fish fry
Subscribe Now

Board to the Future

IoT and the Changing Shape of Board Design
Your mission, should you choose to accept it, is to create a truly unique IoT design. As always, should you or any member of your engineering team be caught or killed, we will disavow any knowledge of your actions. This podcast will self destruct in five seconds… As we all know, IoT designs present us with a unique set of prerequisites and board design challenges. In this week’s episode of Fish Fry, Ted Pawela (Chief Marketing Officer — Altium) joins us to discuss the biggest PCB trends in the IoT ecosystem and what complex board design challenges will look like as we progress to the next generation of connected cars. Also this week, we take a closer look at some creative new beer names invented by engineer extraordinaire Janelle Shane’s industrious AI neural network.

Download this episode (right click and save)

Links fo August 18, 2017

More information about Altium

More information about AltiumLive

Craft beers named by a neural network

Janelle Slane’s tumblr site

Click here to check out the Fish Fry Archive.

Click here to subscribe to Fish Fry via Podbean

Click here to get the Fish Fry RSS Feed

Click here to subscribe to Fish Fry via iTunes.

————————————

Fish Fry Executive Interviews

Moshe Gavrielov, CEO – Xilinx

Darrin Billerbeck, CEO – Lattice Semiconductor

Paul Kocher, President – Cryptography Research Inc.

Anupam Bakshi, CEO – Agnisys

Dave Kleidermacher, CTO – Green Hills Software

Robert Blake, CEO – Achronix

Jack Harding, CEO – eSilicon

Michiel Ligthart, COO – Verific

Adnan Hamid, CEO – Breker Technologies

Jeff Waters, VP and General Manager – Altera

Simon Davidmann, CEO – Imperas

Ted Miracco, CEO – SmartFlow Compliance Solutions

Jessica Gomez – Rogue Valley Microdevices

Shishpal Rawat, Chairman – Accellera Systems Initiative

Kevin Bromber, CEO – myDevices

Daniel Hansson, CEO – Verifyter

Mark Papermaster, CTO – AMD

David Fried, CTO – Coventor

Dr. Steven LeBoeuf, President – Valencell

David Dutton, CEO – Silvaco

Bob Niemiec, CEO – TwistThink

Allan Martinson, COO – Starship Technologies

Zhihong Liu, Chairman and CEO – ProPlus Solutions

Taher Madraswala, CEO and President – Open-Silicon

Kapil Shankar, CEO and Director – AnDAPT

Mike Wishart, CEO – efabless 

Dan Fox, CTO – Local Motors

Kim Rowe, Founder and CEO — RoweBots

Lawrence Cooke, Founder and CEO — NovaSolix

Gregg Recupero, CTO — Performance-IP

Alan Grau, CEO — Icon Labs

Carl Alberty, Vice President – Cirrus Logic

Maximilian Odendahl, CEO — Silexica

Finbarr Moynihan, General Manager — MediaTek

Sanjay Pillay, CEO — Austemper

Leave a Reply

featured blogs
Mar 18, 2024
Innovation in the AI and supercomputing domains is proceeding at a rapid pace, with each new advancement heralding a future more tightly interwoven with the threads of intelligence and computation. Cadence, with the release of its Millennium Platform, co-optimized with NVIDIA...
Mar 18, 2024
Cloud-based EDA tools are critical to accelerating AI chip design and verification; see how NeuReality leveraged cloud-based chip emulation for their 7NR1 NAPU.The post NeuReality Accelerates 7nm AI Chip Tape-Out with Cloud-Based Emulation appeared first on Chip Design....
Mar 5, 2024
Those clever chaps and chapesses at SiTime recently posted a blog: "Decoding Time: Why Leap Years Are Essential for Precision"...

featured video

We are Altera. We are for the innovators.

Sponsored by Intel

Today we embark on an exciting journey as we transition to Altera, an Intel Company. In a world of endless opportunities and challenges, we are here to provide the flexibility needed by our ecosystem of customers and partners to pioneer and accelerate innovation. As we leap into the future, we are committed to providing easy-to-design and deploy leadership programmable solutions to innovators to unlock extraordinary possibilities for everyone on the planet.

To learn more about Altera visit: http://intel.com/altera

featured paper

Reduce 3D IC design complexity with early package assembly verification

Sponsored by Siemens Digital Industries Software

Uncover the unique challenges, along with the latest Calibre verification solutions, for 3D IC design in this new technical paper. As 2.5D and 3D ICs redefine the possibilities of semiconductor design, discover how Siemens is leading the way in verifying complex multi-dimensional systems, while shifting verification left to do so earlier in the design process.

Click here to read more

featured chalk talk

Telematics, Connectivity & Infotainment Integration Made Easy
Today’s automotive designs must contend with a variety of challenges including scalability, security, software integration and the increased use of different radio technologies. In this episode of Chalk Talk, Fredrik Lonegard from u-blox, Patrick Stilwell from NXP and Amelia Dalton explore how the use of modules can help address a variety of automotive design challenges and the benefits that ublox’s JODY-W3 host-based modules can bring to your next automotive application.
Apr 4, 2023
39,995 views