fish fry
Subscribe Now

Driving Toward Functionality

Formal Verification and Safety Critical Designs

In this week’s episode of Fish Fry, we take a closer look at the world of formal verification. Dave Kelf (OneSpin) joins us to discuss the mechanics of systematic verification and random verification and why automotive and other safety-critical applications may prove to be the most effective use of formal verification yet. We also chat about the themes found at this year’s Design Automation Conference including why Dave believes that the convergence of HLS and System-C, FPGAs, and safety-critical applications made DAC 2017 one of the most exciting conference years to date.   

 

Download this episode (right click and save)

Links for July 7, 2017

More information about OpenSpin

Formal Verification Leader OneSpin Solutions Unveils its Comprehensive Safety Critical Solution for Automotive, Other Mission-Critical Applications

New Episode of Chalk Talk – Insatiable Bandwidth: Why HBM is Right For You

Click here to check out the Fish Fry Archive.

Click here to subscribe to Fish Fry via Podbean

Click here to get the Fish Fry RSS Feed

Click here to subscribe to Fish Fry via iTunes.

————————————

Fish Fry Executive Interviews

Moshe Gavrielov, CEO – Xilinx

Darrin Billerbeck, CEO – Lattice Semiconductor

Paul Kocher, President – Cryptography Research Inc.

Anupam Bakshi, CEO – Agnisys

Dave Kleidermacher, CTO – Green Hills Software

Robert Blake, CEO – Achronix

Jack Harding, CEO – eSilicon

Michiel Ligthart, COO – Verific

Adnan Hamid, CEO – Breker Technologies

Jeff Waters, VP and General Manager – Altera

Simon Davidmann, CEO – Imperas

Ted Miracco, CEO – SmartFlow Compliance Solutions

Cees Links – GreenPeak Technologies

Jessica Gomez – Rogue Valley Microdevices

Shishpal Rawat, Chairman – Accellera Systems Initiative

Kevin Bromber, CEO – myDevices

Daniel Hansson, CEO – Verifyter

Mark Papermaster, CTO – AMD

David Fried, CTO – Coventor

Dr. Steven LeBoeuf, President – Valencell

David Dutton, CEO – Silvaco

Bob Niemiec, CEO – TwistThink

Allan Martinson, COO – Starship Technologies

Zhihong Liu, Chairman and CEO – ProPlus Solutions

Taher Madraswala, CEO and President – Open-Silicon

Kapil Shankar, CEO and Director – AnDAPT

Mike Wishart, CEO – efabless 

Dan Fox, CTO – Local Motors

Kim Rowe, Founder and CEO — RoweBots

Lawrence Cooke, Founder and CEO — NovaSolix

Gregg Recupero, CTO — Performance-IP

Alan Grau, CEO — Icon Labs

Carl Alberty, Vice President – Cirrus Logic

Maximilian Odendahl, CEO — Silexica

Leave a Reply

featured blogs
Oct 26, 2020
Last week was the Linley Group's Fall Processor Conference. The conference opened, as usual, with Linley Gwenap's overview of the processor market (both silicon and IP). His opening keynote... [[ Click on the title to access the full blog on the Cadence Community s...
Oct 23, 2020
Processing a component onto a PCB used to be fairly straightforward. Through-hole products, or a single or double row surface mount with a larger centerline rarely offer unique challenges obtaining a proper solder joint. However, as electronics continue to get smaller and con...
Oct 23, 2020
[From the last episode: We noted that some inventions, like in-memory compute, aren'€™t intuitive, being driven instead by the math.] We have one more addition to add to our in-memory compute system. Remember that, when we use a regular memory, what goes in is an address '...
Oct 23, 2020
Any suggestions for a 4x4 keypad in which the keys aren'€™t wobbly and you don'€™t have to strike a key dead center for it to make contact?...

featured video

Demo: Inuitive NU4000 SoC with ARC EV Processor Running SLAM and CNN

Sponsored by Synopsys

Autonomous vehicles, robotics, augmented and virtual reality all require simultaneous localization and mapping (SLAM) to build a map of the surroundings. Combining SLAM with a neural network engine adds intelligence, allowing the system to identify objects and make decisions. In this demo, Synopsys ARC EV processor’s vision engine (VPU) accelerates KudanSLAM algorithms by up to 40% while running object detection on its CNN engine.

Click here for more information about DesignWare ARC EV Processors for Embedded Vision

featured Paper

New package technology improves EMI and thermal performance with smaller solution size

Sponsored by Texas Instruments

Power supply designers have a new tool in their effort to achieve balance between efficiency, size, and thermal performance with DC/DC power modules. The Enhanced HotRod™ QFN package technology from Texas Instruments enables engineers to address design challenges with an easy-to-use footprint that resembles a standard QFN. This new package type combines the advantages of flip-chip-on-lead with the improved thermal performance presented by a large thermal die attach pad (DAP).

Click here to download the whitepaper

Featured Chalk Talk

0 to 112 (Gbps PAM4) in 5 Seconds

Sponsored by Samtec

With serial connections hitting 112Gbps, we can’t mess around with our interconnect. We need engineered solutions that will keep those eyes open and deliver the signal integrity we need in our high-speed designs. In this episode of Chalk Talk, Amelia Dalton talks with Matt Burns of Samtec about the interconnect options for speeds up to 112Gbs, and Samtec’s Flyover interconnect technology.

Click here to download the Silicon-to-Silicon Solutions Guide