fish fry
Subscribe Now

All of the Information: The Good, The Bad, and The Ugly

How Aspinity is Changing the Always-On Game

Did you know that over a hundred devices are connected to the internet every second? In this week’s episode of Fish Fry, we take a closer look at the challenges facing us as we develop the next generation of connected devices. Tom Doyle (CEO – Aspinity) joins me to discuss the details of Aspinity’s innovative RAMP (Reconfigurable Analog Modular Processor) platform, the “deal breakers” as he sees them when it comes to IoT designs, and why the answer to our always-on, always-sensing power challenges is architectural. Also this week, we check out Kickstarter’s Make 100 campaign and a new kind of high-performance multilayer piezo speaker from TDK called PiezoListen.

Click here to download this episode

Links for December 6, 2019

More information about Aspinity

Article by Bryon Moyer: RAMPing Up Always-On AI -Aspinity’s Analog Detector Reduces Power

More information about Kickstarter’s Make 100

New episode of Chalk Talk: PiezoListen – A New Kind of Speaker for New Applications

 

Click here to check out the Fish Fry Archive.

Click here to subscribe to Fish Fry via Podbean

Click here to get the Fish Fry RSS Feed

Click here to subscribe to Fish Fry via iTunes.

 

Fish Fry Executive Interviews

Anupam Bakshi, CEO – Agnisys

Dave Kleidermacher, CTO – Green Hills Software

Robert Blake, CEO – Achronix

Jack Harding, CEO – eSilicon

Michiel Ligthart, COO – Verific

Adnan Hamid, CEO – Breker Technologies

Simon Davidmann, CEO – Imperas

Ted Miracco, CEO – SmartFlow Compliance Solutions

Jessica Gomez – Rogue Valley Microdevices

Shishpal Rawat, Chairman – Accellera Systems Initiative

Kevin Bromber, CEO – myDevices

Daniel Hansson, CEO – Verifyter

Mark Papermaster, CTO – AMD

David Fried, CTO – Coventor

Dr. Steven LeBoeuf, President – Valencell

David Dutton, CEO – Silvaco

Bob Niemiec, CEO – TwistThink

Allan Martinson, COO – Starship Technologies

Zhihong Liu, Chairman and CEO – ProPlus Solutions

Taher Madraswala, CEO and President – Open-Silicon

Kapil Shankar, CEO and Director – AnDAPT

Dan Fox, CTO – Local Motors

David Su, CEO – Atomic Technologies

 

Leave a Reply

featured blogs
Dec 1, 2020
If you'€™d asked me at the beginning of 2020 as to the chances of my replicating an 1820 Welsh dresser, I would have said '€œzero,'€ which just goes to show how little I know....
Dec 1, 2020
More package designers these days, with the increasing component counts and more complicated electrical constraints, are shifting to using a front-end schematic capture tool. As with IC and PCB... [[ Click on the title to access the full blog on the Cadence Community site. ]...
Dec 1, 2020
UCLA’s Maxx Tepper gives us a brief overview of the Ocean High-Throughput processor to be used in the upgrade of the real-time event selection system of the CMS experiment at the CERN LHC (Large Hadron Collider). The board incorporates Samtec FireFly'„¢ optical cable ...
Nov 25, 2020
[From the last episode: We looked at what it takes to generate data that can be used to train machine-learning .] We take a break from learning how IoT technology works for one of our occasional posts on how IoT technology is used. In this case, we look at trucking fleet mana...

featured video

Introduction to the fundamental technologies of power density

Sponsored by Texas Instruments

The need for power density is clear, but what are the critical components that enable higher power density? In this overview video, we will provide a deeper understanding of the fundamental principles of high-power-density designs, and demonstrate how partnering with TI, and our advanced technological capabilities can help improve your efforts to achieve those high-power-density figures.

featured paper

Learn how designing small is easier than you think

Sponsored by Texas Instruments

Designing with small-package ICs is easier than you think. Find out how our collection of industry's smallest signal-chain products can help you optimize board space without sacrificing features, cost, simplicity, or reliability in your system.

Click here to download the whitepaper

Featured Chalk Talk

Intel NUC Elements

Sponsored by Mouser Electronics and Intel

Intel Next Unit of Computing (NUC) compute elements are small-form-factor barebone computer kits and components that are perfect for a wide variety of system designs. In this episode of Chalk Talk, Amelia Dalton chats with Kristin Brown of Intel System Product Group about pre-engineered solutions from Intel that can provide the appropriate level of computing power for your next design, with a minimal amount of development effort from your engineering team.

Click here for more information about Intel NUC 8 Compute Element (U-Series)