fish fry
Subscribe Now

Hearing is Believing: Artificial Intelligence, Cough Patterns, and Stemming the Tide of COVID-19

One person’s data is another person’s noise.” – K.C. Cole

This week’s Fish Fry podcast is all about noisy neurons, cough signature identification, and how AI can help us stem the tide of COVID-19. First up, we check out new research from the German Center for Neurodegenerative Diseases that may have finally unlocked the mysteries of memory retention in people afflicted with Alzheimer’s disease with a little help from a bunch of mice and some very noisy neurons. Also this week, Chris Rogers (CEO – SensiML) joins us to chat about a new health monitoring solution to help fight the COVID-19 pandemic. We discuss the role of artificial intelligence in this solution and how this new platform may help detect symptoms earlier than before with identification of cough sounds.

Click here to download this episode

 

Links for June 12, 2020

More information about SensiML
SensiML Uses AI Technology to Help Fight COVID-19 Global Pandemic

SkyWater Chosen for Volume U.S. Manufacturing of Temperature Sensing Chip for Low-Cost Wearable Solution that Detects Early Stage Symptom of COVID-19
Alzheimer Research: Noise-inducing neurons shut down memories

Memory trace interference impairs recall in a mouse model of Alzheimer’s disease (Whitepaper)

Click here to check out the Fish Fry Archive.

Click here to subscribe to Fish Fry via Podbean

Click here to get the Fish Fry RSS Feed

Click here to subscribe to Fish Fry via iTunes.

Click here to subscribe to Fish Fry via Spotify

 

Fish Fry Executive Interviews

Anupam Bakshi, CEO – Agnisys

Dave Kleidermacher, CTO – Green Hills Software

Robert Blake, CEO – Achronix

Jack Harding, CEO – eSilicon

Michiel Ligthart, COO – Verific

Adnan Hamid, CEO – Breker Technologies

Simon Davidmann, CEO – Imperas

Ted Miracco, CEO – SmartFlow Compliance Solutions

Jessica Gomez – Rogue Valley Microdevices

Shishpal Rawat, Chairman – Accellera Systems Initiative

Kevin Bromber, CEO – myDevices

Daniel Hansson, CEO – Verifyter

Mark Papermaster, CTO – AMD

David Fried, CTO – Coventor

Dr. Steven LeBoeuf, President – Valencell

David Dutton, CEO – Silvaco

Bob Niemiec, CEO – TwistThink

Allan Martinson, COO – Starship Technologies

Zhihong Liu, Chairman and CEO – ProPlus Solutions

Taher Madraswala, CEO and President – Open-Silicon

Kapil Shankar, CEO and Director – AnDAPT

Dan Fox, CTO – Local Motors

 

One thought on “Hearing is Believing: Artificial Intelligence, Cough Patterns, and Stemming the Tide of COVID-19”

Leave a Reply

featured blogs
Dec 7, 2023
Building on the success of previous years, the 2024 edition of the DATE (Design, Automation and Test in Europe) conference will once again include the Young People Programme. The largest electronic design automation (EDA) conference in Europe, DATE will be held on 25-27 March...
Dec 7, 2023
Explore the different memory technologies at the heart of AI SoC memory architecture and learn about the advantages of SRAM, ReRAM, MRAM, and beyond.The post The Importance of Memory Architecture for AI SoCs appeared first on Chip Design....
Nov 6, 2023
Suffice it to say that everyone and everything in these images was shot in-camera underwater, and that the results truly are haunting....

featured video

Dramatically Improve PPA and Productivity with Generative AI

Sponsored by Cadence Design Systems

Discover how you can quickly optimize flows for many blocks concurrently and use that knowledge for your next design. The Cadence Cerebrus Intelligent Chip Explorer is a revolutionary, AI-driven, automated approach to chip design flow optimization. Block engineers specify the design goals, and generative AI features within Cadence Cerebrus Explorer will intelligently optimize the design to meet the power, performance, and area (PPA) goals in a completely automated way.

Click here for more information

featured paper

3D-IC Design Challenges and Requirements

Sponsored by Cadence Design Systems

While there is great interest in 3D-IC technology, it is still in its early phases. Standard definitions are lacking, the supply chain ecosystem is in flux, and design, analysis, verification, and test challenges need to be resolved. Read this paper to learn about design challenges, ecosystem requirements, and needed solutions. While various types of multi-die packages have been available for many years, this paper focuses on 3D integration and packaging of multiple stacked dies.

Click to read more

featured chalk talk

Must be Thin to Fit: µModule Regulators
In this episode of Chalk Talk, Amelia Dalton and Younes Salami from Analog Devices explore the benefits and restrictions of Analog Devices µModule regulators. They examine how these µModule regulators can declutter PCB area and increase the system performance of your next design, and the variety of options that Analog Devices offers within their Ultrathin µModule® regulator product portfolio.
Dec 5, 2023
405 views