fish fry
Subscribe Now

Do You Hear What I Hear?

Not Impossible Labs, Avnet, and New Advancements in Technology for Good

Nothing is impossible, the word itself says ‘I’m possible’! — Audrey Hepburn

In this week’s episode of Fish Fry, we take a closer look at how Avnet and Not Impossible Labs are collaborating to create a new a category of vibratory wearables. Kevin Sellers (Avnet) joins us to discuss how these new wearable technologies will improve quality of life for people affected by motor-related issues and help the deaf to experience live music. Kevin and I also discuss Avnet’s role in The Not Impossible Awards and what the future looks like for this unique collaboration. In this week’s News You May Have Missed, we investigate how Leti is hoping to change smart glasses as we know them – with a little help fro some holographic images that are projected directly into our eyes.

Download this episode (right click and save)

Links for October 12, 2018

More information about Avnet and Not Impossible Labs

Avnet and Not Impossible Labs Enable the Deaf to Experience Live Music

Avnet and Not Impossible Labs Partner to Create Technology Products that Enhance Accessibility and Inclusivity

New Display Design Could Make Lightweight, Compact Smart Glasses a Reality (The Optical Society of America)

See-through holographic retinal projection display concept (Whitepaper)

 

Click here to check out the Fish Fry Archive.

Click here to subscribe to Fish Fry via Podbean

Click here to get the Fish Fry RSS Feed

Click here to subscribe to Fish Fry via iTunes.

Fish Fry Executive Interviews

Anupam Bakshi, CEO – Agnisys

Dave Kleidermacher, CTO – Green Hills Software

Robert Blake, CEO – Achronix

Jack Harding, CEO – eSilicon

Michiel Ligthart, COO – Verific

Adnan Hamid, CEO – Breker Technologies

Simon Davidmann, CEO – Imperas

Ted Miracco, CEO – SmartFlow Compliance Solutions

Jessica Gomez – Rogue Valley Microdevices

Shishpal Rawat, Chairman – Accellera Systems Initiative

Kevin Bromber, CEO – myDevices

Daniel Hansson, CEO – Verifyter

Mark Papermaster, CTO – AMD

David Fried, CTO – Coventor

Dr. Steven LeBoeuf, President – Valencell

David Dutton, CEO – Silvaco

Bob Niemiec, CEO – TwistThink

Allan Martinson, COO – Starship Technologies

Zhihong Liu, Chairman and CEO – ProPlus Solutions

Taher Madraswala, CEO and President – Open-Silicon>

Kapil Shankar, CEO and Director – AnDAPT

Dan Fox, CTO – Local Motors

Leave a Reply

featured blogs
Dec 7, 2023
Building on the success of previous years, the 2024 edition of the DATE (Design, Automation and Test in Europe) conference will once again include the Young People Programme. The largest electronic design automation (EDA) conference in Europe, DATE will be held on 25-27 March...
Dec 7, 2023
Explore the different memory technologies at the heart of AI SoC memory architecture and learn about the advantages of SRAM, ReRAM, MRAM, and beyond.The post The Importance of Memory Architecture for AI SoCs appeared first on Chip Design....
Nov 6, 2023
Suffice it to say that everyone and everything in these images was shot in-camera underwater, and that the results truly are haunting....

featured video

Dramatically Improve PPA and Productivity with Generative AI

Sponsored by Cadence Design Systems

Discover how you can quickly optimize flows for many blocks concurrently and use that knowledge for your next design. The Cadence Cerebrus Intelligent Chip Explorer is a revolutionary, AI-driven, automated approach to chip design flow optimization. Block engineers specify the design goals, and generative AI features within Cadence Cerebrus Explorer will intelligently optimize the design to meet the power, performance, and area (PPA) goals in a completely automated way.

Click here for more information

featured paper

3D-IC Design Challenges and Requirements

Sponsored by Cadence Design Systems

While there is great interest in 3D-IC technology, it is still in its early phases. Standard definitions are lacking, the supply chain ecosystem is in flux, and design, analysis, verification, and test challenges need to be resolved. Read this paper to learn about design challenges, ecosystem requirements, and needed solutions. While various types of multi-die packages have been available for many years, this paper focuses on 3D integration and packaging of multiple stacked dies.

Click to read more

featured chalk talk

EV Charging: Understanding the Basics
Sponsored by Mouser Electronics and Bel
Have you ever considered what the widespread adoption of electric vehicles will look like? What infrastructure requirements will need to be met? In this episode of Chalk Talk, I chat about all of this and more with Bruce Rose from Bel. We review the basics of EV charging, investigate the charging requirements for both AC and DC chargers, and examine the role that on-board inverters play in electric vehicle charging.
Mar 27, 2023
30,872 views