News – Page 975 – EEJournal

Synopsys Unveils IC Validator NXT to Cut Physical Signoff Cycle by 2X

Breakthrough Explorer DRC, Live DRC, and Fusion Technologies Deliver Unparalleled Productivity Gains

March 19, 2019

MOUNTAIN VIEW, Calif., March 18, 2019 /PRNewswire/ —

Highlights:

Industry-leading scalability to 2000+ cores enables full-chip physical signoff within hours
Innovative Explorer DRC technology delivers 5X faster DRC performance during SoC integration
IC Validator NXT physical signoff deployed in the cloud on multiple customer tapeouts
Faster physical signoff closure driven by Fusion Technology with IC … Read More → "Synopsys Unveils IC Validator NXT to Cut Physical Signoff Cycle by 2X"

ADLINK and Charles Industries Jointly Announce Industry’s First Pole Mounted Multi-access Edge AI and Machine Learning Solution

March 19, 2019

SAN JOSE, Calif. — March 18, 2019 — ADLINK Technology and Charles Industries, Ltd. (Charles) have joined together to demonstrate the industry’s first complete micro-edge low latency Artificial Intelligence/Machine Learning/Deep Learning (AI/ML/DL) solution that can be co-located on LTE small cell poles or with emerging 5G radios. The solution is being demonstrated at the NVIDIA GPU Technology Conference (GTC), March 19-21, at the San Jose McEnery Convention Center in Booth #317.

The new solution is a compact low profile pole or wall mountable unit based on an integration of ADLINK’s latest AI … Read More → "ADLINK and Charles Industries Jointly Announce Industry’s First Pole Mounted Multi-access Edge AI and Machine Learning Solution"

Express Logic’s X-Ware IoT Platform™ Crypto Library Achieves FIPS 140-2 Certification

X-Ware IoT Platform NetX™ Crypto Library Helps Secure Sensitive Government, Financial, and Healthcare Data

March 19, 2019

San Diego, CA — March 13, 2019 — Express Logic today announced that thanks to its collaboration with one of the world’s leading security labs, Read More → "Express Logic’s X-Ware IoT Platform™ Crypto Library Achieves FIPS 140-2 Certification"

Mouser-Sponsored Formula E Team Takes to Hong Kong Street Course

Molex, TTI, AVX Join Mouser to Support High-Tech Electric Car Racing

March 19, 2019

March 13, 2019 – The Mouser-sponsored Read More → "Mouser-Sponsored Formula E Team Takes to Hong Kong Street Course"

VadaTech Announces new 6U VPX Chassis with Fiber Optic I/O

March 19, 2019

Henderson, NV – March 14, 2017 – VadaTech, a leading manufacturer of integrated systems, embedded boards, enabling software and application-ready platforms, announces the VTX350. The VTX350 is a 6U VPX chassis with up to twelve 6U VPX slots and provision for dual power modules ideal for field deployment. The chassis can … Read More → "VadaTech Announces new 6U VPX Chassis with Fiber Optic I/O"

New Isolated ICs Ensure Precise Current and Voltage Measurements with Ultra-Low Temperature Drift

Silicon Labs’ Robust Third-Generation Isolation Technology Delivers a Leap Forward in Performance and Stability

March 18, 2019

ANAHEIM, Calif. (APEC) – March 18, 2019 – Read More → "New Isolated ICs Ensure Precise Current and Voltage Measurements with Ultra-Low Temperature Drift"

Aitech’s NVIDIA Jetson-Powered Products with RedHawk Linux RTOS Offer Guaranteed Hard Real-Time Response and Determinism

High Performance Computation Achieved Through Advanced GPGPU

March 18, 2019

Technical Highlights:

Integration of RedHawk Linux for hard RT processing
COTS SFF GPGPU for military (A176) and industrial (A177) applications
Compact, low-power, SWaP-optimized with TFLOP performance

Chatsworth, Calif. March 14, 2019 – As leaders in GPGPU computing technologies, Aitech and Concurrent Real-Time have partnered to integrate RedHawk Linux RTOS with two of Aitech’s powerful Read More → "Aitech’s NVIDIA Jetson-Powered Products with RedHawk Linux RTOS Offer Guaranteed Hard Real-Time Response and Determinism"

Microcircuit Aging/Wearout for Aerospace, Other High-Performance Industries

Sherlock contributes to publication of SAE ARP6338A

March 18, 2019

Beltsville, MD – March 12, 2019 – DfR Solutions played an integral role in the recent publication of the SAE International Revision A of Aerospace Recommended Practice 6338: “Process for Assessment and Mitigation of Early Wearout of Life-limited Microcircuits.” Lloyd Condra of DfR Solutions led the SAE Working Group that published the revision, which included technical content based on DfR Solutions research.

The revision is a result of an eight-month project by the SAE Avionics Process Management Committee (APMC) to address this persistent problem for the avionics industry. DfR Solutions was invited to participate in this project due … Read More → "Microcircuit Aging/Wearout for Aerospace, Other High-Performance Industries"

Arm, Cadence and Xilinx Introduce First Arm Neoverse System Development Platform for Next-Generation Cloud-to-Edge Infrastructure, Implemented on TSMC 7nm Process Technology

March 18, 2019

Highlights:

• Computing industry leaders collaborate in delivery of the industry’s first development platform for 7nm Arm Neoverse N1 SoCs and CCIX interconnect architecture
• Platform includes a 2.6-3GHz Neoverse N1 SoC implemented and verified using a full Cadence tool flow in TSMC 7nm FinFET process technology and connectivity to Xilinx FPGAs via CCIX

SAN JOSE, Calif., March 12, 2019—Arm, Cadence Design Systems, Inc. (NASDAQ: CDNS) and Xilinx, Inc. (NASDAQ: XLNX) today announced the delivery of a new development platform, silicon-proven on TSMC’s (TWSE: 2330, NYSE: TSM) 7nm FinFET process technology, for next-generation cloud-to-edge infrastructure … Read More → "Arm, Cadence and Xilinx Introduce First Arm Neoverse System Development Platform for Next-Generation Cloud-to-Edge Infrastructure, Implemented on TSMC 7nm Process Technology"

eFPGA IP from Menta Selected by Beijing Chongxin Communication Company to Enable Programmability in 4G/5G Wireless Baseband SoC

Enhanced flexibility supports emerging 5G NR wireless specification

March 18, 2019

SOPHIA-ANTIPOLIS, France, March 12, 2019 — Menta SAS, a provider of embedded FPGA (eFPGA) Intellectual Property (IP), today announced that its eFPGA IP has been selected by Beijing Chongxin Communication Company to enable flexibility in baseband SoCs designed for 5G NR pico cell applications.

Menta’s eFPGA integrates embedded SRAM IP in addition to embedded logic blocks (eLBs), global clocks, memory, ALUs, and interfaces optimized for … Read More → "eFPGA IP from Menta Selected by Beijing Chongxin Communication Company to Enable Programmability in 4G/5G Wireless Baseband SoC"