Bend it like Silicon

Flexible Silicon and Plastic Circuits

by Dick Selwood

For some years, when I have travelled, my passport has been stowed in my hip pocket. This has worked well (apart from the incident with the cool wash cycle) but did mean that my passport developed a firm curve. Earlier this year I needed a new passport, and when it arrived, there was a firm instruction: "Do not Bend". This is, presumably, because it has a chip inside, and, as we all know, silicon does not bend. But when you talk to, among others, Gerhard Klink of the Fraunhofer Institute's "Group Polytronic Technologies" in Munich, he can show silicon bending. It is easy, really. You start with a standard wafer, build up your circuit on one side, and then remove the back side of the wafer mechanically until you achieve a thickness of less than 25 microns. (The technology for making wafers thinner has been well developed for MEMS sensors and related products.) At this thickness, it is possible to bend silicon easily.  Read More


latest news

July 30, 2015

Altium Announces Major Update to TASKING Compiler for TriCore/AURIX Microcontrollers

July 29, 2015

Keysight Technologies Introduces PAM-4 Support on M8000 Series BER Test Solutions

July 21, 2015

Molex ML-XTTM Sealed Connection System Delivers Market-Leading Seal Technology for the Commercial Vehicle Market

July 16, 2015

Power-Management IC from STMicroelectronics Selected by Kingston for its HyperX® Savage Solid-State Drive

July 14, 2015

Enics invests in Zuken’s CR-8000 software to future-proof electronics manufacturing services

July 09, 2015

Molex Expands Line of Microminiature SlimStack™ Fine-Pitch Board-to-Board Connectors

July 07, 2015

New Lightweight Terminations for Aerospace Reduce Weight up to 60 Percent

Tektronix Showcases New and Enhanced Coherent Optical Test Solutions at ECOC 2015

June 30, 2015

Zuken Offers Improved Productivity and Enhanced Collaboration with Latest E³.series Release

TE Connectivity’s Micro Circular Connectors Now Available Globally

June 25, 2015

AVX Adds 12+ High-Reliability Tantalum SMD Capacitors to its Proven TMJ S1gma™ Series

June 22, 2015

Keysight Technologies Announces Asygn’s, Kalray’s Successful Use of its Simulation Tool Suite to Validate PCI Express® Gen3 Serial Links

June 18, 2015

Nanonics Connectors from TE Connectivity Offer Weight and Cost Savings

June 16, 2015

Avnet Electronics Marketing Experts to Address IoT and Embedded Linux Development Opportunities at Freescale Technology Forum

Keysight Technologies to Exhibit Latest PCI Express® Design, Test Solutions at PCI-SIG® Developers Conference

Board News Archive

Insights from the 3D Printing Conference and Expo

Technology and Art Attempt to Walk Hand-in-Hand Toward the Future

by Larra Morris

Changing the PCB Axis

Mentor PADS Redefines the Board Genre

by Kevin Morris

A Circuit Board for the Bees

Unexpected Technology on the Farm

by Bryon Moyer

Cramming Moore Components

Moore’s Law Turns Fifty

by Kevin Morris

Bringing Flexy Back

Molex and the Connectors of Tomorrow

by Amelia Dalton

Board Article Archive

 

Editors' Blog

Raspberry Pi: The next generation

posted by Dick Selwood

The little board that can now has more processing power and double the memory (3-Feb)

Planning PCB, Package, and Die Together

posted by Bryon Moyer

Cadence’s OrbitIO tries to tie together disparate tools and inefficient ways of planning pinouts. (31-Jul)

Internet of Things- This Season's Trend

posted by Dick Selwood

(10-Mar)

3D-IC Planning

posted by Bryon Moyer

How do you figure out the best way to arrange all of the pieces that are going to go into your 3D-IC/2.5D-IC/SiP? (2-Apr)

