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MEG-Array® and M Series – Amphenol Communications Solutions and Mouser
October 21, 2024 -- In this episode of Chalk Talk, Jeremy Ellis from Amphenol Communications Solutions and Amelia Dalton chat about the benefits of Amphenol’s MEG-Array and M-Series connector solutions. They also investigate the tooling configurations available for these solutions and how Amphenol’s ball and socket BGA interface can simplify board routing, eliminate press-fit constraints on via and provide excellent SI performance.
More information about Amphenol FCI MEG-Array® Mezzanine Connector System: https://bit.ly/3UjczbJ
XENSIV™ MEMS Microphones Qualified According AEC-Q103 -- Infineon and Mouser
October 15, 2024 -- MEMS based microphone technology can bring a variety of benefits to automotive applications. In this episode of Chalk Talk, Amelia Dalton chats with James Sterling from Infineon about the components included in a MEMS microphone system, the roles that frequency and sensitivity play in microphone enhanced automotive systems, and the benefits that Infineon’s XENSIV™ automotive qualified microphones bring to interior and exterior automotive applications.
More information about Infineon Technologies XENSIV™ MEMS Microphones for Automotive: https://bit.ly/400y1G8
On Board Charger Solutions Enable Vehicle Electrification -- onsemi and Mouser Electronics
October 2, 2024 -- On board charging modules are a key component for a variety of electric cars today and the device selection and topology for these chargers depends on target efficiency, cost and power density. In this episode of Chalk Talk, Amelia Dalton and Kevin Keller from onsemi explore the design considerations for on board chargers, the power requirements needed for these kinds of designs, and the role that packaging plays in the development of on board charging solutions.
More information about onsemi On Board Charging (OBC) Solutions: https://bit.ly/4dw5YRO
ForgeFPGA™: Low Density FPGA Solutions from Renesas -- Renesas and Mouser Electronics
October 1, 2024 -- In this episode of Chalk Talk, Amelia Dalton and Matthew Leonard from Renesas explore the benefits that ForgeFPGAs, low density FPGA solutions from Renesas, bring to a variety of applications including computing and storage, wearables, consumer electronics and more. They also investigate the LUT structure of these low density FPGAs, how these solutions can be utilized for drone sensor aggregation and how Renesas is breaking barriers of entry for FPGA solutions with their ForgeFPGAs.
More information about Renesas Electronics ForgeFPGA™ Low-Density FPGAs: https://bit.ly/3zJCX7B
Pairing Gate Drive to EliteSiC -- onsemi and Mouser Electronics
September 30, 2024 -- In this episode of Chalk Talk, Amelia Dalton and Bob Card from onsemi investigate the role that gate drivers and switches play in high-power mega trend applications. They also explore the benefits that silicon carbide switches bring to these applications, how gate drive is calculated and how onsemi is furthering innovation in wide band gap drivers and switches.
More information about onsemi EliteSiC: https://bit.ly/3NdcCBL
Choosing between GaN, SiC, and traditional Si in your Power Switch Topology -- Infineon and Mouser
September 27, 2024 -- Wide band gap semiconductor materials are great choices for next generation power converter switches. In this episode of Chalk Talk, Amelia Dalton and Matthew Reynolds from Infineon explore the benefits and tradeoffs of GaN, silicon junction and silicon carbide power switching technology, the importance that body diode performance plays in these solutions and how you can take advantage of gallium nitride, silicon carbide, and silicon junction wide band gap power solutions in your next design.
More information about Infineon Technologies CoolSiC™ G2 Silicon Carbide MOSFETs: https://bit.ly/4gVODoH
ECK Series DC Contactors -- TE Connectivity and Mouser Electronics
September 26, 2024 -- In this episode of Chalk Talk, Amelia Dalton and John Hamilton from TE Connectivity chat about the what, where, and how of DC Contactors. They also explore the benefits that these solutions can bring to a variety of e-mobility, warehouse automation and battery management applications, and how you can get started using a TE Connectivity ECK DC Contactor in your next design.
More information about TE Connectivity ECK High-Voltage DC Contactors: https://bit.ly/4duOGow
Routing Signals, Data, and Power in Rugged Applications -- Samtec and Mouser Electronics
September 16, 2024 -- In this episode of Chalk Talk, Amelia Dalton and Matthew Burns from Samtec investigate the design challenges involved with routing signals, data and power in rugged applications. They also explore the benefits that Samtec’s URSA® I/O Ultra Rugged Cable System brings to rugged applications and why the extreme density and the hyperboloid-type contact sets this cable system apart from other solutions on the market today.
More information about Samtec URSA® Ultra Rugged I/O System: https://bit.ly/3XJpZQp
How to Implement Protection and Power Management ICs for Super Capacitors -- Littelfuse and Mouser
September 10, 2024 -- Many super capacitor applications require protection and power backup. In this episode of Chalk Talk, Amelia Dalton and Pete Pytlik from Littelfuse explore the benefits of protection and power management ICs for super capacitor applications. They also investigate how these IC solutions compare with discrete solutions, and the advantages that Littelfuse protection and power management ICs bring to super capacitor applications.
More information about Littelfuse LS0502SCD33S Super Capacitor Protection IC: https://bit.ly/3z0Yjx2
High Power Charging Inlets -- TE Connectivity and Mouser Electronics
August 30, 2024 -- All major truck and bus OEMs will be launching electric vehicle platforms within the next few years and in order to keep pace with on-highway and off-highway EV innovation, our charging inlets must also provide the voltage, current and charging requirements needed for these vehicles. In this episode of Chalk Talk, Amelia Dalton and Drew Reetz from TE Connectivity investigate charging inlet design considerations for the next generation of industrial and commercial transportation, the differences between AC only charging and fast charge and high power charging inlets, and the benefits that TE Connectivity’s ICT high power charging inlets bring to these kinds of designs.
More information about TE Connectivity High Power Charging Inlets: https://bit.ly/4cLEoQn
Power Modules and Why You Should Use Them in Your Next Power Design — Texas Instruments and Mouser
August 22, 2024 -- In this episode of Chalk Talk, Amelia Dalton and Christine Chacko from Texas Instruments explore a variety of power module package technologies, examine the many ways that power modules can help save on total design solution cost, and the unique benefits that Texas Instruments power modules can bring to your next design.
More information about Texas Instruments TPSM336x5 Synchronous Buck Converter Power Module: https://bit.ly/46USk9t
STM32 Security for IoT -- STMicroelectronics and Mouser Electronics
August 20, 2024 -- Today’s modern embedded systems face a range of security risks that can stem from a variety of different sources including insecure communication protocols, hardware vulnerabilities, and physical tampering. In this episode of Chalk Talk, Amelia Dalton and Thierry Crespo from STMicroelectronics explore the biggest security challenges facing embedded designers today, the benefits of the STM32 Trust platform, and why the STM32Trust TEE Secure Manager is an IoT security game changer.
More information about STMicroelectronics STM32H5 Arm® Cortex®-M33 32-Bit MCU+FPU: https://bit.ly/4drXhsL
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