News – Page 976 – EEJournal

Latest Release of Synopsys’ Design Compiler NXT is Ready for Broad Availability

Early Adopters Realizing Up to 2X Faster Runtime, 10% Improved QoR, and Tight Correlation to IC Compiler II

March 18, 2019

MOUNTAIN VIEW, Calif., March 13, 2019 /PRNewswire/ —

Highlights:

Synopsys Design Compiler NXT incorporates innovative and efficient optimization engines delivering faster runtime and improved power and timing QoR
Advanced-node support, including common libraries and aligned RC extraction with IC Compiler II, delivers extremely … Read More → "Latest Release of Synopsys’ Design Compiler NXT is Ready for Broad Availability"

DesignCore® Interface Card Has 16 Camera/Sensor Channels to Speed AI System Development with NVIDIA Jetson AGX Xavier Developer Kit

Features High-Speed SerDes Input via Texas Instruments FPD-Link™ III Interface, Power-Over-Coax, and On-Board FPGA for Hardware-Level Synchronization

March 18, 2019

Rochester, NY – March 14, 2019 – D3 Engineering today announced its new DesignCore® sensor interface card for the NVIDIA Jetson AGX Xavier Developer Kit. The new card allows engineers to quickly connect multiple cameras or sensors with their NVIDIA Jetson AGX Xavier Developer Kit to access its full power for system development.

D3 Engineering will demonstrate its DesignCore NVIDIA Jetson AGX Xavier FPD-Link III Sensor Interface Card at the GPU Technology Conference (GTC) in San Jose March 18-21, 2019.

“The new DesignCore sensor interface card allows engineers to take advantage of … Read More → "DesignCore® Interface Card Has 16 Camera/Sensor Channels to Speed AI System Development with NVIDIA Jetson AGX Xavier Developer Kit"

Pixus Announces New Thick and Rugged Faceplates For Embedded Boards

March 18, 2019

Waterloo, Ontario — Mar 15, 2019 – Pixus Technologies, a provider of embedded computing and enclosure solutions, has released new OpenVPX faceplates for rugged applications.

The new 6U OpenVPX panels feature an extra thick extrusion, providing both rigidity and the ability to attach helicoils on the faceplate. There is also a PCB holder bar that extends along the inside of the 0.8” wide panel. This bar acts as a stiffener for the panel and provides a more … Read More → "Pixus Announces New Thick and Rugged Faceplates For Embedded Boards"

The 11th Annual I LOVE DAC Campaign Kicks Off Registration for the 56th Design Automation Conference

Free three-day exhibition passes with access to keynotes, exhibits, DAC Pavilion and Design-on-Cloud presentations

March 18, 2019

LOUISVILLE, Colo. – March 11, 2019 – Starting today, free registration is open to attend the exhibits and keynotes at the Design Automation Conference, the premier event for the design and automation of electronic systems. Avatar Integrated Systems^TM, ClioSoft^{TM</ … Read More → "The 11th Annual I LOVE DAC Campaign Kicks Off Registration for the 56th Design Automation Conference"}

Sequential Infiltration Synthesis (SIS) Significantly Improves EUV Patterning

March 15, 2019

SAN FRANCISCO (US), FEBRUARY 25, 2019 — This week, at the SPIE Advanced Lithography conference 2019, imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, demonstrates the positive impact of sequential infiltration synthesis (SIS) on the EUVL (extreme ultra-violet lithography) patterning process. This post-lithography technique is shown to significantly reduce stochastic nano-failures and line roughness, contributing to the introduction of EUVL patterning of future nodes”. This work integrates recent advancements on metrology and etch, and on material developments, which will be presented in multiple papers at this week’s 2019 SPIE Advanced Lithography Conference.

Read More → "Sequential Infiltration Synthesis (SIS) Significantly Improves EUV Patterning"

Power Stamp Alliance Announces Reference Design Board for Next-Generation 10 nm Intel CPU Microarchitecture

March 15, 2019

[March 14, 2019] – At the OCP Summit 2019, the Power Stamp Alliance (PSA), which is creating collaborative solutions for 48V-to-low-voltage on-board DC-DC power converters, today announced a new reference design board for processors based on the next-generation 10 nm Intel® CPU microarchitecture, code-named “Ice Lake” by Intel®. Engineers designing high-performance computers and servers being used in large data centers, which are increasingly using 48-volt … Read More → "Power Stamp Alliance Announces Reference Design Board for Next-Generation 10 nm Intel CPU Microarchitecture"

GPIO Port Expander From Diodes Incorporated Provides I2C Interface And Level Shifting For Any Peripheral

March 15, 2019

Plano, Texas 13 March, 2019 Diodes Incorporated (Nasdaq:DIOD), a leading global manufacturer and supplier of high-quality application-specific standard products within the broad discrete, logic, analog and mixed-signal semiconductor markets, today announced the PI4IOE5V6416 16-bit I/O expander, which enables any digital device to be accessed and controlled over an I2C interface, across a range … Read More →

ON Semiconductor to Demonstrate Rapid Analysis of Power Solutions Using Advanced Cloud-Connected Strata Developer Studio™ at APEC 2019

Other on-booth demonstrations will include new innovations in Cloud Power, Energy Infrastructure, and Industrial Power & Motion

March 15, 2019

ANAHEIM, USA – 13 March, 2019 – ON Semiconductor (Nasdaq: ON), driving energy efficient innovations, will be exhibiting and demonstrating new power solutions boards enabled with its Strata Developer Studioä development platform … Read More → "ON Semiconductor to Demonstrate Rapid Analysis of Power Solutions Using Advanced Cloud-Connected Strata Developer Studio™ at APEC 2019"

Power Stamp Alliance Announces New Specification for Controller Stamp

March 15, 2019

[March 14, 2019] – At the OCP Summit 2019, the Power Stamp Alliance (PSA), which is creating collaborative solutions for 48V-to-low-voltage on-board DC-DC power converters, today published a new specification for a controller stamp that will improve the usability of satellite power stamps while reducing the component count for server manufacturers. A controller stamp includes all the control functionalities of a main stamp and, … Read More → "Power Stamp Alliance Announces New Specification for Controller Stamp"

Cadence Announces Industry’s First Verification IP for USB4

Cadence VIP and TripleCheck technology support for the next-generation USB standard enables early adoption of the protocol

March 15, 2019

SAN JOSE, Calif., March 14, 2019—Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced the availability of the industry’s first Verification IP (VIP) in support of the recently announced USB4 standard (https://usb.org/sites/default/files/2019-03/USB_PG_USB4_DevUpdate_Announcement_FINAL_< … Read More → "Cadence Announces Industry’s First Verification IP for USB4"