fish fry
Subscribe Now

Communication Breakdown

Cyber-physical Challenges, LIDAR’s Gold Rush, and Adventures in Packaging

In this week’s Fish Fry podcast, we start things off with an investigation into the cyber-physical world with Ian Dennison from Cadence Design Systems. Ian and I talk about the challenges of connecting the physical world with the virtual world of information processing and why we are experiencing a “Gold Rush” in LiDAR these days. Also this week, I sit down with Dave Caserza and Ken Grob from Elma Electronic to discuss the evolution of packaging standards and why guidance for new system architectures is needed today more than ever before. To finish up this week’s podcast, I take a closer look at how Singapore’s Nanyang Technological University is using sunlight to convert plastic waste into the building blocks for future fuel cell innovation.

 

Click here to download this episode

 

Links for December 13, 2019

More information about Cadence’s Automotive Solutions

More information about Elma Electronic

​NTU Singapore scientists convert plastics into useful chemicals using sunlight

Visible Light–Driven Cascade Carbon–Carbon Bond Scission for Organic Transformations and Plastics Recycling (Whitepaper)

The world’s first formic acid-based fuel cell

 

Click here to check out the Fish Fry Archive.

Click here to subscribe to Fish Fry via Podbean

Click here to get the Fish Fry RSS Feed

Click here to subscribe to Fish Fry via iTunes.

 

Fish Fry Executive Interviews

Anupam Bakshi, CEO – Agnisys

Dave Kleidermacher, CTO – Green Hills Software

Robert Blake, CEO – Achronix

Jack Harding, CEO – eSilicon

Michiel Ligthart, COO – Verific

Adnan Hamid, CEO – Breker Technologies

Simon Davidmann, CEO – Imperas

Ted Miracco, CEO – SmartFlow Compliance Solutions

Jessica Gomez – Rogue Valley Microdevices

Shishpal Rawat, Chairman – Accellera Systems Initiative

Kevin Bromber, CEO – myDevices

Daniel Hansson, CEO – Verifyter

Mark Papermaster, CTO – AMD

David Fried, CTO – Coventor

Dr. Steven LeBoeuf, President – Valencell

David Dutton, CEO – Silvaco

Bob Niemiec, CEO – TwistThink

Allan Martinson, COO – Starship Technologies

Zhihong Liu, Chairman and CEO – ProPlus Solutions

Taher Madraswala, CEO and President – Open-Silicon

Kapil Shankar, CEO and Director – AnDAPT

Dan Fox, CTO – Local Motors

David Su, CEO – Atomic Technologies

 

 

Leave a Reply

featured blogs
May 21, 2022
May is Asian American and Pacific Islander (AAPI) Heritage Month. We would like to spotlight some of our incredible AAPI-identifying employees to celebrate. We recognize the important influence that... ...
May 20, 2022
I'm very happy with my new OMTech 40W CO2 laser engraver/cutter, but only because the folks from Makers Local 256 helped me get it up and running....
May 19, 2022
Learn about the AI chip design breakthroughs and case studies discussed at SNUG Silicon Valley 2022, including autonomous PPA optimization using DSO.ai. The post Key Highlights from SNUG 2022: AI Is Fast Forwarding Chip Design appeared first on From Silicon To Software....
May 12, 2022
By Shelly Stalnaker Every year, the editors of Elektronik in Germany compile a list of the most interesting and innovative… ...

featured video

Building safer robots with computer vision & AI

Sponsored by Texas Instruments

Watch TI's demo to see how Jacinto™ 7 processors fuse deep learning and traditional computer vision to enable safer autonomous mobile robots.

Watch demo

featured paper

Reduce EV cost and improve drive range by integrating powertrain systems

Sponsored by Texas Instruments

When you can create automotive applications that do more with fewer parts, you’ll reduce both weight and cost and improve reliability. That’s the idea behind integrating electric vehicle (EV) and hybrid electric vehicle (HEV) designs.

Click to read more

featured chalk talk

Small Form Factor Industry Standards for Embedded Computing

Sponsored by Mouser Electronics and Samtec

Trends in today’s embedded computing designs including smart sensors, autonomous vehicles, and edge computing are making embedded computing industry standards more important than ever before. In this episode of Chalk Talk, Amelia Dalton chats with Matthew Burns from Samtec about how standards organizations like PC104, PICMG and VITA s are encouraging innovation in today’s embedded designs, how Samtec supports each one of these standards organizations and how you can utilize Samtec’s high performance interconnects for your next small-form factor embedded computing designs.

Click here for more information about Samtec Industry Standards Solution