the DATE (Design, Automation and Test in Europe) conference will once again include the Young People Programme. The largest electronic design automation (EDA) conference in Europe, DATE will be held on 25-27 March...
Dec 7, 2023
Explore the different memory technologies at the heart of AI SoC memory architecture and learn about the advantages of SRAM, ReRAM, MRAM, and beyond.The post The Importance of Memory Architecture for AI SoCs appeared first on Chip Design....
Nov 6, 2023
Suffice it to say that everyone and everything in these images was shot in-camera underwater, and that the results truly are haunting....

featured video

Dramatically Improve PPA and Productivity with Generative AI

Sponsored by Cadence Design Systems

Discover how you can quickly optimize flows for many blocks concurrently and use that knowledge for your next design. The Cadence Cerebrus Intelligent Chip Explorer is a revolutionary, AI-driven, automated approach to chip design flow optimization. Block engineers specify the design goals, and generative AI features within Cadence Cerebrus Explorer will intelligently optimize the design to meet the power, performance, and area (PPA) goals in a completely automated way.

Click here for more information

featured paper

3D-IC Design Challenges and Requirements

Sponsored by Cadence Design Systems

While there is great interest in 3D-IC technology, it is still in its early phases. Standard definitions are lacking, the supply chain ecosystem is in flux, and design, analysis, verification, and test challenges need to be resolved. Read this paper to learn about design challenges, ecosystem requirements, and needed solutions. While various types of multi-die packages have been available for many years, this paper focuses on 3D integration and packaging of multiple stacked dies.

Click to read more

featured chalk talk

Littelfuse Protection IC (eFuse)
If you are working on an industrial, consumer, or telecom design, protection ICs can offer a variety of valuable benefits including reverse current protection, over temperature protection, short circuit protection, and a whole lot more. In this episode of Chalk Talk, Amelia Dalton and Pete Pytlik from Littelfuse explore the key features of protection ICs, how protection ICs compare to conventional discrete component solutions, and how you can take advantage of Littelfuse protection ICs in your next design.
May 8, 2023
27,254 views