March 14, 2019 – Mouser Electronics, Inc. announces that it is exhibiting as a Platinum Partner at the 2019 Read More → "Join Mouser Electronics at APEC 2019 for Latest in Power Technologies"
MOUNTAIN VIEW, Calif., March 14, 2019 /PRNewswire/ — Read More → "Synopsys Delivers Industry’s First USB4 Subsystem Verification Solution, VIP, and Test Suite for High-performance USB Architecture"
Santa Clara, CA – DSP Concepts, Inc., a developer of embedded audio-processing solutions, has launched TalkTo™, a new brand and a major expansion of its voice recognition technologies. TalkTo is a family of software-based Audio Front Ends for voice-controlled products. It uses machine learning and advanced microphone-processing techniques to deliver highly reliable voice control, even in high-noise environments.
With TalkTo, product makers can now … Read More → "DSP Concepts announces TalkTo™ front ends for voice-controlled products"
At the Open Compute Summit today, Artesyn Embedded Technologies announced a new series of power supplies following the Intel® Common Redundant Power Supply (CRPS) specification, which includes a 2400 watt model, the highest power available in the industry in this form factor, offering a market-leading power density of 75 watts per cubic inch (W/in3).
With individual power ratings from 550 W up to 2400 W, Artesyn’s new Read More → "New Series of Artesyn CRPS Server Power Supplies Includes Industry’s Highest Power 2.4 kW Model"
San Diego, CA, 14 March 2019 * * * congatec – a leading vendor of standardized and customized embedded computer boards and modules – presents a SMARC 2.0 Quick Starter Kit for the new NXP i.MX 8 QuadMax processor family. The kit offers everything developers need for the immediate evaluation of the new NXP i.MX 8 processor generation. Developers of vision-based AI applications, in particular, benefit from the natively supported integrated MIPI interfaces and optional pre-configured software support for artificial intelligence.
“Developers of highly integrated IIoT, industrial and embedded vision applications can reach the next technology level very quickly and easily … Read More → "congatec presents SMARC 2.0 Quick Starter Kit for NXP i.MX 8 designs"
MOUNTAIN VIEW, Calif., March 14, 2019 /PRNewswire/ —
Highlights:
LEUVEN (Belgium), MARCH 12, 2019 — Today, imec, a world-leading research and innovation hub in nanoelectronics, energy, and digital technologies and KU Leuven, both partners in EnergyVille, present a novel nanomesh material that could mean a breakthrough in a variety of sustainable-application sectors. The new nanomesh material is a three-dimensional nanometer-scale (metal) grid structure with highly regular internal dimensions. Thanks to a combination of its unique material properties and the ease of manufacturing, it holds the promise to become widely applicable in (sustainable) industrial applications. Think about more efficient batteries, better catalytic convertors, fuel cells … Read More → "Novel nanomaterial promises improvements in batteries and many more sustainable applications"
OCP GLOBAL SUMMIT 2019, SAN JOSE, CA, March 14, 2019 – Netronome, a leader in high-performance intelligent networking solutions, today unveiled its Agilio CX 50GbE SmartNICs in OCP Mezzanine 2.0 form factor with line-rate advanced cryptography and 2GB onboard DDR memory. The new SmartNIC reduces tail latency significantly enabling high-performance Web 2.0 applications to be deployed in cost and energy-efficient servers. With advanced Transport Layer Security (TLS/SSL)-based cryptography support at line-rate and up to two million stateful sessions per SmartNIC, web and data storage servers in hyperscale environments can now be secured tighter than ever before, preventing hacking of networks and … Read More → "Netronome Advances Cloud, Hyperscale Server and Storage Infrastructure Performance and Security with New 50GbE OCP-based SmartNICs"
LONDON, UK, 14 March 2019 – RS Components (https://uk.rs-online.com/web/
Munich, March 2019: Panasonic Industry Europe (PIEU), the European partner for electronic components, devices, modules and solutions in the industrial sector, today announced a collaborative sponsorship agreement with Technical University of Munich and Eindhoven University of Technology, both internationally recognized institutions of higher education and research in the field of engineering. The cooperation encompasses four mobility projects, all addressing frictionless, automated and sustainable answers for tomorrow’s transportation. The one-year sponsorship grants almost €100k in financial support and importantly enables the teams to benefit from Panasonic Industry’s components and know-how. Both vital factors to the education of … Read More → "Panasonic Industry announces sponsorship and collaboration on future transportation programmes with Eindhoven University of Technology and Technical University of Munich"