Debug Trick Uses CPU Cache as RAM

posted by Jim Turley

Can't bring up your new hardware because the %#$@! thing won't even boot? Can't access even basic RAM? Try using the CPU's on-chip cache like RAM and find the bug! (26-Feb)

Board Editors' Blog Archive

 

forum

Cloud EDA Round 2

Posted on 08/03/15 at 11:07 AM by TotallyLost

TotallyLost
At least working with IBM and Globalfoundaries It's likely your IP will stay in the US. Doesn't mean that Asian IP theft rings can not insert/purchase Globalfoundaries employees. At least with the majority of the company inside the US, we have US laws and…

Trust

Posted on 08/03/15 at 10:29 AM by bmoyer

bmoyer
Regarding auditing by end customers, that's going to depend mightily on who that end customer is. If we're talking home automation, there's no way your average customer is going to do that (they wouldn't know how, nor could they interpret artifacts). So t…

Cloud EDA Round 2

Posted on 08/03/15 at 9:24 AM by bmoyer

bmoyer
Do these new cloud-based EDA offerings adequately address security, to the point where you could use them?

A View from Above

Posted on 07/31/15 at 11:40 AM by TotallyLost

TotallyLost
Hmmm ... more outsourcing IT and EDA engineering jobs.

And moving critical US IP into foreign hands, where IP laws are sometimes less than useful?

There is resistance to this???

Trust

Posted on 07/29/15 at 2:02 PM by RyanKenny

RyanKenny
An important aspect of the picture you draw here is that it is multi-party: chip vendor, processor IP provider, OS/RTOS provider, hypervisor provider, stack source (open?), and applications.

I won't comment if Benjamin Franklin's quote about secrets an…

Board Forum Archive

subscribe to our board design newsletter



On Demand

Altera Stratix 10 Security

10 Secrets to Getting a Lower BOM Cost

Announcing the RN4677 Bluetooth 4.0 Dual Mode Module

Meet PPA and Turnaround Time Requirements at Advanced Nodes with Innovus Implementation System

Inductance-to-Digital Converters Revolutionize Position & Rotation Sensing

Connecting ZYNQ-7000 All Programmable SoCs with TE Connectivity Interconnect Products

i.MX 6SoloX – Freescale’s New Heterogeneous Multicore Applications Processor

SDSoC Development Environment: Optimization & Debug

SDSoC Development Environment: Estimation & Implementation

Massive DDR4 Memory Bandwidth with Xilinx UltraScale FPGAs

Cadence Perspec System Verifier SW Driven SoC Verification Automation

USB Type-C Solutions

Efficient Product Creation with Allegro and Sigrity Solutions

Mixed Signal Verification: The Long and Winding Road

Accelerating Your Analog Output Design

Model-Based Design for Xilinx Zynq & Altera SoC Devices

Solution for Heterogeneous Multicore Embedded Systems

MathWorks Connects to Hardware

Architecture Matters: Three Architectural Insights for SoC FPGAs

Delivering Higher FPGA Utilization & Performance: UltraScale Architecture

The Vault

FRAM Technology: The Next Generation of Non-volatile Memory for Microcontrollers

Function Enablement with 8-bit PIC Microcontrollers

4-Channel Analog Front End Solution

What is Electrically Aware Design?

Increase FPGA Performance with Enhanced Capabilities of Synplify Pro & Premier

Physically Aware Synthesis Techniques to Lower Power, Improve Timing, Congestion & Correlation

Abstract and Conquer: A New Alternative to Hierarchical Timing Analysis

PADS VX: Redefining Productivity

Integrating Electronic Design Analysis Upstream, Downstream, and Sideways

Vivado In-System Debug

Product-Centric Design with Virtual Prototyping

Design Control, Data & Comparison with PADS Design Archive

Protium Rapid Prototyping Platform

Board On Demand Archive


Login Required

In order to view this resource, you must log in to our site. Please sign in now.

If you don't already have an acount with us, registering is free and quick. Register now.

Sign In    Register