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Reliability’s Road

Automotive Mixed Signal Chips, Defect Analysis, and Where We Go From Here

“The road to success is paved with the hot asphalt of failure.” ― Craig D. Lounsbrough

In this week’s episode of Fish Fry, we take an in-depth look at the complex reliability issues present in today’s automotive designs. Hany Elhak (Cadence Design Systems) and I chat about the role that mixed-signal chips play in the automotive ecosystem, the reality of defect analysis in the world of analog design today, and why transistor degradation it is even more important now than ever before. Also this week, we check out the details of three new automotive-based design contests rolled out by Ennomotive and Grupo Antolin.

Click here to download this episode

Links for May 17, 2019

ennomotive and Grupo Antolin launch the first three technological challenges of the ANTOLIN i.JUMP open innovation program.

Enter to win an ennomotive design challenge

More information about Cadence’s Legato Reliability Solution

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Anupam Bakshi, CEO – Agnisys

Dave Kleidermacher, CTO – Green Hills Software

Robert Blake, CEO – Achronix

Jack Harding, CEO – eSilicon

Michiel Ligthart, COO – Verific

Adnan Hamid, CEO – Breker Technologies

Simon Davidmann, CEO – Imperas

Ted Miracco, CEO – SmartFlow Compliance Solutions

Jessica Gomez – Rogue Valley Microdevices

Shishpal Rawat, Chairman – Accellera Systems Initiative

Kevin Bromber, CEO – myDevices

Daniel Hansson, CEO – Verifyter

Mark Papermaster, CTO – AMD

David Fried, CTO – Coventor

Dr. Steven LeBoeuf, President – Valencell

David Dutton, CEO – Silvaco

Bob Niemiec, CEO – TwistThink

Allan Martinson, COO – Starship Technologies

Zhihong Liu, Chairman and CEO – ProPlus Solutions

Taher Madraswala, CEO and President – Open-Silicon

Kapil Shankar, CEO and Director – AnDAPT

Dan Fox, CTO – Local Motors

David Su, CEO – Atomic Technologies

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