fish fry
Subscribe Now

Super Standards to the Rescue

2020 Embedded Tech Trends, SOSA, and The Grey Box Concept

In this week’s podcast, we are tackling two of the biggest themes at this year’s Embedded Tech Trends Conference:  SOSA (Sensor Open Systems Architecture) and artificial intelligence processing at the edge. First up, I take a closer look at SOSA with Rodger Hosking from Pentek. Rodger and I discuss the role SOSA will have in the war fighting technology, what the future holds for this open systems architecture, and what exactly the “Grey Box Concept” is all about. Next up, Doug Patterson from AiTech and I discuss some real world examples of AI processing at the edge in military, space, and industrial applications, and why surveillance and reconnaissance plays an important roles in this arena. 

 

Click here to download this episode

Links for January 31, 2020

More information about 2020 Embedded Tech Trends Conference

More information about VITA

More information about SOSA – Sensor Open Systems Architecture

More information about Pentek

Pentek Announces New Quartz RFSoC Board Aligned with the Technical Standard for the SOSA Reference Architecture

More information about Aitech 

 

Click here to check out the Fish Fry Archive.

Click here to subscribe to Fish Fry via Podbean

Click here to get the Fish Fry RSS Feed

Click here to subscribe to Fish Fry via iTunes.

 

Fish Fry Executive Interviews

Anupam Bakshi, CEO – Agnisys

Dave Kleidermacher, CTO – Green Hills Software

Robert Blake, CEO – Achronix

Jack Harding, CEO – eSilicon

Michiel Ligthart, COO – Verific

Adnan Hamid, CEO – Breker Technologies

Simon Davidmann, CEO – Imperas

Ted Miracco, CEO – SmartFlow Compliance Solutions

Jessica Gomez – Rogue Valley Microdevices

Shishpal Rawat, Chairman – Accellera Systems Initiative

Kevin Bromber, CEO – myDevices

Daniel Hansson, CEO – Verifyter

Mark Papermaster, CTO – AMD

David Fried, CTO – Coventor

Dr. Steven LeBoeuf, President – Valencell

David Dutton, CEO – Silvaco

Bob Niemiec, CEO – TwistThink

Allan Martinson, COO – Starship Technologies

Zhihong Liu, Chairman and CEO – ProPlus Solutions

Taher Madraswala, CEO and President – Open-Silicon

Kapil Shankar, CEO and Director – AnDAPT

Dan Fox, CTO – Local Motors

David Su, CEO – Atomic Technologies

 

Leave a Reply

featured blogs
Jun 2, 2023
Diversity, equity, and inclusion (DEI) are not just words but values that are exemplified through our culture at Cadence. In the DEI@Cadence blog series, you'll find a community where employees share their perspectives and experiences. By providing a glimpse of their personal...
Jun 2, 2023
I just heard something that really gave me pause for thought -- the fact that everyone experiences two forms of death (given a choice, I'd rather not experience even one)....
Jun 2, 2023
Explore the importance of big data analytics in the semiconductor manufacturing process, as chip designers pull insights from throughout the silicon lifecycle. The post Demanding Chip Complexity and Manufacturing Requirements Call for Data Analytics appeared first on New Hor...

featured video

Shift-left with Power Emulation Using Real Workloads

Sponsored by Synopsys

Increasing software content and larger chips are demanding pre-silicon power for real-life workloads. Synopsys profile, analyze, and signoff emulation power steps to identify and analyze interesting stimulus from seconds of silicon runtime are discussed.

Learn more about Synopsys’ Energy-Efficient SoCs Solutions

featured paper

EC Solver Tech Brief

Sponsored by Cadence Design Systems

The Cadence® Celsius™ EC Solver supports electronics system designers in managing the most challenging thermal/electronic cooling problems quickly and accurately. By utilizing a powerful computational engine and meshing technology, designers can model and analyze the fluid flow and heat transfer of even the most complex electronic system and ensure the electronic cooling system is reliable.

Click to read more

featured chalk talk

Achieving High Power Density with IGBT and SiC Power Modules
Sponsored by Mouser Electronics and Infineon
Recent trends in the inverter market have made high power density, scalability, and ease of assembly more important than ever before. In this episode of Chalk Talk, Amelia Dalton and Abraham Markose from Infineon examine how Easy & Econo power modules from Infineon can help solve common inverter design requirements. They explore the benefits and construction of these modules and how you can take advantage of them in your next design.
May 19, 2023
1,738 views